KR20080070448A - Dry Film Resist and Manufacturing Method Thereof - Google Patents

Abstract

Provided is a dry film resist and a method of manufacturing the same, wherein a release agent film is attached to both sides of the base film to enable application of an organic film in one base film removal process. The dry film resist includes a base film, a first release agent film adhered to the upper surface of the base film, a second release agent film adhered to the lower surface of the base film, and an organic film applied to an upper surface of the first release agent film. do.

Description

Dry film resist and method for manufacturing the same {Dry film resist and method for fabricating the same}

1 is a perspective view of a dry film resist roll according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the dry film resist of FIG. 1 taken along line II-II ′. FIG.

3A to 3C are cross-sectional views of a process of manufacturing the dry film resist of FIG. 1.

4A and 4B are cross-sectional views of a process of attaching the dry film resist of FIG. 1 to a substrate.

<Description of the symbols for the main parts of the drawings>

5: roll 10: dry film resist

20: base film 30: organic film

40: first release agent film 41: first release agent film upper layer

42: first release agent film lower layer 50: second release agent film

51: lower layer of the second release agent film 52: upper layer of the second release agent film

100: substrate

The present invention relates to a dry film resist and a method for manufacturing the same, and more particularly, to a dry film resist and a method for producing the organic film can be applied in one step of removing the base film by attaching a release agent film on both sides of the base film. .

The liquid crystal display device includes two display panels facing each other and a liquid crystal layer interposed between the two display panels. Each display panel adopts a transparent insulating substrate as a supporting substrate. A plurality of thin film patterns are formed on the insulating substrate.

Representative methods for forming such a thin film pattern include a method of laminating constituent materials and patterning them through a photographic process. Specifically, a photoresist is applied on the constituent material layer, exposed and developed using a mask to form a photoresist pattern, and then the constituent material layer is patterned using the photoresist pattern as an etch mask. When the constituent material layer includes a photosensitive agent, the constituent material layer is patterned only by exposure and development without forming a separate photoresist pattern.

Here, when the photoresist or the constituent materials including the photosensitizer are all provided in a liquid phase, they are applied by a method such as spin coating, followed by drying and baking. However, not only the coating equipment is expensive, but the flatness of the constituent material layer applied after the coating may be poor depending on the coating method. Accordingly, in forming a thin film pattern, a dry film resist in the form of a film is used.

Such a dry film resist is to apply an organic film to the base film and to attach a cover layer thereon, and both the cover layer and the base film layer should be peeled off during the resist process. Therefore, not only the process itself is complicated but also the organic film is separated when the base film is peeled off, resulting in a problem of inferior uniformity of the photoresist film.

The technical problem to be achieved by the present invention is to provide a dry film resist capable of applying an organic film in one base film removal step by attaching a release agent film on both sides of the base film.

Another technical problem to be solved by the present invention is to provide a method for producing a dry film resist that can be applied to the release film on both sides of the base film to apply the organic film in one base film removal step.

The technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

Dry film resist according to an embodiment of the present invention for achieving the technical problem is a base film, a first release agent film attached to the base film upper surface, and a second release agent film attached to the base film lower surface and And an organic film applied to an upper surface of the first release agent film.

According to another aspect of the present invention, there is provided a method of manufacturing a dry film resist, comprising: placing a first release agent film or a second release agent film on upper and lower surfaces of a base film, and the base film and the first release film. Compressing and attaching a release agent film or the second release agent film, and applying an organic material on the first release agent film or the second release agent film.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

The spatially relative terms " below ", " beneath ", " lower ", " above ", " upper " It may be used to easily describe the correlation of a device or components with other devices or components. Spatially relative terms are to be understood as including terms in different directions of the device in use or operation in addition to the directions shown in the figures. Like reference numerals refer to like elements throughout.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, referring to FIGS. 1 and 2, a dry film resist according to an embodiment of the present invention will be described in detail. 1 is a perspective view of a dry film resist roll according to an exemplary embodiment of the present invention, and FIG. 2 is a cross-sectional view of the dry film resist of FIG. 1 taken along line II-II ′.

The dry film resist 10 according to an embodiment of the present invention includes a base film 20, first and second release agent films 40 and 50, and an organic film.

The base film 20 serves to support the organic layer 30 and is formed of a flexible material that is easily bent. The base film 20 may be made of any material as long as it can support the organic layer 30, but the dry film resist 10 may be formed of a flexible material to store and manage the dry film resist 10 in a roll form. It is preferable. The base film 20 may be made of polymethyl methacrylate (PMMA), polycarbonate (PC), polyethylene (PolyEthylene; PE), or polyethylene terephthalate (PET).

