KR20090067762A - Camera module with reflow process - Google Patents

Abstract

The present invention relates to a camera module applicable to the reflow process.

Camera module applicable to the reflow process of the present invention, the upper, lower opening the housing; A lens barrel coupled to an upper portion of the housing and having a plurality of lenses laminated therein; A substrate mounted on an image sensor at a central portion thereof and tightly coupled to a lower opening of the housing; And a circular cap-shaped protective cap to be covered on the upper portion of the lens barrel, and includes an advantage of preventing thermal deformation of the plastic lens mounted in the camera module and maximizing productivity. By using the plastic lens of the camera module there is an advantage that can reduce the manufacturing cost.

Description

Camera module that can be applied to reflow process {Camera module}

The present invention relates to a camera module applicable to a reflow process, and more particularly, a lens in a camera module when bonding a camera module component member or a surface mounter (SMT: Surface Mounter Technology) using a reflow process for soldering bonding. A protective cap is mounted on the outside to prevent deformation at high temperatures, allowing the mass production of camera modules through a reflow process, thereby improving productivity and reducing manufacturing costs. It is about a module.

Currently, camera modules are installed in the production of automobiles and endoscopes, including mobile communication terminals, IT devices such as PDAs and MP3 players, and these camera modules have been upgraded from 300,000 pixels (VGA level) to millions of pixels according to the development of technology. At the same time, the development of high-resolution (MEGA-class) has been focused on miniaturization and thinning according to the mounting target, and various additional functions such as auto focusing (AF) and optical zoom (OPTICAL ZOOM) can be implemented at low cost. It is becoming.

In addition, the current camera module is equipped with an image sensor module mainly manufactured by wire bonding method (COB; chip of board), flip chip method (COF; chip of flexible), and chip scale package method (CSP). It is mainly manufactured in the form of being connected to the main board through electrical connection means such as a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

This type of camera module should be connected to the connector extending from the board on the main board of the mobile communication terminal, and this must be done by manual labor of the worker, the work process becomes complicated, the problem that productivity is pointed out have.

However, recently, camera modules that are directly surface mounted on the main board in the terminal have been developed by minimizing the camera module mounting area and simplifying and automating the manufacturing process due to the slimming of the mobile communication terminal.

In order to surface mount the camera module on the main board, a silicon module is mainly manufactured as a camera module, and a silicon board is attached to the lower part of the camera module so that it can be directly mounted on the main board like general IC chips and passive devices. This can simplify the manufacturing process and reduce the manufacturing cost.

However, the surface mountable camera module is mainly soldered to the joint surface and mounted on the main board through a reflow process in order to mount the camera module directly on the main board. Since the lens is heated, the lens laminated in the camera module is inevitably affected by temperature.

1 is an assembled perspective view of a conventional camera module applicable to a reflow process, Figure 2 is a cross-sectional view of a conventional camera module, as shown, the conventional camera module 10 is a housing 11, the housing 11 The lens 12 is coupled to the upper part of the housing 11 and the lens barrel 14 mounted inside the image sensor 13 mounted on the lower portion of the housing 11.

The lens L may be stacked in the lens barrel 14 in a large number, and is supported to be in close contact with the lens barrel 14 by the press-fit ring 15.

The substrate 12 is mainly composed of a ceramic substrate capable of soldering bonding.

The lens L mounted on the lens barrel 14 may be a glass lens, a plastic lens, a lens made of a photocurable resin, or the like. However, since the glass lens and the lens made of the photocurable resin have excellent optical characteristics such as shape change and birefringence according to temperature change, and are expensive and heavy, they are relatively manufactured by injection molding to lower the manufacturing cost of the camera module. The camera module is mainly manufactured using an aspherical plastic lens which is easy, inexpensive compared to other lenses, and has relatively little aberration.

The lens made of the glass lens and the photocurable resin has no problem in performing the reflow process after being embedded in the camera module because the temperature at which the thermal deformation occurs is around 500 ° C., but the plastic lens of the aspherical surface injection-molded with thermoplastic resin In most cases, thermal deformation occurs at a temperature of 200 ° C. or less, and thus, there is a problem in passing a reflow process after installation of the camera module.

