KR20070080895A - Semiconductor chip package deposit apparatus and method using fluorinated ketone - Google Patents

Abstract

An apparatus for storing a semiconductor chip package using fluorinated ketone is provided to vaporize residual fluorinated ketone liquid by making a semiconductor chip package soak into fluorinated ketone liquid while the semiconductor chip package is stagnated between fabricating processes and by performing a bake process. A fluorinated ketone room(20) includes a loading part(10) and at least one solution bath. A semiconductor chip package is loaded into the loading part. Fluorinated ketone liquid into which the semiconductor chip package inserted into the loading part is soaked is put into the at least one solution bath. An oven(30) vaporizes the fluorinated ketone liquid remaining on the semiconductor chip package taken out from the fluorinated ketone room. A transfer unit(40) transfers the semiconductor chip package from the loading part to the fluorinated ketone room and from the fluorinated ketone room to the oven. The loading part, the fluorinated ketone room and the oven are interconnected and intercepted by a mask window. An oven for baking the semiconductor chip package can be installed in the loading part.

Description

Semiconductor chip package storage device and storage method using fluorinated ketone {SEMICONDUCTOR CHIP PACKAGE DEPOSIT APPARATUS AND METHOD USING FLUORINATED KETONE}

1 is a cross-sectional view showing a state in which a failure occurs during the manufacturing process of a general semiconductor chip package.

Figure 2 is a block diagram schematically showing a semiconductor chip package storage device according to the present invention.

Figure 3 is a flow chart illustrating a semiconductor chip package storage method according to the present invention.

* Description of the main parts of the drawings *

100; Semiconductor chip package storage device.

10; Loading section

20; Fluorinated ketone room

30; Oven

40; Picker

50a, 50b; Vacuum suction device

201; Semiconductor chip

202; Circuit board

205; Semiconductor chip package

The present invention relates to a semiconductor chip package manufacturing apparatus and a manufacturing method, and more particularly, a semiconductor chip package storage device that can prevent the moisture absorption of the semiconductor chip package when the semiconductor chip package is stagnant in the manufacturing process of the semiconductor chip package. And storage method.

The semiconductor chip package discharged after the pretreatment process in the manufacturing process of the semiconductor chip package may not be immediately introduced into the post-treatment process for the reasons of the process, and may be stagnant between processes. As such, when the semiconductor chip package is stagnant between processes, the semiconductor chip package absorbs moisture in the air.

1 is a cross-sectional view illustrating a state in which a defect occurs during a manufacturing process of a general semiconductor chip package.

In the manufacturing process of a general semiconductor chip package, the semiconductor chip package 205 may be stagnant between processes. The semiconductor chip package 205 is a state in which a warpage is generated to some extent as it is heated in a pretreatment process. Or a state in which warpage may occur. However, the semiconductor chip package 205 absorbs moisture in the air during stagnation, so that the degree of warpage may increase or the warpage may increase as shown in FIG. 1. When the adhesive, the resin encapsulation 201, and the wiring board 202 containing the polymer material absorb moisture, the moisture acts as a plasticizer, and their expansion coefficient depends on the amount of moisture absorbed. This is because they change physical properties such as modulus and strength. The warpage of the semiconductor chip package 205 due to the change in physical properties causes poor appearance and poor coplanarity.

In the case of a semiconductor chip package that absorbs moisture, the moisture absorbed by the semiconductor chip package due to high temperature is converted into water vapor inside the package when a solder ball attach process or a board mounting process is performed in a reflow facility. Will change. As a result, swelling or popcorn cracks occur in the semiconductor chip package.

On the other hand, in order to prevent the above-mentioned problem, when the semiconductor chip package is stagnant in the semiconductor chip package manufacturing process, there is a method to bake and dehumidify the semiconductor chip package at a temperature of about 125 ℃ for a certain time. . However, the semiconductor chip package subjected to high temperature is in a state where physical properties are changed from before the baking, and the bending of the semiconductor chip package may be caused again after baking. And there is a problem that the process time is long because the baking process for a certain time, for example about 4 hours.