Meanwhile, the base film 20 may be a PET layer having a thickness of 10 to 30 μm so as to be flexible while supporting the organic film 30, and preferably maintained at about 20 μm.

The first and second release agent films 40 and 50 serve to easily peel the base film 20 from the organic film 30 and are attached to the upper and lower layers of the base film 20, respectively. The first and second release agent films 40 and 50 may be easily separated from the organic film 30 and not easily separated from the base film 20, so that the first and second release agents films 40 and 50 may be separated from the organic film 30. And the second release agent films 40 and 50 are preferably not separated from the base film 20.

Specifically, the first release agent film 40 is attached to an upper layer of the base film 20, and includes a first release agent film upper layer 41 and a first release agent film lower layer 42.

The first release agent film lower layer 42 is positioned directly on the base film 20, and serves to bond the base film 20 and the first release agent film upper layer 41. The first release agent film lower layer 42 prevents the first release agent film upper layer 41 from being separated from the base film 20 when the base film 20 is peeled off from the organic film 30.

The first release agent film upper layer 41 is attached directly to the upper layer of the first release agent film lower layer 42, and serves to easily peel the organic layer 30 from the base film 20. As such, when the first release agent film 40 is separated into the first release agent film upper layer 41 and the first release agent film lower layer 42 to be formed in two layers, separation with the organic layer 30 may be improved. And adhesion with the base film 20 can be improved together. However, forming the first release agent film 40 into a plurality of layers is only one embodiment of the present invention. Therefore, the organic film 30 may be easily separated and the base film 20 may be formed of a single layer of a material having good adhesion.

The organic layer 30 is coated and formed on the upper layer 41 of the first release agent film, and may be applied as an etching mask, a spacer of the liquid crystal panel, or an insulating layer as necessary. That is, when the organic film 30 is applied as a spacer of the liquid crystal panel, the organic film 30 may include an organic material having elasticity. When the organic film 30 is applied as an organic insulating film, an organic material for the organic insulating film may be used. The organic layer 30 may include a photosensitive agent together with an organic material. Such a photosensitive agent may use a PAG (Photo Acid Generator) that generates hydrogen ions and transforms the structure of the organic material in the exposure area into a structure that can be dissolved in a shape liquid according to irradiation of light such as ultraviolet rays.

In addition, the organic layer 30 may further include other additives depending on the structure or process applied. For example, when the organic layer 30 is applied as a black matrix, the organic layer 30 may further include carbon black having a black color. When the organic layer 30 is patterned as a negative type, the organic layer 30 may further include a crosslinker.

On the other hand, when the organic film 30 is used as an overcoat film of the liquid crystal panel, since no patterning is required, the organic film 30 may not include a photosensitive agent. Such an organic film 30 may be composed of a plurality of layers having the above-described function.

In addition, the second release agent film 50 is attached to the lower layer of the base film 20 and includes a second release agent film upper layer 52 and a second release agent film lower layer 51.

The second release agent film upper layer 52 is attached to the lower surface of the base film 20, and the base film 20 and the second release agent film lower layer 51 are bonded together like the first release agent film lower layer 42 described above. do.

The second release agent film lower layer 51 is attached to the lower surface of the second release agent film upper layer 52 and serves to be easily separated from the organic film 30 like the first release agent film upper layer 41 described above. And, it is formed of the same material as the first release film 40.

Referring to FIG. 1, the dry film resist 10 is wound in a roll and stored and managed. That is, since the dry film resist 10 is wound on a roll, the organic film 30 is not only in contact with the first release agent film upper layer 41 but also with the second release agent film lower layer 51 of the already wound dry film resist 10. do. Therefore, the lower layer 51 of the second release agent film is positioned on the upper layer of the organic layer 30, and the upper layer 41 of the first release agent film is positioned on the lower layer, thereby protecting the organic layer 30.

Hereinafter, a method of manufacturing a dry film resist will be described in detail with reference to FIGS. 3A to 3C. 3A to 3C are cross-sectional views of a process of manufacturing the dry film resist of FIG. 1.

Referring to FIG. 3A, first, the base film 20 is prepared. The base film 20 may be continuously supplied by a roll, and the thickness of the base film 20 may be maintained at about 10 to 30 μm to sufficiently support the organic film 30 while maintaining flexibility. Do.