Here, the temperature in the reflow during the reflow process is maintained at an average of 100 ~ 200 ℃, rises up to 260 ℃ as the aspherical plastic lens is mounted on the camera module and then soldering through the reflow soldering process in the camera module Thermal deformation is inevitable in the lens.

Accordingly, the present invention was devised to solve the above-mentioned disadvantages and problems in the conventional camera module, and a protective cap made of a heat-resistant resin on the outside of the camera module during the reflow process for soldering the camera module is covered. It is an object of the invention to provide a camera module that can be applied to the reflow process to prevent the thermal deformation of the lens mounted in the camera module to pass through the reflow.

The object of the present invention, the upper and lower housings, the lens barrel is coupled to the upper portion of the housing, the plurality of lenses are laminated and coupled to the inside, and the image sensor is mounted in the center of the lower opening of the housing It is achieved by providing a camera module capable of applying a reflow process including a substrate to be tightly coupled, and a protective cap of a circular lid shape covered on the lens barrel.

The housing has a female screw portion formed on an inner circumferential surface thereof, and a filter seating portion is extended to a central portion at an arbitrary inner circumferential surface thereof to closely couple an infrared cut filter.

In addition, the lens barrel coupled to the upper portion of the housing is configured in the form of a male screw portion formed on the outer peripheral surface having an entrance hole in the center of the upper surface, one or more lenses are laminated and coupled therein.

At this time, the lens is tightly coupled to the lens barrel by the press-fit ring, the lens barrel is inserted through the upper opening of the housing in the state that the lens is closely coupled, the screw through the screw portion formed on the inner and outer peripheral surfaces of the housing and the lens barrel Combined.

The upper portion of the lens barrel is equipped with a protective cap formed of a circular cover similar to the lens barrel, the lens barrel and the protective cap is preferably screwed through a screw formed on the inner, outer peripheral surface, respectively.

In this case, since the protective cap may be manufactured in a form that is coupled to surround the outer circumferential surface of the lens barrel, the inner circumferential surface of the protective cap and the outer circumferential surface of the lens barrel may be configured to contact each other.

The protective cap is covered on the upper portion of the camera module, the reflow heating temperature to prevent the thermal deformation of the lens mounted in the lens barrel by the protective cap when the camera module equipped with the protective cap passes through the reflow Injection molded into a heat-resistant resin that can withstand.

On the other hand, the present invention is coupled to the upper and lower housing housing, the upper part of the housing, the lens barrel in which a plurality of lenses are laminated and coupled to the inside, and the image sensor is mounted in the center close contact to the lower opening of the housing It can also be achieved by providing a camera module that can be applied to the reflow process including a substrate and a protective cap of a rectangular cover shape in which the lower end is in close contact with the side of the housing.

At this time, the protective cap is made of a heat-resistant resin, similar to the protective cap of the circular cover form described above, and wraps the outside of the camera module except the side of the singer substrate, so that the side of the camera module is exposed in the reflow apparatus Do not

As described above, the camera module which can be applied to the reflow process of the present invention is equipped with a protective cap made of a heat-resistant resin on the outer surface of the lens barrel or the outside of the camera module so that soldering bonding is performed by the reflow process, This product has the advantage of preventing thermal deformation of the plastic lens mounted in the camera module and maximizing productivity, and reducing the manufacturing cost of the camera module by using a low-cost plastic lens during the reflow process. There is this.

In addition, the present invention is manufactured by uniformly the size of the protective cap mounted on the camera module according to the specifications of the camera module and the lens barrel mounted on the camera module, it is possible to recycle when soldering the bonding of the camera module through the reflow process There is an advantage.

Matters relating to the operational effects including the technical configuration of the camera module applicable to the reflow process according to the present invention will be clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

First, Figure 3 is a perspective view of a camera module that can be applied to the reflow process according to the present invention, Figure 4 is a cross-sectional view of the camera module shown in FIG.

