KR102492720B1 - Anti-glare glass using silk screen mesh patterns and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a diffuse reflection glass substrate and a method for manufacturing the same, and a photoresist thin film pattern is made by using a fine mesh pattern having holes penetrating the substrate, such as a silk screen mask, as a mask on a glass substrate. The present invention relates to a diffuse reflection substrate manufactured by a technique of transferring a mask pattern to an arbitrary substrate such as glass, metal, polymer, etc. through an etching process thereafter, and a manufacturing method thereof. On the surface of the diffuse reflection substrate developed according to the present invention, a diffuse reflection function can be implemented by various desired regular patterning. This is very creative and progressive as it is distinct from the technology using the boundary etching process on the surface of materials that exist in very irregular sizes or the conventional diffuse reflection glass manufacturing technology that uses fine particles as a mask. Through the present invention, it is determined that diffuse reflection substrates using more various kinds of regular patterns can be made more convenient and more environmentally friendly in the future. In addition, it is expected that it will be able to more efficiently cope with quality control based on large-area automation, greatly contributing to the improvement of diffuse reflection substrate manufacturing efficiency.

Description

Anti-glare glass using silk screen mesh patterns and manufacturing method thereof}

The present invention relates to a diffuse reflection glass substrate and a method for manufacturing the same, and more particularly, by using silk screen itself as a mask material to create a photoresist thin film pattern on a glass substrate, and then transferring the mask pattern to the glass substrate through an etching process. It relates to a diffuse reflection glass substrate having a regular diffuse reflection pattern manufactured by a technique for manufacturing the same and a manufacturing method thereof.

The anti-glare glass substrate is a special glass used as a window to reduce the reflection of incident light in products such as electronic blackboards, electric signboard displays, and kiosks. Techniques for manufacturing diffuse reflection glass using irregular pattern wet etching have already been described in detail in US Patents US 4,944,986, US 5,120,605, US 6,929,861 and the like.

To explain the technology, generally, after cleaning the surface of specially manufactured soda-lime glass, it is immersed in a solution containing a hydrofluoric acid mixture, or the aqueous solution of a hydrofluoric acid mixture is sprayed to form materials that exist in various sizes on the surface of an amorphous glass material. Fine boundary surfaces (boundaries) are selectively etched. In that case, the interface where the linear defects are concentrated reacts faster than the amorphous glass surface, and as a result, it is etched more deeply and more.

As a result, when an incident ray is incident on the boundary surface, irregular reflection or diffuse reflection of light occurs at the very irregular boundary surface. Glass made using this principle to reduce the reflectivity of incident light is called sine glass or anti-glare glass. Another diffuse reflection glass manufacturing method is a method of wet etching by applying fine particles and using them as a mask, which is described in detail in US Patent Application Pub.No.: US2007/0195419.

However, according to the conventional case, by using a method of selectively etching only the boundary of the glass by mixing HF, NH ₄ F, etc., the characteristics of the diffuse reflection glass are highly dependent on the size and shape of the boundary inherent in the glass. do. Accordingly, a lot of wet process time may be required, and glass is limited to specific glass suitable for boundary characteristics, so the price is relatively high and the process is very sensitive and inconvenient.

In addition, the boundary of the glass etched with the existing hydrofluoric acid mixture is very irregular, and the density of fine defects is concentrated on the boundary, so if even a little contaminant remains due to lack of cleaning, the energy required for the reaction is very low, affecting the fine boundary. The chemical reaction of the surface state of the given diffuse reflection glass has been the main cause of product defects.

In addition, such a wet etching technology after application of fine particles is not easy to apply to large-area glass, and has many technical limitations when the uniformity of substrate etching is important.

US Patent US 4,944,986

The present invention was developed to solve the above problems, and an object of the present invention is to provide a diffuse reflection glass substrate and a manufacturing method thereof through regular pattern etching, which was impossible with techniques using irregular boundary etching or fine particle masks. .

In addition, it is intended to provide a diffuse reflection substrate having regular fine patterning having an arbitrary size and shape desired by a manufacturer, and a method for manufacturing the same, rather than an irregularly sized interface etching technique.

By using the present invention, those skilled in the art can easily make a diffuse reflection substrate any substrate that reflects incident light, such as a polymer substrate or a metal substrate, by simply changing the substrate, as well as the substrate described here as an example.

In addition, the surface of the diffuse reflection glass developed according to the present invention can implement a diffuse reflection function by various regular patterning, so it can be clearly distinguished from the conventional boundary etching process-based diffuse reflection glass manufacturing technique in which the size is very irregular. In the future, it is expected that the present invention will contribute greatly to the development of the diffuse reflection substrate manufacturing industry by conveniently making diffuse reflection substrates of various materials as well as diffuse reflection glass substrates having more diverse types of patterns in the future.

