KR102447759B1 - 점착 시트, 및 가공물의 제조 방법 - Google Patents

점착 시트, 및 가공물의 제조 방법 Download PDF

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Publication number: KR102447759B1
Authority: KR; South Korea
Prior art keywords: adhesive sheet; pressure; sensitive adhesive; plate; layer
Prior art date: 2014-12-02

Application number

KR1020177005685A

Other languages

English (en)

Korean (ko)

Other versions

KR20170091578A (ko

Inventor

시게유키 야마시타

마사토모 나카무라

Original Assignee

린텍 가부시키가이샤

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2014-12-02

Filing date

2015-11-27

Publication date

2022-09-27

2015-11-27 Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤

2017-08-09 Publication of KR20170091578A publication Critical patent/KR20170091578A/ko

2022-09-27 Application granted granted Critical

2022-09-27 Publication of KR102447759B1 publication Critical patent/KR102447759B1/ko

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239000000975 dye Substances 0.000 description 1
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UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
239000005038 ethylene vinyl acetate Substances 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
238000001125 extrusion Methods 0.000 description 1
239000003063 flame retardant Substances 0.000 description 1
229910052731 fluorine Inorganic materials 0.000 description 1
239000011737 fluorine Substances 0.000 description 1
229910021485 fumed silica Inorganic materials 0.000 description 1
239000011086 glassine Substances 0.000 description 1
ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
229910052736 halogen Inorganic materials 0.000 description 1
150000002367 halogens Chemical class 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
239000003999 initiator Substances 0.000 description 1
229910010272 inorganic material Inorganic materials 0.000 description 1
239000011147 inorganic material Substances 0.000 description 1
229920000554 ionomer Polymers 0.000 description 1
229910052742 iron Inorganic materials 0.000 description 1
ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
239000000314 lubricant Substances 0.000 description 1
238000012423 maintenance Methods 0.000 description 1
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
229910052753 mercury Inorganic materials 0.000 description 1
229910001507 metal halide Inorganic materials 0.000 description 1
150000005309 metal halides Chemical class 0.000 description 1
AYLRODJJLADBOB-QMMMGPOBSA-N methyl (2s)-2,6-diisocyanatohexanoate Chemical compound COC(=O)[C@@H](N=C=O)CCCCN=C=O AYLRODJJLADBOB-QMMMGPOBSA-N 0.000 description 1
125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 1
JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
SJPFBRJHYRBAGV-UHFFFAOYSA-N n-[[3-[[bis(oxiran-2-ylmethyl)amino]methyl]phenyl]methyl]-1-(oxiran-2-yl)-n-(oxiran-2-ylmethyl)methanamine Chemical compound C1OC1CN(CC=1C=C(CN(CC2OC2)CC2OC2)C=CC=1)CC1CO1 SJPFBRJHYRBAGV-UHFFFAOYSA-N 0.000 description 1
229910052759 nickel Inorganic materials 0.000 description 1
125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 1
229920002601 oligoester Polymers 0.000 description 1
239000011368 organic material Substances 0.000 description 1
RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
239000002245 particle Substances 0.000 description 1