Accordingly, an object of the present invention is to provide a semiconductor chip package storage device and a storage method for preventing the absorption of moisture when the semiconductor chip package is stagnant in the manufacturing process of the semiconductor chip package.

In order to achieve the above object, the present invention is a loading unit for loading a semiconductor chip package; A fluorinated ketone room including at least one solution bath containing a fluorinated ketone liquid in which the semiconductor chip package introduced from the loading unit is immersed; An oven to vaporize the fluorinated ketone liquid remaining in the semiconductor chip package discharged from the fluorinated ketone room; Transfer means for transferring the semiconductor chip package from the loading section to the fluorinated ketone room and from the fluorinated ketone room to the oven; And a shielding window connecting and blocking the loading unit, the fluorinated ketone room, and the oven.

In the semiconductor chip package storage device according to the present invention, a vacuum suction device for recovering the fluorinated ketone gas introduced from the fluorinated ketone room to the fluorinated ketone room is provided in the loading unit and the oven, respectively.

In the semiconductor chip package storage device according to the present invention, in the semiconductor chip package manufacturing apparatus, the semiconductor chip package is accommodated in a tray and transferred to a lot unit consisting of a plurality of trays, and the semiconductor chip package of a lot unit is immersed in solution baths, respectively. do.

In the semiconductor chip package storage device according to the present invention, an oven for baking the semiconductor chip package may be installed in the loading portion.

The semiconductor chip package storage method according to the present invention comprises the following steps: loading a semiconductor chip package; Immersing the semiconductor chip package in a fluorinated ketone liquid; And removing the semiconductor chip package from the fluorinated ketone liquid to vaporize the fluorinated ketone liquid remaining in the semiconductor chip package.

In the semiconductor chip package storage method according to the present invention, the step (B) may include baking the semiconductor chip package.

In the method for storing a semiconductor chip package according to the present invention, the step (b) includes storing the semiconductor chip package in a tray and transferring the lot into a lot unit consisting of a plurality of trays, and before immersing the semiconductor chip package in a lot unit in a fluorinated ketone solution. And storing the ID of the lot in a storage means, and before the step iii, the control means designates a position to immerse the semiconductor chip package of the lot unit among a plurality of solution tanks containing a fluorinated ketone solution. In the step S, the semiconductor chip package of the lot unit is selectively taken out according to the lot ID request of the user, and the fluorinated ketone liquid remaining in the semiconductor chip package is vaporized.

In the semiconductor chip package storage method according to the present invention, the step (f) is performed by applying heat of 49 to 100 ° C. for 1 to 5 minutes to vaporize the fluorinated ketone liquid remaining in the semiconductor chip package.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the accompanying drawings, some of the components are somewhat exaggerated, schematically illustrated or omitted to facilitate a clear understanding of the drawings, and the actual size of each component is not entirely reflected.

Example

Figure 2 is a block diagram schematically showing a semiconductor chip package storage device according to the present invention.

2, the semiconductor chip package storage device 100 according to the present invention includes a loading unit 10, a fluorinated ketone 20, an oven 30, and a transfer means 40. do. The fluorinated ketone room 20 is characterized in that a plurality of solution tanks containing the fluorinated ketone liquid are formed, and the semiconductor chip package is immersed in the solution bath.

The loading unit 10 is loaded with a semiconductor chip package stagnated between processes in the semiconductor chip package manufacturing process. Here, the semiconductor chip package is accommodated in a tray and inserted into the loading unit 10 in a unit of a lot consisting of a plurality of trays. The vacuum suction device 50a is installed in the loading unit 10. The vacuum suction device 50a sucks the fluorinated ketone gas introduced into the loading unit 10 when the shielding window between the loading unit 10 and the fluorinated ketone room 20 is opened, and enters the fluorinated ketone room 20. Recover. In addition, an oven may be installed in the loading unit 10. Among the loaded semiconductor chip packages, there is a package that is vulnerable to moisture penetration during the manufacturing process due to the characteristics of the structure, such as a flip chip package. In the case of such a semiconductor chip package, first, baking is performed to remove moisture absorbed into the semiconductor chip package.

