KR102175798B1 - Interface module and apparatus for testing semiconductor devices having the same - Google Patents

Abstract

A semiconductor device testing apparatus is disclosed. The test apparatus includes a test chamber providing a space for electrically inspecting semiconductor elements accommodated in a test tray, and providing inspection signals for inspecting the semiconductor elements, and based on output signals from the semiconductor elements. And a test module for testing the semiconductor devices, and an interface module for transferring the test signals and output signals between the test module and the semiconductor devices. The interface module is disposed between a plurality of socket boards connected to the semiconductor elements, an interface board on which the socket boards are mounted, and between the socket boards or on the socket boards, and controls the temperature of the socket boards. It includes temperature control pipes that are provided with a fluid for temperature control.

Description

Interface module and apparatus for testing semiconductor devices including the same

Embodiments of the present invention relate to an interface module and a semiconductor device testing apparatus including the same. More specifically, it relates to a test module for providing inspection signals to semiconductor devices, an interface module for connecting the semiconductor devices, and a semiconductor device testing apparatus including the same.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be manufactured into finished products through a dicing process, a bonding process, and a packaging process. I can.

Semiconductor devices manufactured as described above may be determined as good or defective products through electrical characteristic inspection. In the electrical characteristic test, a semiconductor device test including a plurality of transfer modules for transferring the semiconductor devices, a test module for testing the semiconductor devices, and an interface module for connecting the semiconductor devices and the test module to each other Devices can be used.

The interface module may include an interface board disposed between the test module and a test tray in which the semiconductor devices are accommodated, and socket boards mounted on the interface board and connected to the semiconductor devices.

The semiconductor device testing apparatus includes a match plate having a plurality of pushers for pressing the semiconductor devices to connect the semiconductor devices and the socket boards, and a driving unit for operating the match plate. I can.

Meanwhile, the test process for the semiconductor devices may be classified into a high-temperature process and a low-temperature process. As an example, the high-temperature process is performed at an inspection temperature of about 85°C to 130°C, and the low-temperature process is about − It can be carried out at a test temperature of about 55 ℃ to -5 ℃. For the high-temperature and low-temperature processes as described above, thermoelectric elements for controlling the temperature of the semiconductor elements may be mounted on the match plate through the pushers.

On the other hand, test sockets for connection with the semiconductor elements are mounted on the socket boards, and on the rear surface of the socket boards, power supply elements for inspection of the semiconductor elements and resistors for signal conversion, capacitors, amplifiers, etc. Passive elements can be mounted.

However, the temperature of the socket boards may be increased by power supply elements mounted on the socket boards and passive elements for signal conversion, thereby making it difficult to maintain the semiconductor elements at a desired test temperature. have. In particular, in the case of a low-temperature process, it is difficult to lower the temperature of the semiconductor devices to a desired inspection temperature.

Republic of Korea Patent Publication No. 10-0671397 (2007.01.12) Republic of Korea Patent Publication No. 10-1228207 (2013.01.24)

An object of the present invention is to provide an interface module capable of controlling the temperature of socket boards connected to semiconductor devices, and a semiconductor device testing apparatus including the same.

An interface module according to an aspect of the present invention for achieving the above object includes a plurality of socket boards for transmitting test signals to the semiconductor devices in order to electrically test semiconductor devices accommodated in a test tray, and the socket board And an interface board on which they are mounted, and temperature control pipes disposed between the socket boards or on the socket boards on the interface board and provided with a temperature control fluid for adjusting the temperature of the socket boards.

According to embodiments of the present invention, the temperature control pipes are arranged parallel to each other, and both ends of the temperature control pipes may be respectively connected to a supply pipe and a recovery pipe for supplying and recovering the temperature control fluid.

According to embodiments of the present invention, when air is used as the temperature control fluid, the temperature control pipe may include a plurality of injection holes for injecting the air into a space adjacent to the socket boards.

According to embodiments of the present invention, test sockets for connection with the semiconductor devices may be disposed on the socket boards.

According to embodiments of the present invention, the interface module may further include a temperature sensor for measuring the temperature of the socket boards.

A semiconductor device testing apparatus according to another aspect of the present invention for achieving the above object includes a test chamber providing a space for electrically testing semiconductor devices accommodated in a test tray, and test signals for testing the semiconductor devices. And a test module for providing and inspecting the semiconductor elements based on output signals from the semiconductor elements, and an interface module for transferring the inspection signals and output signals between the test module and the semiconductor elements. I can. In this case, the interface module may include a plurality of socket boards connected to the semiconductor elements, an interface board on which the socket boards are mounted, and between the socket boards or on the socket boards, and the temperature of the socket boards It may include temperature control pipes provided with a temperature control fluid for adjusting the temperature.

According to embodiments of the present invention, the temperature control pipes are arranged parallel to each other, and both ends of the temperature control pipes may be respectively connected to a supply pipe and a recovery pipe for supplying and recovering the temperature control fluid.

According to embodiments of the present invention, when air is used as the temperature control fluid, the temperature control pipe may include a plurality of injection holes for injecting the air into the test chamber.

According to embodiments of the present invention, the air may be injected toward the socket boards.

According to embodiments of the present invention, test sockets for connection with the semiconductor devices may be disposed on the socket boards.

According to embodiments of the present invention, the test module may include a base board connected to the socket boards through a plurality of connectors in the test chamber.

According to embodiments of the present invention, the semiconductor device testing apparatus may further include a temperature sensor for measuring temperatures of the socket boards.

According to embodiments of the present invention, a plurality of spray nozzles for injecting a temperature control gas into the test chamber may be disposed on edge portions of the test chamber.

According to embodiments of the present invention, the test chamber may be provided with at least one outlet for discharging the injected temperature control gas to the outside of the test chamber.

