KR19990081141A - Parts cleaning device of semiconductor cleaning equipment - Google Patents

Abstract

The present invention relates to a component washing apparatus for a semiconductor cleaning equipment, wherein a pure water supply line (20) and a pure water discharge line (30) are installed at an inlet and an outlet of a circulation line (13), and the pure water supply line (20). And the open and closed valves 21 and 31 and the check valves 22 and 32 are respectively installed in the pure water discharge line 30 and the open and closed valves 23 and 33 in the circulation line 13 on the opposite side thereof. ) To supply pure water to the pure water supply line 20 when the parts installed on the circulation line 13 are replaced, and the supplied pure water is pure water discharge line together with the chemicals present in the circulation line 13 and the components. By discharging to 30 and replacing the parts, there is an effect that the parts are easier to clean than when the pure water is put into the inner tank and circulated as in the conventional cleaning.

Description

Parts cleaning device of semiconductor cleaning equipment

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component cleaning apparatus for semiconductor cleaning equipment, and more particularly, to a component cleaning apparatus for semiconductor cleaning equipment suitable for making it possible to easily remove chemicals from circulation lines when replacing components.

In general, a cleaning apparatus for wet etching and removing foreign substances of a semiconductor wafer is illustrated in FIG. 1, which is briefly described as follows.

1 is a piping diagram showing the structure of a conventional semiconductor cleaning equipment, as shown in the conventional semiconductor cleaning equipment, the inner tank (INNER BATH) (1) of the upper side is opened so that the chemical can be accommodated, and the inner tank ( It is installed on both outer sides of 1) and the outer bath (2), which overflows from the inner tank (1), can overflow, and the outer tank (2) and the inner tank (1) are connected to the chemical It consists of the circulation line 3 provided so that it can circulate, and the drain line 4 provided below the inner tank 1. As shown in FIG.

And, on the circulation line (3), a pump (5) for pumping the chemical, a damper (DAMPER) (6) for controlling the flowing pulsation of the chemical, a filter (FILTER) (7) for removing particulates in the chemical, A temperature controller (HEATER) 8 is provided for controlling the temperature of the chemical.

The conventional semiconductor cleaning equipment configured as described above loads wafers into the inner tank 1 in a state in which the chemical is stored in the inner tank 1. Then, when pumping with the pump (5), the chemical overflows from the inner tank (1) to the outer tank (2), the overflowed chemical flows on the circulation line (3) line and the appropriate temperature with the foreign matters removed It is controlled to be supplied to the inner tank (1) again and the chemical is circulated for a certain time to remove and etch the foreign matter attached to the wafer.

When the components on the circulation line 3 are replaced by long-term use, the chemicals are discharged to the drain line 4, and then pure water is introduced into the inner tank 1 and pumped by the pump 5 to After completely removing the residual amount of chemical present inside, the pure water is discharged to the drain line 4, and the parts are replaced.

However, as long as the use of the equipment as described above, when replacing the parts installed on the circulation line (3) as in the cleaning operation, the pure water is circulated throughout the equipment and the chemicals present in the circulation line (3) must be removed, which is a very cumbersome problem. There was this.

SUMMARY OF THE INVENTION An object of the present invention devised in view of the above problems is to provide a component washing apparatus of a semiconductor cleaning equipment suitable for easily removing chemicals present in the circulation line when replacing a component installed on the circulation line. have.

1 is a piping diagram showing the structure of a conventional semiconductor cleaning equipment.

Figure 2 is a piping diagram showing the configuration of the cleaning equipment equipped with the present invention parts cleaning apparatus.