As shown, the camera module 100 of the present invention includes a housing 110, a lens barrel 120 coupled to the upper portion of the housing 110, and a substrate closely coupled to the lower portion of the housing 110. 130).

The housing 110 has an upper and a lower opening, and a filter seat 111 protrudes inward. On the top or bottom of the filter seating portion 111, the infrared cut filter 140 is tightly coupled with an adhesive interposed at its edge.

In addition, the housing 110 is coupled to the lens barrel 120 in which the lens L is laminated and coupled therein through an opening in the upper portion. The lens barrel 120 has an incident hole 121 formed at the center of the image surface, and one or more lenses L are laminated and coupled therein so that the light reflected from an external subject through the incident hole 121 is a lens ( Flows into L).

At this time, the light flowing through the lens (L) includes a long wavelength of infrared rays through the infrared cut filter 140 coupled to the inside of the housing 110, the infrared rays of excessive long wavelengths included in the light is blocked It is introduced into the housing 110.

In addition, the housing 110 has a male screw portion 112 formed on an outer circumferential surface thereof, and the lens barrel 120 coupled to an upper portion of the housing 110 has a female screw portion 122 provided on an inner circumferential surface of the lens barrel 120. And the housing 110 are tightly coupled to each other by screwing.

The substrate 130 on which the image sensor 131 is mounted is tightly coupled to the lower end of the housing 110.

The substrate 130 is preferably composed of a ceramic substrate having a plurality of pads 132 formed on all sides. The reason why the substrate 130 is formed of a ceramic substrate is that the housing 110 and the lens barrel 120 are sequentially assembled on the substrate 130, and the substrate 130 is mounted on a main substrate (not shown in the drawings). This is to allow the surface mount (SMT) through the soldering bonding between the pad 132 formed on the side of the substrate 130 and the pattern formed on the upper surface of the main substrate by directly seating on the substrate.

In the camera module 100 configured as described above, the housing 110 is tightly coupled to an upper portion of the substrate 130 on which the image sensor 131 is mounted at the center, and a plurality of lenses L are stacked on the upper portion of the housing 110. By assembling the lens barrel 120 is completed as a single piece assembly.

The camera module 100 assembled as described above is mounted on a predetermined point of the main substrate, and is coated with solder around the substrate 130 at the seating area so as to penetrate the inside of the reflow apparatus by being horizontally transferred through the conveyor. 130) the solder applied around is melted and cured by the temperature in the reflow so that the surface mount (SMT) of the camera module is performed on the main substrate.

In this case, the camera module 100 is mounted on the main substrate with a protective cap 150 having a circular cover shape thereon, and passes through the reflow apparatus in a state where the protective cap 150 is mounted.

The protective cap 150 is preferably formed of a heat resistant resin capable of blocking high temperature heat, that is, high temperature heat of 260 ° C. or more emitted from the inside of the reflow, and a circular cover which may cover the outer circumferential surface of the lens barrel 120. Form.

In addition, the protective cap 150 is to ensure that the upper surface including the entrance hole 121 of the lens barrel 120 is to be covered and to be coupled to be in close contact with the outer circumferential surface of the lens barrel 120, the lens barrel 120 ) And the protective cap 150 to be closely coupled to each other by the surface contact.

Preferably, the male screw portion 123 is formed on the outer circumferential surface of the lens barrel 120, the female screw portion 151 is formed on the inner circumferential surface of the protective cap 150 so that the two members are firmly coupled by screwing. do.

The camera module 100 that has passed through the reflow apparatus with the protective cap 150 mounted thereon is soldered and bonded between the main board and the substrate 130 mounted below without thermal deformation of the lens L mounted therein. When the soldering is completed, the protective cap 150 is removed from the upper portion of the camera module 100, and the removed protective cap 150 is the lens barrel 120 of the other camera module 100 for subsequent soldering bonding. Reseat at).

On the other hand, Figure 5 is another embodiment assembled perspective view of the camera module according to the invention, Figure 6 is a cross-sectional view of another embodiment of the camera module according to the present invention.