125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
229940059574 pentaerithrityl Drugs 0.000 description 1
WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
239000012466 permeate Substances 0.000 description 1
229910000073 phosphorus hydride Inorganic materials 0.000 description 1
239000003504 photosensitizing agent Substances 0.000 description 1
230000000704 physical effect Effects 0.000 description 1
239000000049 pigment Substances 0.000 description 1
239000004014 plasticizer Substances 0.000 description 1
229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
229920002857 polybutadiene Polymers 0.000 description 1
229920001083 polybutene Polymers 0.000 description 1
229920000515 polycarbonate Polymers 0.000 description 1
239000004417 polycarbonate Substances 0.000 description 1
229920000728 polyester Polymers 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
229920000570 polyether Polymers 0.000 description 1
229920001223 polyethylene glycol Polymers 0.000 description 1
239000011112 polyethylene naphthalate Substances 0.000 description 1
229920001721 polyimide Polymers 0.000 description 1
229920000306 polymethylpentene Polymers 0.000 description 1
239000011116 polymethylpentene Substances 0.000 description 1
229920005672 polyolefin resin Polymers 0.000 description 1
229920005606 polypropylene copolymer Polymers 0.000 description 1
229920002223 polystyrene Polymers 0.000 description 1
239000004814 polyurethane Substances 0.000 description 1
229920002635 polyurethane Polymers 0.000 description 1
229920001289 polyvinyl ether Polymers 0.000 description 1
239000000047 product Substances 0.000 description 1
230000002250 progressing effect Effects 0.000 description 1
125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
239000011342 resin composition Substances 0.000 description 1
238000007665 sagging Methods 0.000 description 1
RSVDRWTUCMTKBV-UHFFFAOYSA-N sbb057044 Chemical compound C12CC=CC2C2CC(OCCOC(=O)C=C)C1C2 RSVDRWTUCMTKBV-UHFFFAOYSA-N 0.000 description 1
230000011218 segmentation Effects 0.000 description 1
239000002356 single layer Substances 0.000 description 1
238000005549 size reduction Methods 0.000 description 1
239000002904 solvent Substances 0.000 description 1
125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
229920005992 thermoplastic resin Polymers 0.000 description 1
229910052718 tin Inorganic materials 0.000 description 1
239000011135 tin Substances 0.000 description 1
239000010936 titanium Substances 0.000 description 1
229910052719 titanium Inorganic materials 0.000 description 1
239000004408 titanium dioxide Substances 0.000 description 1
DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
IUCJMVBFZDHPDX-UHFFFAOYSA-N tretamine Chemical compound C1CN1C1=NC(N2CC2)=NC(N2CC2)=N1 IUCJMVBFZDHPDX-UHFFFAOYSA-N 0.000 description 1
229950001353 tretamine Drugs 0.000 description 1
229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
229910052725 zinc Inorganic materials 0.000 description 1
239000011701 zinc Substances 0.000 description 1
229910052726 zirconium Inorganic materials 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
- C09J133/12—Homopolymers or copolymers of methyl methacrylate
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Adhesive Tapes (AREA)
Dicing (AREA)
Adhesives Or Adhesive Processes (AREA)
Laminated Bodies (AREA)
Laser Beam Processing (AREA)

