KR20100054426A - Multi-layers packaging substrate comprising a rigid-pin and method of manufacturing the same - Google Patents

Abstract

PURPOSE: A multi-layers packaging substrate comprising a rigid-pin and a method of manufacturing the same are provided to improve the transfer characteristic of electrical signal between layers by communicating a multiple package substrate with a rigid pin formed on the first package substrate. CONSTITUTION: In a multi-layers packaging substrate comprising a rigid-pin and a method of manufacturing the same, a first package substrate has a rigid pin(300) protruded to the outside. A second package substrate(500) has a penetration hole(510) corresponding to a rigid pin. The conductive filler is selectively charged into the penetration hole. The rigid pin is expanded through a penetration hole and is protruded to the second package substrate to form a connection terminal.

Description

Multi-layer package substrate having rigid pins and a method for manufacturing the same {MULTI-LAYERS PACKAGING SUBSTRATE COMPRISING A RIGID-PIN AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a multilayer package substrate having rigid pins, and more particularly to a multilayer package substrate having rigid pins for electrically connecting the package package and the main board and electrically connecting the package package and the main board. It is about a method.

Recently, in order to meet the demand for higher functionality and miniaturization of electronic devices, a plurality of semiconductor chips are required to be mounted in a limited space. Accordingly, a method of stacking dies or chips vertically with each other has been proposed as a method of reducing the size of multi-chip modules and increasing the effective density. Typical examples of this approach are package-on-package (PoP) or package-in-package (PiP). These can save the space on the package substrate which mounts a semiconductor chip. Such packages may, for example, have an area of approximately 15 mm ² and a height of approximately 2 mm.

1 is a cross-sectional view of a multilayer package substrate according to the prior art. In the conventional package-on-package substrate, the package substrates 1, 2 and 3 to which the respective semiconductor chips 1a, 2a and 3a are solder ball connected and the package substrates to the solder balls 1b, 2b and 3b are connected to each other. It forms a package substrate. The package substrate disposed on the lowermost layer of these package substrates is mounted on the package substrate by BGA bonding to the main board with solder balls.

This method uses the BGA technology and flip chip technology, which have gained much research on the bonding between packages using solder, to ensure the stable bonding such as self-alignment between packages.

However, this method inevitably undergoes many reflow processes in order to solder ball connect the chip and the substrate and solder ball connect the substrate and the substrate. Since the reflow process is a high temperature process, many reflow processes have a problem of causing warping of the substrate, and also a problem of deterioration of the joint reliability due to noise caused by voids in the solder ball and uneven solder ball size.

The present invention was created to solve the problems of the prior art as described above, the electrical connection reliability of the package substrate and the package substrate, the package substrate and the main board is improved, and the reflow process is minimized to prevent warpage of the substrate. A structure of a multi-layer package substrate and a manufacturing method thereof are proposed.

Multi-layer package substrate having a rigid pin according to the present invention, the first package substrate having a rigid pin protruding outward; A second package substrate having a through hole at a position corresponding to the rigid pin; And a conductive filler selectively filled in the through hole, wherein the rigid pin extends through the through hole and protrudes out of the second package substrate to form a connection terminal.

As a preferable feature of the present invention, the rigid pin includes a rigid pin head formed on the upper end of the rigid pin, the rigid pin head is bonded to the surface of the first package substrate.

In another preferred aspect of the present invention, the second package substrate includes vias and circuit patterns electrically connected to the rigid pins through the conductive filler.

As another preferable feature of the present invention, the conductive filler is a solder paste.

In another preferred aspect of the present invention, the method further includes an insulating material interposed between the first package substrate and the second package substrate, wherein the insulating material has a through hole at a position corresponding to the rigid pin.

According to still another preferred feature of the present invention, the method may further include a third package substrate inserted between the first package substrate and the second package substrate and having a through hole at a position corresponding to the rigid pin.

Method for manufacturing a multi-layer package substrate having a rigid pin according to the present invention, (A) forming a rigid pin protruding to the outside on the first package substrate having an electronic component mounting surface; (B) providing a second package substrate having a through hole at a position corresponding to the rigid pin, and selectively filling a conductive filler in the through hole; And (C) coupling the first package substrate and the second package substrate such that the rigid pins extend through the through holes of the second package substrate to protrude out of the second package substrate. It is done.