As shown, the camera module 200 of the present embodiment has a housing 110 is tightly coupled to the upper portion of the substrate 130 in which the image sensor 131 is mounted in the center, the lens (on the upper portion of the housing 110) By combining the lens barrel 120 having a plurality of L) is combined, the protective cap 210 of the rectangular cover shape is mounted on the outside of the assembled single-unit camera module.

The protective cap 210 is configured to have a lower opening so that the lower end of the protective cap 210 is tightly coupled to the side of the housing 110 to which the lens barrel 120 is coupled.

The protective cap 210 surrounds and mounts the entire exterior of the camera module 200 except for the side surface of the substrate 130 coupled to the lower end of the housing 110, so that the lens L is stacked inside the camera module 200. The thermal deformation of) can be prevented more effectively.

That is, as the protective cap 210 covers the outer surface of the housing 110 including the lens barrel 120 of the camera module 200, divergence in the reflow that may flow through the side of the camera module 200. It can cut off heat efficiently.

The technical configuration of the camera module 200 equipped with the protective cap 210 is the same as the above-described embodiment, and thus the detailed technical description thereof is omitted, and the same reference numerals are assigned to the same members.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

1 is an assembled perspective view of a conventional camera module applicable to a reflow process, Figure 2 is a cross-sectional view of a conventional camera module

3 is a perspective view of a camera module applicable to the reflow process according to the present invention, Figure 4 is a cross-sectional view of the camera module shown in FIG.

5 is an assembled perspective view of another embodiment of a camera module according to the present invention, Figure 6 is a cross-sectional view of another embodiment of the camera module according to the present invention

<Explanation of symbols for the main parts of the drawings>

110. Housing 120. Lens Barrel

130. Substrate 140. Infrared cut filter

150,210. Protective cap L. Lens

Claims (11)

Upper and lower housings; A lens barrel coupled to an upper portion of the housing and having a plurality of lenses laminated therein; A substrate mounted on an image sensor at a central portion thereof and tightly coupled to a lower opening of the housing; A protective cap of a circular cover shape covered with an upper portion of the lens barrel; Camera module that can be applied to the reflow process including a. The method of claim 1, The housing has a filter seating portion extending toward the center portion on the inner circumferential surface, and an infrared cut filter is tightly coupled to the upper or lower surface of the filter seating portion. The method of claim 1, The lens barrel and the protective cap, the camera module can be applied to the reflow process, characterized in that the outer circumferential surface and the inner circumferential surface is in close contact with each other. The method of claim 3, The lens barrel is a male screw portion is formed on the outer circumferential surface, the protective cap is a female screw portion is formed on the inner circumferential surface is a camera module applicable to the reflow process, characterized in that the close coupling is coupled to each other by screwing the male and female threaded portion. The method of claim 1, The substrate is a camera module applicable to the reflow process, characterized in that the ceramic substrate with a pad formed on each side. The method of claim 1, The protective cap is a camera module that can be applied to the reflow process, characterized in that it is injection-molded with a heat-resistant resin that withstands the heating temperature in the reflow, and excellent heat blocking efficiency. Upper and lower housings; A lens barrel coupled to an upper portion of the housing and having a plurality of lenses laminated therein; A substrate mounted on an image sensor at a central portion thereof and tightly coupled to a lower opening of the housing; A protective cap having a rectangular cover shape surrounding the outer surface of the housing including the lens barrel; Camera module that can be applied to the reflow process including a. The method of claim 7, wherein The protective cap, the camera module is applicable to the reflow process, characterized in that the lower end is in close contact with the bottom side of the housing in close contact. The method of claim 7, wherein The housing has a filter seating portion extending toward the center portion on the inner circumferential surface, and an infrared cut filter is tightly coupled to the upper or lower surface of the filter seating portion. The method of claim 7, wherein The substrate is a camera module applicable to the reflow process, characterized in that the ceramic substrate with a pad formed on each side. The method of claim 8, The protective cap is a camera module that can be applied to the reflow process, characterized in that it is injection-molded with a heat-resistant resin that withstands the heating temperature in the reflow, and excellent heat blocking efficiency.

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