Next, the first and second release agent films 40 and 50 are attached to the upper and lower surfaces of the base film 20. That is, the first release agent film 40 moves to the upper surface of the base film 20 so that the first release agent film lower layer 42 contacts the base film 20, and the second release agent film 50 is the second release agent film. The upper layer 52 is moved to the lower surface of the base film 20 so as to contact the lower surface of the base film 20. Subsequently, the first and second release agent films 40 and 50 and the base film 20 disposed therebetween are pressed and attached to each other by passing between two pressing rollers (not shown).

Such a pressing process may include a heating process. That is, the pressing roller (not shown) may include a heating means such as a heater, so as to be heated to a predetermined temperature or more in the pressing process. The compression temperature may be set to a temperature at which the base film 20, the first release film lower layer 42, and the second release film upper layer 52 are at least partially dissolved or activated to facilitate mutual compression.

Meanwhile, as described above, the first and second release agent films 40 and 50 may be supplied by attaching each of the upper and lower layers in a film form, and the upper and lower layers may be separately attached in a separate process. That is, the first release agent film lower layer 42 and the second release agent film upper layer 52 together with the base film 20 are supplied together and compressed by a pressing roller, and then the first release agent film upper layer 41 and the second The release agent film lower layer 51 may be supplied and bonded by the pressing roller.

Next, referring to FIG. 3C, the organic layer 30 is coated on the first release film upper layer 41. The organic layer 30 may apply a liquid organic composition including an organic material, a photosensitive agent, and a solvent to the upper surface of the first release agent film upper layer 41 using spin coating or slit coating. Next, the organic composition is dried to complete the dry film resist 10.

On the other hand, as a method for drying the organic composition, a heat treatment chamber such as an oven may be used, and at this time, the heat treatment step is sufficient to the temperature that the solvent can be removed.

In addition, in order to dry the organic composition, a hot plate or an infrared lamp may be used instead of the heat treatment chamber. In this manner, the base film 20 to which the first and second release agent films 40 and 50 are attached is continuously supplied. It is preferred to carry out a process in which the organic composition is continuously coated thereon.

Hereinafter, a process of attaching the dry film resist to the substrate will be described in detail with reference to FIGS. 4A and 4B. 4A and 4B are cross-sectional views of a process of attaching the dry film resist of FIG. 1 to a substrate.

First, referring to FIG. 4A, the substrate 100 and the dry film resist 10 are positioned so that the organic film 30 of the substrate 100 and the dry film resist 10 face each other. Subsequently, the substrate 100 and the dry film resist 10 are passed between the pressing rollers 200 and 300. As a result, the dry film resist 10 is compressed and laminated on the substrate 100.

Next, referring to FIG. 4B, the base film 20 stacked on the organic layer 30 on the substrate 100 and the first and second release agent films 40 and 50 attached thereto are removed. As a result, the organic film 30 is coated on the substrate 100.

As such, the process of compressing the dry film resist 10 and the substrate 100 and the process of removing the base film 20 to which the first and second release agent films 40 and 50 are attached are performed using a roller or the like. This can be done in a continuous process.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. I can understand that. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

As described above, the dry film resist and the manufacturing method thereof according to the embodiments of the present invention have the following effects.

First, the base film with the release agent film attached to the upper and lower surfaces is removed in only one step, thereby simplifying the organic film coating process on the substrate.

Second, by using a release film on both sides of the organic film in contact with each other to prevent damage to the organic film and to remove the base film.

Claims (9)

Base film; A first release agent film attached to the upper surface of the base film; A second release agent film attached to the bottom surface of the base film; And Dry film resist comprising an organic film applied to the upper surface of the first release agent film. The method of claim 1, The first release agent film is a dry film resist comprising a first release agent film upper layer and a second release agent film lower layer. The method of claim 1, The second release film is a dry film resist consisting of a second release agent film upper layer and a second release agent film lower layer. The method of claim 1, The organic film is a dry film resist formed of a plurality of layers. The method of claim 1, The organic film is a dry film resist containing a photosensitive agent. Placing a first release agent film or a second release agent film on the upper and lower surfaces of the base film; Pressing and attaching the base film and the first release agent film or the second release agent film; And Method of producing a dry film resist comprising the step of applying an organic material on the first release agent film or the second release agent film. The method of claim 6, The first release agent film is a manufacturing method of a dry film resist is formed of the first release agent film upper layer and the first release agent film lower layer. The method of claim 6, The second release agent film is a method of manufacturing a dry film resist is formed of the second release agent film upper layer and the second release agent film lower layer. The method of claim 6, And pressing and attaching the base film and the first release agent film or the second release agent film by a pressing roller.

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