In order to solve the above-mentioned problems of the irregular reflection glass manufacturing method by irregular boundary etching or fine particle coating, the present invention has developed a diffuse reflection substrate using a regular fine pattern and a manufacturing method thereof from a very original point of view.

In the present invention, in a glass substrate for diffuse reflection of light incident from the outside, a diffuse reflection pattern having a regular shape, size, or arrangement appears on one or both sides of the substrate by using a silk screen itself formed with a fine mesh pattern as a mask. and the diffuse reflection pattern has various optical characteristics by controlling the shape or size of the fine mesh pattern of the mask.

The diffuse reflection pattern may be embossed or engraved on one or both surfaces of the substrate.

Here, the diffuse reflection pattern is composed of a combination of polygons, and is characterized in that polygons of a certain shape are continuously and repeatedly formed around the center pattern formed at the center of the unit cell.

In addition, the substrate is mainly described as a glass substrate capable of reflecting incident light, but may be formed of either a polymer substrate or a metal substrate.

On the other hand, in order to achieve the above object, in the present invention, a mask preparation step of preparing a mask in which fine mesh patterns are regularly formed through which light partially passes, and when the mask is prepared, a photoresist is applied to a substrate to make a diffuse reflection substrate. A photoresist film forming step of forming a photoresist thin film by applying a thin film, an exposure step of exposing the mask to ultraviolet rays after contacting the substrate coated with the photoresist, and selectively removing the photoresist on the substrate using a developing solution after exposure to the substrate. A developing step of forming a regular photoresist fine pattern thereon, an etching step of transferring the regular fine pattern on the substrate by etching the substrate having the photoresist fine pattern, and removing the photoresist remaining on the substrate on which the fine pattern is transferred. There is provided a method for manufacturing a diffuse reflection glass substrate comprising the step of removing the photoresist film, and the step of cleaning the substrate from which the photoresist film is removed with distilled water to form a regular diffuse reflection pattern on the surface of the substrate.

Here, the mask may be formed of any one of a glass mask, a quartz mask, a polymer mask, a metal mask, a ceramic screen, and a silk screen.

Here, the fine mesh pattern of the metal or silk screen mask is characterized by using a mesh having a size of 30 to 600 necks.

In addition, in the etching step, dip etching in which the substrate having the photosensitive film fine pattern is immersed in an etchant for a certain period of time, wet etching using chemicals in a spray method, or dry etching using etching gas, plasma, or ion beam Either way can be used.

Meanwhile, in the photoresist film forming step, a photoresist coating method including spin coating, roll coating, bar coating, and dip coating may be used, or a photoresist bonding method of forming a photoresist thin film by bonding the photoresist thin film to a substrate may be used.

According to the present invention as described above, there is an effect of forming a regular diffuse reflection pattern on a glass substrate, which was impossible with techniques using irregular boundary etching or fine particle masks.

In addition, it is possible to manufacture a diffuse reflection glass substrate having regular micro-patterning having an arbitrary size and shape desired by a manufacturer, rather than an irregularly sized interface etching technique.

In addition, substrates made of any material that reflects incident light, such as polymer substrates and metal substrates, as well as glass substrates, can be easily made into diffuse reflection substrates.

In addition, the surface of the diffuse reflection glass developed according to the present invention can implement a diffuse reflection function by various regular patterning, so it can be clearly distinguished from the conventional boundary etching process-based diffuse reflection glass manufacturing technique in which the size is very irregular. In the future, it is expected that the present invention will contribute greatly to the development of the diffuse reflection substrate manufacturing industry as various diffuse reflection substrates as well as diffuse reflection substrates having more diverse types of patterns can be conveniently manufactured in the future.

An aspect of the present invention is to provide a diffuse reflection function to an arbitrary glass substrate by using 1) a silk screen with a fine mesh pattern as a pattern mask, and 2) an optimized combination of depth, shape, and size of the pattern when the pattern is transferred. It has a feature of imparting a diffuse reflection function by. Therefore, it has the characteristic of using a silk screen mask that is completely different from the conventional glass or quartz mask mainly used for patterning for semiconductor manufacturing and the type of mask used for material or application. In addition, in terms of using the silk screen itself without making any additional patterns, it is clearly distinguished from the silk screen-based photoresist mask used for patterns on electronic circuit boards.

1 is a process chart showing an embodiment of a method for manufacturing a diffuse reflection glass substrate according to the present invention.
2 is a flowchart illustrating a method of manufacturing a diffuse reflection substrate according to the present invention.
3 is a photograph of a diffuse reflection glass surface manufactured using a conventional boundary etching technique.
4 is a photograph of the surface of the diffuse reflection glass manufactured using the etching transfer technology of the silk screen mask fine pattern according to the present invention (using a 250-item screen mask).