As a preferable feature of the present invention, after the step (C), and further comprising the step of performing a reflow process to cure the conductive filler.

In another preferred embodiment of the present invention, before the step (C), the insulating material having a through hole at a position corresponding to the rigid pin, and the rigid package to pass through the through hole of the insulating material It further comprises the step of combining the insulating material with the.

In another preferred embodiment of the present invention, before the step (C), a third package substrate having a through hole at a position corresponding to the rigid pin is provided, and selectively conductive within the through hole of the third package substrate. And after filling the filler, coupling the first package substrate and the third package substrate such that the rigid pins pass through the through holes of the third package substrate.

As another preferable feature of the present invention, the conductive filler is a solder paste.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

In the multilayer package substrate having rigid pins according to the present invention, since the multilayer package substrate is electrically interlayer-conducted by the rigid pins formed on the first package group substrate, the transmission of the interlayer electrical signal is good.

In addition, in the multilayer package substrate having a rigid pin according to the present invention, since the rigid pin protruding below the second package substrate serves as a connection terminal, not only the coupling with the main board is easy but also the electrical connection between the main board and the package substrate This has the advantage of being good.

Hereinafter, a preferred embodiment of a multilayer package substrate having rigid pins according to the present invention will be described in detail with reference to the accompanying drawings. Throughout the accompanying drawings, the same or corresponding components are referred to by the same reference numerals, and redundant descriptions are omitted. In this specification, terms such as top and bottom are used to distinguish one component from another component, and a component is not limited by the terms.

2 is a schematic diagram of a multilayer package substrate having rigid pins according to a preferred embodiment of the present invention. As shown in the drawing, in the multilayer package substrate according to the present exemplary embodiment, the through-hole 510 is positioned at a position corresponding to the first package substrate 100 and the rigid pin 300 protruding to the outside. The second package substrate 500 and a conductive filler 530 selectively filled in the through-hole 510 has a configuration.

The first package substrate 100 is a printed circuit board for mounting an electronic component such as an IC chip on a main board, and is generally composed of an insulating layer interposed between a circuit layer and a circuit layer for transmitting an electrical signal. Has an electronic component mounting surface on which an electronic component can be mounted. Since the printed circuit board having the above-described configuration is carried out by a known technique, the manufacturing method of the package substrate is not described in detail here.

The first package substrate 100 used in the present embodiment is disposed on the top of the multi-layer package substrate and includes a rigid pin 300 protruding to the outside of the first package substrate 100. The rigid pin 300 is made of a metal material having good electrical conductivity and low warpage. For example, the rigid pin 300 may be made of copper, gold, silver, nickel, or an alloy thereof.

Preferably, the rigid pin 300 includes a disc shaped rigid pin head 310 formed at an upper end thereof, and the rigid pin head 310 adheres to the surface of the first package substrate 100. The rigid pin 300 head 310 may be selectively connected to an external connection terminal (not shown) of the first package substrate to extract an electrical signal of the first package substrate 100. That is, not all of the rigid pins 300 and the head 310 are connected to the external connection terminals of the first package substrate 100, and the rigid pins 300 may be connected to the external connection terminals of the first package substrate 100. 300) Head 310 may be attached. As will be described in detail below, in this case, the rigid pin 300 is used to transmit the electrical signal of the first package substrate 100 to the main board, or to deform the multilayer package substrate to the main board (not shown). It acts as a connector.

Similar to the first package substrate 100, the second package substrate 500 may be a printed circuit board having an electronic component mounting surface, or may be a printed circuit board having only a wiring layer on which the electronic component mounting surface is not formed. Can be. 2 illustrates a second package substrate 500 on which the electronic component mounting surface is not formed, and FIG. 3 illustrates a second package substrate 500 on which the electronic component is mounted on the electronic component mounting surface. .