Explanation of symbols on the main parts of the drawings

11: inner tide 12: outer tide

13 circulation line 14 pump

15 damper 16 filter

17: temperature controller 20: pure water supply line

21,31: open / close valve 22,32: check valve

23,33: open / close valve 30: pure water discharge valve

In order to achieve the object of the present invention as described above, the outer tank and the inner tank is connected to the circulation line, the pump, damper, filter, temperature controller is installed on the circulation line in the semiconductor cleaning equipment, the inlet of the circulation line Branched to the pure water supply line, and installed in the outlet portion to install the pure water discharge line, the open and close valves and check valves respectively installed in the pure water supply line and the pure water discharge line, and the pure water supply line and There is provided a component washing apparatus for semiconductor cleaning equipment, characterized in that an open / close valve is installed on a circulation line opposite to the pure water discharge line.

Hereinafter, with reference to the embodiment of the accompanying drawings, the component washing apparatus of the present invention semiconductor cleaning equipment configured as described above in more detail as follows.

Figure 2 is a piping diagram showing the configuration of the cleaning equipment is installed parts cleaning device of the present invention, as shown, the outer tank 12 is provided on the outside of the inner tank 11, the inner tank 11 and the outer tank 12 Is connected to the circulation line 13, the pump 14, the damper 15, the filter 16, the temperature controller 17 is installed on the circulation line (13).

In addition, as a component washing device, the inlet portion of the circulation line 13 is branched and connected to the pure water supply line 20, and the outlet portion is branched to install the pure water discharge line 30, and the pure water supply line 20 ), And the open and close valves 21 and 31 and the check valves 22 and 32 are respectively installed in the pure water discharge line 30 and the opposite side of the pure water supply line 20 and the pure water discharge line 30. The opening and closing valves 23 and 33 are provided on the line 13.

In the figure, reference numeral 18 denotes a drain valve.

The cleaning equipment provided with the component cleaning device configured as described above is loaded with wafers inside the inner tank to be etched and cleaned in a state where the chemical is stored inside the inner tank 11, and pumped by the pump 14 to the inner tank. Chemical of (11) is overflowed to the outer tank 12, the foreign matter is removed while being circulated in the circulation line 13 is adjusted to the appropriate temperature is supplied to the inner tank again.

When the parts on the circulation line 13 are replaced due to long term use, the opening / closing valves 23 and 33 installed in the circulation line 13 are closed, and the pure water supply line 20 and the pure water discharge line ( Opening the open / close valves 21 and 31 installed on the 30 and then supplying pure water to the pure water supply line 20, the chemical present inside the circulation line 13 is a pure discharge line with the pure water ( It is discharged to the outside through 30). Such chemical removal is carried out for a certain time and is present in the circulation line 13 and the components (pump 14, damper 15, filter 16, temperature controller 17) installed on the circulation line 13. When the chemicals are completely removed, close the open and close valves 21 and 31 and replace the parts.

Then, the open / close valves 23 and 33 provided on the circulation line 13 are opened again, the chemical is stored in the inner tank 11, and the cleaning operation of the wafer is resumed.

As described above in detail, the component washing apparatus of the present invention for semiconductor cleaning equipment is provided with a pure water supply line and a pure water discharge line at the inlet and outlet of the circulation line, and open and close valves at the pure water supply line and the discharge line, respectively. And check valves are installed, and open / close valves are installed in the circulation line on the opposite side to supply pure water to the pure water supply line when replacing parts installed on the circulation line, and the supplied pure water exists in the circulation line and parts. It is discharged to the pure water discharge line with the chemical to be cleaned, and then replace the parts, as in the case of the conventional cleaning, there is an effect that the parts are easier to wash than when the pure water in the inner tank circulating.

Claims (1)

In the semiconductor cleaning equipment in which the outer tank and the inner tank are connected by a circulation line, and a pump, a damper, a filter, and a temperature controller are installed on the circulation line, the pure water supply line is connected to the inlet of the circulation line. , Branched to the outlet and connected to the pure water discharge line, and install the open, closed valve and check valve in the pure water supply line and the pure water discharge line, respectively, and open on the circulation line opposite to the pure water supply line and the pure water discharge line , Component cleaning apparatus for a semiconductor cleaning equipment, characterized in that configured by installing a closed valve.