KR102497541B1 - 표시 장치 - Google Patents
표시 장치 Download PDFInfo
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- KR102497541B1 KR102497541B1 KR1020150162073A KR20150162073A KR102497541B1 KR 102497541 B1 KR102497541 B1 KR 102497541B1 KR 1020150162073 A KR1020150162073 A KR 1020150162073A KR 20150162073 A KR20150162073 A KR 20150162073A KR 102497541 B1 KR102497541 B1 KR 102497541B1
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- reinforcing member
- thickness
- driving chip
- circuit board
- printed circuit
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- 230000003014 reinforcing effect Effects 0.000 claims abstract description 82
- 230000000903 blocking effect Effects 0.000 claims description 25
- 230000017525 heat dissipation Effects 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 79
- 239000000758 substrate Substances 0.000 description 16
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 9
- 230000007547 defect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000003666 anti-fingerprint Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005674 electromagnetic induction Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
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- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
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- G—PHYSICS
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- G—PHYSICS
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- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/1658—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to the mounting of internal components, e.g. disc drive or any other functional module
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
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- H—ELECTRICITY
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- H04M—TELEPHONIC COMMUNICATION
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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Abstract
Description
도 2는 도 1에 도시된 표시 장치의 분해 사시도이다.
도 3은 도 1의 I-I`선을 따라 절단한 표시 장치의 단면도이다.
도 4는 본 발명의 일 실시예에 따른 제1 보강 부재의 단면도이다.
도 5는 본 발명의 일 실시예에 따른 제2 보강 부재의 단면도이다.
도 6은 본 발명의 일 실시예에 따른 제2 보강 부재의 일부를 확대하여 도시한 단면도이다.
도 7은 본 발명의 일 실시예에 따른 제2 보강 부재의 일부를 확대하여 도시한 단면도이다.
도 8은 본 발명의 일 실시예에 따른 표시 장치의 단면도이다.
200: 표시 패널 300: 제1 보강 부재
400: 제2 보강 부재 500: 브래킷
600: 후면 케이스
Claims (19)
- 영상을 표시하는 표시 패널;
상기 표시 패널 아래에 배치되며 일면에 구동칩이 실장된 인쇄회로기판;
상기 표시 패널과 상기 인쇄회로기판 사이에 배치된 제1 보강 부재; 및
상기 인쇄회로기판 아래에 배치되며, 상기 구동칩을 사이에 두고 상기 인쇄회로기판과 마주하고, 상기 구동칩과 마주하는 일면에는 음각홈이 제공된 제2 보강 부재를 포함하고, 상기 구동칩은 상기 음각홈 내부에 배치되고,
상기 제2 보강 부재는 평면상에서 상기 구동칩과 중첩하는 제1 영역, 및 상기 제1 영역을 둘러싸는 제2 영역으로 구분되고,
상기 제1 영역은 제1 두께를 갖고, 상기 제2 영역은 상기 제1 두께보다 두꺼운 제2 두께를 갖고,
상기 제2 보강 부재는,
차광층; 및
상기 차광층과 상기 인쇄회로기판 사이에 배치되는 쿠션층을 포함하는 표시 장치. - 제1 항에 있어서,
상기 음각홈의 깊이는 상기 구동칩의 두께와 같거나 상기 구동칩의 두께보다 큰 표시 장치. - 삭제
- 삭제
- 제1 항에 있어서,
상기 쿠션층은 상기 제1 영역에서 제3 두께를 갖고, 상기 제2 영역에서 상기 제3 두께보다 두꺼운 제4 두께를 갖는 표시 장치. - 제5 항에 있어서,
상기 제3 두께와 상기 제4 두께의 두께 차이는 상기 구동칩의 두께와 같거나 상기 구동칩의 두께보다 큰 표시 장치. - 제1 항에 있어서,
상기 쿠션층은 상기 표시 패널의 두께 방향에서 바라볼 때 상기 제1 영역과 비중첩하는 표시 장치. - 제7 항에 있어서,
상기 쿠션층의 두께는 상기 구동칩의 두께와 같거나 상기 구동칩의 두께보다 큰 표시 장치. - 제1 항에 있어서,
상기 제1 보강 부재는
차광층;
상기 차광층 위에 배치된 방열층; 및
상기 방열층 위에 배치된 차폐층을 포함하고, 상기 차폐층은 상기 표시 패널의 배면에 부착되는 표시 장치. - 제9 항에 있어서,
상기 차폐층은 도전성 물질을 포함하고, 상기 방열층은 그라파이트 분자를 포함하는 표시 장치. - 제1 항에 있어서,
상기 제2 보강 부재 아래에 배치되는 브래킷을 더 포함하는 표시 장치. - 제11 항에 있어서,
상기 브래킷의 상기 제2 보강 부재와 접촉되는 일면에는 수용홈이 제공되고, 상기 제2 보강 부재는 상기 수용홈 내부에 배치되는 표시 장치. - 표시 패널;
상기 표시 패널 아래에 배치되며 일면에 구동칩이 실장된 인쇄회로기판;
상기 표시 패널의 일단에 부착되어 상기 표시 패널의 배면을 향해 굴곡되어 상기 인쇄회로기판에 부착되는 연성인쇄회로기판;
상기 표시 패널과 상기 인쇄회로기판 사이에 배치된 제1 보강 부재; 및
상기 인쇄회로기판을 사이에 두고 상기 제1 보강 부재와 마주하며 배치된 제2 보강 부재를 포함하고,
상기 제2 보강 부재는 상기 표시 패널의 두께 방향에서 바라볼 때 상기 구동칩과 중첩하며 제1 두께를 갖는 제1 영역, 및 상기 제1 영역을 둘러싸며 상기 제1 두께보다 두꺼운 제2 두께를 갖는 제2 영역으로 구분되고,
상기 제2 보강 부재의 상기 제1 영역에는 상기 구동칩이 삽입되는 음각홈이 제공되는 표시 장치. - 제13 항에 있어서,
상기 구동칩은 상기 인쇄회로기판과 상기 제2 보강 부재 사이에 배치되는 표시 장치. - 삭제
- 제13 항에 있어서,
상기 음각홈의 깊이는 상기 구동칩의 두께와 같거나 상기 구동칩의 두께보다 큰 표시 장치. - 제13 항에 있어서,
상기 제2 보강 부재 아래에 배치되는 브래킷을 더 포함하는 표시 장치. - 제17 항에 있어서,
상기 브래킷의 상기 제2 보강 부재와 접촉되는 일면에는 수용홈이 제공되고, 상기 제2 보강 부재는 상기 수용홈 내부에 배치되는 표시 장치. - 제13 항에 있어서,
상기 제2 보강 부재는 상기 인쇄회로기판을 커버하며 상기 제1 보강 부재와 결합하는 표시 장치.
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