In this case, the second package substrate 500 may have a through hole 510 at a position corresponding to the rigid pin 300 formed on the first package substrate 100 to pin-couple with the first package substrate 100. . Vias 550 are selectively formed on the inner walls of the through holes 510, the vias 550 are filled with conductive fillers 530, and the conductive fillers 530 are vias 550. Is electrically connected). That is, not all the through holes 510 formed in the second package substrate 500 are electrically connected to the rigid pins 300, but the second package substrate 500 is formed as shown in FIG. 4A. Through-holes 510 including vias and fillers to electrically transfer to the rigid pins 300, and through-holes 510 not electrically connected to the rigid pins 300, as shown in FIG. 4B. It may include. In addition, the circuit layer formed on the second package substrate 500 may include a circuit pattern 570 (refer to FIG. 4A) to be electrically connected to the via 550 to be electrically connected to the via 550 and the rigid pin 300. Can be. The conductive filler 530 may be, for example, a solder paste containing conductive metal powder.

Meanwhile, the rigid pin 300 extends through the through hole 510 formed in the second package substrate 500 and protrudes out of the second package substrate 500 to form a connection terminal. In this way, the end of the rigid pin 300 protruding to the outside of the second package substrate 500 is inserted into the terminal portion formed on the main board (multi-layer package) similar to the general pin-grid array (PGA) substrate The board can be easily mounted on the main board. That is, the rigid pin 300 used in this embodiment not only serves to electrically conduct the interlayers of the multilayer package substrate but also serves as a connection terminal for mounting the multilayer package substrate on the main board.

Here, an insulating material 700 having a through hole may be interposed between the first package substrate 100 and the second package substrate 500 at a position corresponding to the rigid pin 300. The insulating material 700 may not only electrically insulate the first package substrate 100 and the second package substrate 500, but also provide rigidity to the multilayer package substrate to prevent bending. The insulating material 700 may be made of, for example, a prepreg containing an epoxy resin.

In the multi-layer package substrate having rigid pins according to the present exemplary embodiment, since the multi-layer package substrate is electrically interlayer-conducted by the rigid pins 300 formed on the first package substrate 100, the transmission of the interlayer electrical signals is good. FIG. 5A is an enlarged view of a solder ball 1b junction of a ball grid array (BGA) substrate 1 according to the related art shown in FIG. 1, and FIG. 5B is a multilayer package substrate having rigid pins shown in FIG. 2. The enlarged view of the via 550 coupled to the rigid pin 300 of the second package substrate 500. As shown in this, when interlayer bonding is performed with the solder balls 1b bonded to the connection terminal 1c of the ball grid array (BGA) substrate 1, problems such as poor connection due to voids generated in the solder balls 1b are caused. Although it may occur, when the rigid pin 300 is used, there is no void generation and electrical connection may be well made.

In addition, in the multilayer package substrate having rigid pins according to the present embodiment, since the rigid pin 300 protruding below the second package substrate 500 serves as a connection terminal, not only the coupling with the main board is easy but also the electrical There is an advantage that the connection is good.

Hereinafter, a method of manufacturing a multilayer package substrate having rigid pins according to a preferred embodiment will be briefly described with reference to FIG. 2.

First, the rigid pin 300 protruding to the outside is formed on the first package substrate 100 having the electronic component mounting surface. Since the manufacturing of the printed circuit board for mounting the electronic component and the mounting of the electronic component are performed by known techniques, detailed description thereof will be omitted. When the first package substrate 100 is provided, the rigid pin 300 is attached to the bottom surface of the first package substrate 100. For example, the solder pin is applied to the connection pad portion of the first package substrate 100, the head 310 of the rigid pin 300 is bonded to the solder paste, and then the rigid pin is performed in a reflow process. The 300 may be attached to the first package substrate 100.

Thereafter, the second package substrate 500 having the through hole 510 is provided at a position corresponding to the rigid pin 300, and the conductive filler 530 is selectively filled in the through hole 510.

Next, a third package substrate 900 having a through hole 910 is provided at a position corresponding to the rigid pin 300, and a conductive filler is selectively provided inside the through hole 910 of the third package substrate 900. After charging, the rigid package 300 couples the first package substrate 100 and the third package substrate 900 to pass through the through hole 910 of the third package substrate 900.

Next, the first and second package substrates 100 and 200 may extend through the through holes 510 of the second package substrate 500 to protrude out of the second package substrate 500. 500).