In embodiments, products of the present invention and methods of making, using the present invention provide one or more desirable characteristics or aspects, including examples as discussed below. Features or aspects recited in any of the claims are generally applicable to all aspects of the invention. A single or multiple feature or aspect recited in any one claim may be modified in combination with any other recited feature or aspect in any other claim or claims. A diffuse reflection substrate and a method for manufacturing the same will be described with reference to examples for carrying out the invention.

The present invention proposes a method of manufacturing a diffuse reflection glass substrate using a regular fine pattern from a very original point of view in order to solve the problems of the irregular reflection glass manufacturing method by irregular boundary etching or fine particle coating mentioned above.

1 is a process chart showing an embodiment of a method for manufacturing a diffuse reflection glass substrate according to the present invention, and FIG. 2 is a flow chart showing a method for manufacturing a diffuse reflection substrate according to the present invention. Step S110, photoresist film forming step S120, exposure step S130, developing step S140, etching step S150, photoresist film removing step S160, and diffuse reflection pattern forming step S170 are performed.

In order to form a fine pattern for diffuse reflection of the present invention, in the mask preparation step (S110), a mask 10 in which a fine mesh pattern 12 through which light partially passes is regularly formed is prepared (Fig. 1 (a)). ).

Here, the mask 10 may be a quartz mask, a glass mask, a polymer mask, a metal mask, a ceramic screen, a silk screen, or the like used in semiconductor manufacturing.

Specifically, the fine pattern 12 of the mask 10 may be used by fabricating a pattern on a quartz mask, glass mask, or film mask used in semiconductor manufacturing. However, in the present invention, a commercially available silk screen mesh having fine patterns capable of shielding light is used without the need for expensive processing costs such as a quartz mask.

An aspect of the present invention is to provide a diffuse reflection function to an arbitrary glass substrate by using a silk screen having a fine mesh pattern as a pattern mask, and by optimizing the depth, shape, and size of the pattern when the pattern is transferred, the diffuse reflection is reduced. It has a feature that gives it a function.

Therefore, it has the characteristic of using a silk screen mask that is completely different from the glass or quartz mask mainly used for conventional patterning for semiconductor manufacturing and the type of mask used for material or application. In terms of use, it is clearly distinguished from the silk screen-based photoresist mask used for patterns on electronic circuit boards and the like.

Here, it is preferable to use a mesh having a size of 30 to 600 necks for the fine mesh pattern 12 of the mask 10, and more specifically, a mask using a mesh or pattern having a size of 100 to 400 necks It is also possible to use

When the mask 10 is prepared, a photoresist thin film 30 is formed by thinly applying a photoresist to the substrate 20 to be a diffuse reflection substrate (FIG. 1(c)).

In the present invention, the substrate 20 may be formed of any one of a glass substrate, a polymer substrate, or a metal substrate capable of reflecting incident light, and in an embodiment of the present invention, a glass substrate will be described as an example.

In the step of forming the photoresist film 30, a photoresist coating method including spin coating, roll coating, bar coating, and dip coating may be used, or a photoresist bonding method of forming a photoresist thin film by bonding the photoresist thin film to a substrate may be used. .

Thereafter, after the mask 10 is brought into contact with the substrate coated with the photoresist, an exposure step of irradiating ultraviolet rays is performed (FIG. 1(d)).

When ultraviolet rays are irradiated through the mask 10, the light passing through the fine screen mesh pattern 12 of the mask 10 hits the photoresist film 30 and selectively exposes it.

After exposure, the photoresist on the substrate is selectively removed using a developing solution to form a regular photoresist fine pattern 32 on the substrate 20 (FIG. 1(e)).

Through such a developing step, a photoresist thin film having a certain fine pattern is fabricated on a glass substrate by leaving exposed or unexposed portions in the exposure step.

Thereafter, an etching step of transferring the regular fine pattern 22 on the substrate by etching the substrate 20 having the photoresist fine pattern 32 is performed (FIG. 1(f)).

In the etching step, dip etching in which the substrate 20 having the photoresist film fine pattern 32 is immersed in an etchant 40 for a certain period of time, wet etching using chemicals in a spray method or etching gas, plasma, Any one of dry etching using an ion beam may be used.

As the etchant 40, for example, a glass etchant such as Buffered Oxide Etching Solution may be used, and washed with distilled water after being immersed in the glass etchant for a certain period of time. As such, through the etching step of immersing in an etching solution, the fine pattern 22 can be regularly transferred to the surface of the substrate 20 .

After the photoresist film remaining on the substrate 20 on which the fine pattern is transferred is removed using acetone, the substrate from which the photoresist film is removed is washed with distilled water.

When each of these processes is performed in order, a certain fine pattern of the screen mesh is finally formed through etching on the surface of the glass substrate. At this time, by controlling the size or shape of the pattern made, it is possible to conveniently manufacture diffuse reflection glass having various optical characteristics.