KR1020177005685A 2014-12-02 2015-11-27 점착 시트, 및 가공물의 제조 방법 KR102447759B1 (ko)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2014244009		2014-12-02
JPJP-P-2014-244009		2014-12-02
PCT/JP2015/083414 WO2016088677A1 (ja)	2014-12-02	2015-11-27	粘着シート、および加工物の製造方法

Publications (2)

Publication Number	Publication Date
KR20170091578A KR20170091578A (ko)	2017-08-09
KR102447759B1 true KR102447759B1 (ko)	2022-09-27

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Country Status (6)

Country	Link
JP (1)	JP6731852B2 (zh)
KR (1)	KR102447759B1 (zh)
CN (1)	CN106795396B (zh)
SG (1)	SG11201704347YA (zh)
TW (3)	TWI811763B (zh)
WO (1)	WO2016088677A1 (zh)

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JP6545712B2 (ja) *	2014-12-25	2019-07-17	デンカ株式会社	レーザーダイシング用粘着シートおよび半導体装置の製造方法
WO2018084021A1 (ja) *	2016-11-02	2018-05-11	リンテック株式会社	ダイシングシート
WO2019008807A1 (ja) *	2017-07-03	2019-01-10	リンテック株式会社	ステルスダイシング用粘着シートおよび半導体装置の製造方法
JP7109918B2 (ja) *	2017-12-28	2022-08-01	日東電工株式会社	ダイシングテープ一体型半導体背面密着フィルム
WO2019188817A1 (ja) *	2018-03-29	2019-10-03	リンテック株式会社	ワーク加工用シート
WO2019203021A1 (ja) *	2018-04-18	2019-10-24	リンテック株式会社	ワーク加工用シート
WO2020195744A1 (ja) *	2019-03-27	2020-10-01	リンテック株式会社	ワーク加工用シート
KR102426261B1 (ko) *	2019-09-26	2022-07-29	주식회사 엘지화학	다이싱 테이프용 점착조성물 및 이를 포함하는 다이싱 테이프
CN111693368A (zh) *	2020-06-15	2020-09-22	苏州高泰电子技术股份有限公司	用于晶圆切割胶带微观表征性能的测试方法

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2015
- 2015-11-27 KR KR1020177005685A patent/KR102447759B1/ko active IP Right Grant
- 2015-11-27 WO PCT/JP2015/083414 patent/WO2016088677A1/ja active Application Filing
- 2015-11-27 CN CN201580047960.6A patent/CN106795396B/zh active Active
- 2015-11-27 JP JP2016562422A patent/JP6731852B2/ja active Active
- 2015-11-27 SG SG11201704347YA patent/SG11201704347YA/en unknown
- 2015-12-01 TW TW110129890A patent/TWI811763B/zh active
- 2015-12-01 TW TW108148058A patent/TW202014490A/zh unknown
- 2015-12-01 TW TW104140062A patent/TWI738633B/zh active

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JP2011139042A (ja) *	2009-12-04	2011-07-14	Lintec Corp	ステルスダイシング用粘着シート及び半導体装置の製造方法

Also Published As

Publication number	Publication date
KR20170091578A (ko)	2017-08-09
TWI811763B (zh)	2023-08-11
CN106795396A (zh)	2017-05-31
JP6731852B2 (ja)	2020-07-29
TW202014490A (zh)	2020-04-16
TWI738633B (zh)	2021-09-11
JPWO2016088677A1 (ja)	2017-09-07
CN106795396B (zh)	2020-12-18
WO2016088677A1 (ja)	2016-06-09
TW202144516A (zh)	2021-12-01
SG11201704347YA (en)	2017-06-29
TW201629171A (zh)	2016-08-16

Publication	Publication Date	Title
KR102447759B1 (ko)	2022-09-27	점착 시트, 및 가공물의 제조 방법
CN106660332B (zh)	2020-08-07	保护膜形成用片以及带有保护膜的半导体芯片的制造方法
CN109743881B (zh)	2023-05-23	半导体加工用粘着胶带以及半导体装置的制造方法
KR101215105B1 (ko)	2012-12-24	스텔스 다이싱용 점착 시트 및 반도체 장치의 제조 방법
KR101880644B1 (ko)	2018-07-20	표면 보호 시트
JP6580219B2 (ja)	2019-09-25	粘着シートおよび加工されたデバイス関連部材の製造方法
US11842916B2 (en)	2023-12-12	Semiconductor processing adhesive tape and method of manufacturing semiconductor device
KR102632032B1 (ko)	2024-01-31	반도체 가공용 점착 테이프 및 반도체 장치의 제조 방법
KR102258918B1 (ko)	2021-06-02	보호막 형성용 복합 시트
JPWO2014155756A1 (ja)	2017-02-16	粘着シートおよび保護膜形成用複合シートならびに保護膜付きチップの製造方法
JP2017179025A (ja)	2017-10-05	ガラスダイシング用粘着シートおよびその製造方法
KR20230159372A (ko)	2023-11-21	반도체 가공용 점착 테이프 및 반도체 장치의 제조방법
KR20230159373A (ko)	2023-11-21	반도체 가공용 점착 테이프 및 반도체 장치의 제조방법
KR20230160228A (ko)	2023-11-23	반도체 가공용 점착 테이프 및 반도체 장치의 제조방법

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