Next, a multilayer package substrate having rigid pins may be manufactured by curing the conductive filler 530 selectively filled in the through holes 510 and 910 formed in the third package substrate and the second package substrate by performing a reflow process. have.

In this case, the process of inserting the insulating material 700 between the package substrate and the package substrate to be coupled up and down in the above-described process may be further performed. That is, the insulating material 700 having a through hole at a position corresponding to the rigid pin 300 is provided, and the rigid pin 300 is formed before the bonding process of the third package substrate 900 or the bonding process of the second package substrate 500. The method may further include coupling the first package substrate 100 and the insulating material 700 to pass through the through hole of the insulating material 700. In addition, in the present embodiment, the configuration of one additional third package substrate 900 is illustrated, but the present invention is not limited thereto, and it is also possible to combine two or more additional package substrates according to the design of the multilayer package substrate. You can easily understand the point.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a cross-sectional view of a multilayer package substrate according to the prior art.

2 is a cross-sectional view of a multi-layer package substrate with rigid pins in accordance with a preferred embodiment of the present invention.

3 is a cross-sectional view of a multi-layer package substrate with rigid pins in accordance with another preferred embodiment of the present invention.

4 is a partially enlarged perspective view of a rigid pin coupled to a through hole filled with a filler of the second package substrate illustrated in FIG. 2.

FIG. 5 is a partially enlarged perspective view of a rigid pin coupled with a filler-free through hole of the second package substrate shown in FIG. 2.

FIG. 5A is an enlarged cross-sectional view illustrating the solder ball joint of the multilayer package substrate according to the related art shown in FIG. 1.

FIG. 5B is an enlarged cross-sectional view illustrating a rigid pin junction of a second package substrate of the multilayer packager substrate having rigid pins shown in FIG. 2.

<Description of Major Symbols in Drawing>

100 first package substrate 300 rigid pin

310 rigid pin head 500 second package substrate

510, 910 Through Hole 530 Filling

550 Via 570 Circuit Pattern

700 Insulation Material 900 Third Package Substrate

Claims (11)

A first package substrate having a rigid pin projecting outward; A second package substrate having a through hole at a position corresponding to the rigid pin; And A conductive filler selectively filled in the through hole; Including, The rigid pin extends through the through-hole and protrudes out of the second package substrate to form a connection terminal. The method of claim 1, The rigid pin includes a rigid pin head formed on the upper end of the rigid pin, the rigid pin head is a multilayer package substrate having a rigid pin, characterized in that bonded to the surface of the first package substrate. The method of claim 1, And the second package substrate includes vias and circuit patterns electrically connected to the rigid pins through the conductive filler. The method of claim 1, And the conductive filler is a solder paste. The method of claim 1, The multilayer package substrate having a rigid pin further comprises an insulating material interposed between the first package substrate and the second package substrate, wherein the insulating material has a through hole at a position corresponding to the rigid pin. The method of claim 1, And a third package substrate inserted between the first package substrate and the second package substrate and having a through hole at a position corresponding to the rigid pin. (A) forming a rigid pin projecting outwardly on the first package substrate having the electronic component mounting surface; (B) providing a second package substrate having a through hole at a position corresponding to the rigid pin, and selectively filling a conductive filler in the through hole; And (C) coupling the first package substrate and the second package substrate such that the rigid pins extend through the through holes of the second package substrate to protrude out of the second package substrate; Method of manufacturing a multi-layer package substrate having a rigid pin comprising a. The method of claim 7, wherein After the step (C), The method of manufacturing a multi-layer package substrate having a rigid fin further comprising the step of performing a reflow process to cure the conductive filler. The method of claim 7, wherein Before step (C), Providing an insulating material having a through hole at a position corresponding to the rigid pin, and coupling the first package substrate and the insulating material to allow the rigid pin to pass through the through hole of the insulating material. Method of manufacturing a package substrate. The method of claim 7, wherein Before step (C), After providing a third package substrate having a through hole at a position corresponding to the rigid pin, and selectively filling the conductive filler in the through hole of the third package substrate, the rigid pin is penetrated through the third package substrate And coupling the first package substrate and the third package substrate to pass through holes. The method of claim 7, wherein The conductive filler is a solder paste, the method for producing a multi-layer package substrate having a rigid pin.

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