The fluorinated ketone room 20 is installed in connection with the loading unit 10, and a shielding window for blocking the fluorinated ketone room 20 from the outside is installed therebetween. A plurality of solution tanks are formed in the fluorinated ketone room 20. The solution tank contains a fluorinated ketone liquid in which the semiconductor chip package of the lot unit is immersed and stored. Fluorinated ketones are artificially made from the ketone molecules by hydrogen fluorine, which has a molecular formula of CF ₃ CF ₂ (O) CF (CF ₃ ) ₂ . Fluorine has a stable property, so fluorinated ketones do not conduct electricity and do not cause a reaction such as oxidation with a contacted substance. The boiling point of the ketone fluoride is 49 ° C, much lower than that of water, so that it is quickly dried.

The oven 30 is installed in connection with the fluorinated ketone room 20, and between them, a shielding window is provided to block the fluorinated ketone room 20 from the outside. The oven 30 vaporizes the fluorinated ketone liquid remaining in the semiconductor chip package that was immersed in the fluorinated ketone liquid. The oven 30 bakes the semiconductor chip package for a short time, such as 1 to 5 minutes, at a temperature between the boiling point of the fluorinated ketone liquid and the boiling point of water, that is, 49 to 100 ° C. The oven 30 is provided with a vacuum suction device 50b. The vacuum suction device 50b sucks the fluorinated ketone gas introduced into the oven 30 and recovers it to the fluorinated ketone room 20 when the shielding window between the oven 30 and the fluorinated ketone room 20 is opened. .

The transfer means 40 transfers the semiconductor chip package in units of lots while moving from the loading unit 10 to the fluorinated ketone room 20 and from the fluorinated ketone room 20 to the oven 30. The transfer means 40 is a picker for transferring the semiconductor chip package in units of lots in a manner such as vacuum suction.

The semiconductor chip package storage apparatus according to the present exemplary embodiment may be installed in a movement path between facilities of the semiconductor chip package so that the semiconductor chip package stagnated between processes may be stored. In this case, for example, the semiconductor chip package may be installed between a post cure facility and a solder ball attach facility of the semiconductor chip package. In addition, the semiconductor chip package may be installed between the vacuum packaging opening equipment and the reflow equipment in the mounting process of the semiconductor chip package, and may be installed between the baking equipment and the underfill equipment that are added after removing the flux from the flip chip package. .

In the semiconductor chip package storage device according to the present embodiment, when the semiconductor chip package is stagnant during the semiconductor chip package manufacturing process, the semiconductor chip package is immersed in the fluorinated ketone liquid, and the fluorinated ketone liquid remaining in the package is vaporized. Bake as much as possible. The fluorinated ketone liquid is in a stable state and is blocked from the outside to prevent moisture absorption of the semiconductor chip package, thereby preventing moisture absorption of the package during stagnation between processes. The storage method of the semiconductor chip package according to the present embodiment will be described below.

3 is a flowchart illustrating a method of storing a semiconductor chip package according to the present invention.

Referring to FIG. 3, first, a semiconductor chip package is put into a loading unit (61). The semiconductor chip package is a package that is stagnant between processes and is stored in a tray and put into a loading unit in a lot unit consisting of a plurality of trays. Here, a lot ID is stored in the storage means. In order to remove moisture of a package vulnerable to moisture penetration, such as a flip chip package, baking may be performed on the semiconductor chip package introduced into the loading unit.

Next, the shielding window between the loading section and the fluorinated ketone room is opened, the semiconductor chip package is introduced into the fluorinated ketone room by the transfer means, and the semiconductor chip package is immersed in the fluorinated ketone liquid (62). When the semiconductor chip package in units of lots is transferred to the fluorinated ketone room, the control means designates a position at which the semiconductor chip package is to be immersed among a plurality of solution tanks containing the fluorinated ketone liquid. The control means immerses a semiconductor chip package in units of lots at a designated position.