The glass etchant used in the process technology developed through the present invention is safer and more environmentally friendly than the mixed etchant used in the conventional diffuse reflection glass manufacturing technology by irregular boundary etching. In addition, the manufactured diffuse reflection glass substrate also has a very regular pattern, so that it is possible to automate the diffuse reflection defect inspection equipment and more efficiently cope with quality control.

As shown in FIG. 4 , a diffuse reflection pattern 22 having a regular shape, size, or arrangement is formed on the surface of the diffuse reflection substrate manufactured by this manufacturing method. The pattern 22 may be formed in an embossed or intaglio pattern on one or both surfaces of the substrate.

Here, the diffuse reflection pattern 22 may be formed of a polygonal combination.

As shown in FIG. 4 , the diffuse reflection pattern 22 on the glass may be continuously and repeatedly formed with polygons of a certain shape around the center pattern formed at the center of the unit cell.

The diffuse reflection glass pattern can be adjusted by controlling the shape or size of the fine mesh pattern of the mask. That is, when the shape of the fine mesh pattern of the mask is a square, the central pattern of the diffuse reflection pattern is formed in a square, and small polygons may be continuously and regularly arranged around it.

Accordingly, in the present invention, a diffuse reflection glass substrate having various optical characteristics can be manufactured by controlling the shape or size of the pattern.

[Example]

As shown in FIG. 1, in the process of manufacturing diffuse reflection glass using a regular mask pattern according to the present invention, a mask 10 having a fine mesh pattern 12 is prepared. In this embodiment, a silk screen of 250 or 300 necks was cut into a size of 100x100 mm 2 to prepare a mask.

Thereafter, a photoresist (product name: QX601) was deposited on the soda lime substrate to a thickness of 1 μm at 3,000 rpm through spin coating. Thereafter, the silk screen mask was placed on the substrate coated with the photoresist, and after contact, ultraviolet rays were vertically irradiated for 5 minutes. Thereafter, the treated substrate was immersed in a photoresist developing solution (product name: AZ 400) for 15 seconds to remove the exposed portion of the photoresist thin film, and a photoresist fine pattern was fabricated on the glass.

The substrate was immersed in an etching solution (Buffered Oxide Etching Solution) for about 10 seconds, and a fine pattern was produced by etching the glass surface. After glass etching, it was washed with distilled water, and then the remaining photoresist thin film was removed with acetone.

Finally, the final cleaning was performed with distilled water to complete the fabrication of the diffuse reflection glass substrate.

<Result analysis>

3 is a photograph of the surface of the diffuse reflection glass manufactured using the conventional boundary etching technique, and FIG. 4 is a photograph of the surface of the diffuse reflection glass manufactured using the etching transfer technique of the silk screen mask fine pattern according to the present invention (250 items). use screen mask)

By comparing them, the difference between the two process results can be clearly understood.

Table 1 shows an example of the characteristics of the silk screen micro-patterned diffuse reflection glass manufactured through the present invention.

[Table 1] Characteristics of silk screen micro-patterned diffuse reflection glass manufactured through the present invention

sample number screen size (th) tint transmittance
(400-700 nm) (%) Gloss (at 60 degrees) One 110 89.5 86.68 149.0 2 180 78.8 80.07 91.2 3 250 77.7 72.60 71.7 4 300 93.5 85.69 33.4

The surface of the diffuse reflection glass developed according to the present invention can realize the diffuse reflection function by various regular patterning, which can be clearly distinguished from the conventional boundary etching process-based diffuse reflection glass manufacturing technique in which the size is very irregular. Through the invention, it is expected that various diffuse reflection substrates as well as diffuse reflection substrates having more diverse types of patterns can be conveniently made in the future, greatly contributing to the development of the diffuse reflection substrate manufacturing industry.

10: mask 12: fine mesh pattern
20: substrate 22: diffuse reflection pattern
30: photoresist thin film 32: photoresist fine pattern
40: etchant

Claims (7)

In the glass substrate for diffuse reflection of light incident from the outside,
A diffuse reflection pattern having a regular shape, size or arrangement is formed on one or both sides of the substrate using a silk screen mask formed with a mesh pattern having a size of 30 to 600 necks,
The diffuse reflection pattern has various optical characteristics by controlling and transferring the shape or size of the fine mesh pattern of the mask,
The diffuse reflection pattern is formed in an embossed or intaglio pattern on one or both surfaces of the substrate,
The diffuse reflection pattern is composed of a combination of polygons, and polygons of a certain shape are continuously and repeatedly formed around the center pattern formed at the center of the unit cell,
The diffuse reflection glass substrate, characterized in that the width and length of the center pattern are 25.89 μm and 27.68 μm, respectively, and the width and length of the polygon are 14.64 μm and 5.24 μm, respectively. delete delete delete delete delete delete

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