Thereafter, the shielding window is closed to block the fluorinated ketone room from the outside, and the fluorinated ketone gas introduced into the loading unit is sucked into the vacuum suction device and recovered to the fluorinated ketone room (63).

Next, the semiconductor chip package is taken out of the fluorinated ketone liquid and put into the oven according to the lot ID request of the user (64). In the semiconductor chip package put into the oven, the remaining fluorinated ketone liquid is vaporized by 49 to 100 ° C. heat applied for 1 to 5 minutes.

Then, the fluorinated ketone room is shut off from the outside, and the fluorinated ketone gas introduced into the oven is sucked by a vacuum suction device and recovered to the fluorinated ketone room (63), and then the semiconductor chip package is discharged.

On the other hand, the semiconductor chip package storage device according to the present embodiment is installed in the movement path between the facilities of the semiconductor chip package, it is not limited to the progress of the storage method of the semiconductor chip package. The semiconductor chip package, which is stagnant in the manufacturing process of the semiconductor chip package, may be introduced to prevent the semiconductor chip package from absorbing moisture in the air.

According to the semiconductor chip package storage device and storage method according to the present invention as described above, the fluorinated ketone liquid remaining by immersing the semiconductor chip package stagnated during the manufacturing process in the fluorinated ketone liquid during the process stagnation, and then baked Vaporize. Therefore, the fluorinated ketone liquid is in a stable state and is blocked from the outside so as to prevent moisture absorption of the semiconductor chip package, thereby preventing moisture absorption of the semiconductor chip package.

In addition, the semiconductor chip package storage device according to the present invention may be installed between the pretreatment process facility and the posttreatment process facility as well as the semiconductor chip package that is stagnant between processes, thereby preventing moisture absorption of the semiconductor chip package that is moved between processes.

Claims (8)

A loading unit in which a semiconductor chip package is loaded; A fluorinated ketone room including at least one solution tank containing a fluorinated ketone liquid in which the semiconductor chip package introduced from the loading unit is immersed; An oven to vaporize the fluorinated ketone liquid remaining in the semiconductor chip package discharged from the fluorinated ketone room; Transfer means for transferring said semiconductor chip package from said loading portion to said fluorinated ketone room and from said fluorinated ketone room to said oven; And And a shielding window connecting and blocking the loading unit, the fluorinated ketone room, and the oven. According to claim 1, And a vacuum suction device for recovering the fluorinated ketone gas introduced from the fluorinated ketone room to the fluorinated ketone room is installed in the loading unit and the oven, respectively. According to claim 1, The semiconductor chip package manufacturing apparatus is characterized in that the semiconductor chip package is accommodated in a tray and transferred in a lot unit consisting of a plurality of trays, the semiconductor chip package of the lot unit is immersed in the solution bath, respectively. Semiconductor chip package storage device. According to claim 1, The semiconductor chip package storage device, characterized in that the oven for baking the semiconductor chip package (baking) is installed in the loading portion. ⒜loading the semiconductor chip package; Immersing the semiconductor chip package in a fluorinated ketone solution; And (B) removing the semiconductor chip package from the fluorinated ketone liquid, and vaporizing the fluorinated ketone liquid remaining in the semiconductor chip package. The method of claim 5, And the step (b) comprises baking the semiconductor chip package. The method of claim 5, In step ⒜, the semiconductor chip package is stored in a tray and transferred to a lot unit consisting of a plurality of trays, and the ID of the lot is stored before the semiconductor chip package of the lot unit is immersed in the fluorinated ketone liquid. And storing, in a means, a position for immersing the semiconductor chip package of the lot unit in a plurality of solution tanks containing the fluorinated ketone liquid before proceeding to the step iii. In the step (i), the semiconductor chip package storage method may include selectively removing the semiconductor chip package of the lot unit according to a lot ID request of a user, and then vaporizing the fluorinated ketone liquid remaining in the semiconductor chip package. . The method of claim 5, The step (V) is a semiconductor chip package storage method, characterized in that the vaporization of the fluorinated ketone liquid remaining in the semiconductor chip package by applying a heat of 49 ~ 100 ℃ for 1 to 5 minutes.

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