According to embodiments of the present invention, air may be used as the temperature control gas.

According to embodiments of the present invention, a match plate including a plurality of pushers for closely contacting the semiconductor devices to the socket boards may be disposed in the test chamber, and the temperature control gas passes through the pushers. A plurality of holes may be provided.

Insert assemblies in which the semiconductor elements are accommodated may be mounted on the test tray, and the insert assemblies may be provided with a plurality of holes for passing the temperature control gas.

According to the embodiments of the present invention as described above, a test apparatus for inspecting electrical characteristics of semiconductor elements includes a test module for inspecting the semiconductor elements and an interface module for connection between the semiconductor elements and the test module. It may include. The interface module may include a plurality of socket boards for connection with the semiconductor devices and a plurality of temperature control pipes disposed adjacent to the socket boards to control the temperature of the socket boards. In addition, temperature control gas for temperature control of the socket boards may be injected into the test chamber in which the inspection process of the semiconductor devices is performed.

As described above, the temperature of the socket boards can be easily adjusted to a desired level by using the temperature control pipes and the temperature control gas, through which the temperature of the semiconductor elements can be easily raised or lowered to a desired test temperature. In addition, it can be kept constant at the test temperature. As a result, reliability can be greatly improved in the electrical characteristics inspection of the semiconductor devices.

1 is a schematic configuration diagram illustrating an interface module and a semiconductor device testing apparatus including the same according to an embodiment of the present invention.
FIG. 2 is a schematic plan view illustrating the interface module shown in FIG. 1.
3 is a schematic enlarged cross-sectional view for describing the interface module shown in FIG. 2.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention does not have to be configured as limited to the embodiments described below, and may be embodied in various other forms. The following examples are provided to sufficiently convey the scope of the present invention to those skilled in the art, rather than provided to enable the present invention to be completely completed.

In the embodiments of the present invention, when one element is described as being disposed on or connected to another element, the element may be directly disposed on or connected to the other element, and other elements are interposed therebetween. It could be. Alternatively, if one element is described as being placed or connected directly on another element, there cannot be another element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers, and/or parts, but the above items are not limited by these terms. Won't.

The terminology used in the embodiments of the present invention is used only for the purpose of describing specific embodiments, and is not intended to limit the present invention. In addition, unless otherwise limited, all terms including technical and scientific terms have the same meaning that can be understood by those of ordinary skill in the art of the present invention. The terms, such as those defined in conventional dictionaries, will be interpreted as having a meaning consistent with their meaning in the context of the description of the related art and the present invention, and ideally or excessively external intuition unless explicitly limited. It will not be interpreted.

Embodiments of the invention are described with reference to schematic diagrams of ideal embodiments of the invention. Accordingly, changes from the shapes of the diagrams, for example changes in manufacturing methods and/or tolerances, are those that can be sufficiently anticipated. Accordingly, embodiments of the present invention are not described as limited to specific shapes of regions described as diagrams, but include variations in shapes, and elements described in the drawings are entirely schematic and their shapes Is not intended to describe the exact shape of the elements, nor is it intended to limit the scope of the present invention.

1 is a schematic configuration diagram illustrating an interface module and a semiconductor device testing apparatus including the same according to an embodiment of the present invention.

Referring to FIG. 1, an interface module 120 and a semiconductor device test apparatus 100 including the same according to an embodiment of the present invention may be used for electrical inspection of semiconductor devices 10 (see FIG. 3 ). . For example, the interface module 120 and the test apparatus 100 provide electrical inspection signals to the plurality of semiconductor elements 10 accommodated in the test tray 20, and the semiconductor elements 10 It can be used to check the electrical performance of the semiconductor devices 10 by analyzing the output signals from.

The test apparatus 100 may include a test chamber 102 that provides a space for performing an electrical inspection process on the semiconductor elements 10. Although not shown, the test apparatus 100 transfers the semiconductor elements 10 from a customer tray (not shown) to the test tray 20, and moves the test tray 20 into the test chamber 102. And the test tray 20 is removed from the test chamber 102 after the inspection process is completed in the test chamber 102, and the semiconductor elements 10 accommodated in the test tray 20 are empty. It may include a plurality of transfer modules (not shown) transferred to the customer tray (not shown). In addition, a preheating chamber (not shown) for controlling the temperature of the semiconductor devices 10 in advance and a heat removal chamber (not shown) for recovering the temperature of the semiconductor devices 10 to room temperature may be included. The test chamber 102 may be disposed between the preheating chamber and the heat removing chamber.

The test apparatus 100 provides test signals to the semiconductor devices 10 and tests the electrical performance of the semiconductor devices 10 based on output signals from the semiconductor devices 10 It may include a module 110.

The test module 110 may include a test head 112 that provides the test signals and analyzes the output signals, and a base board 114 disposed on the test head 112. In this case, the base board 114 may be disposed in the test chamber 102 and may be connected to the test head 112 by connection cables or connectors.

The test apparatus 100 may include an interface module 120 for transferring the test signals and the output signals between the test head 112 and the semiconductor devices 10.

2 is a schematic plan view illustrating the interface module illustrated in FIG. 1, and FIG. 3 is a schematic enlarged cross-sectional view illustrating the interface module illustrated in FIG. 2.

2 and 3, the interface module 120 includes a plurality of socket boards 122 connected to the semiconductor devices 10 to transmit the test signals and the output signals, and the socket. It may include an interface board 124 on which the boards 122 are mounted, and temperature control pipes 130 through which a temperature control fluid for adjusting the temperature of the socket boards 122 is provided.

In addition, to face the interface module 120, for example, as shown in FIG. 3, the semiconductor elements 10 accommodated in the test tray 20 are inserted into the socket. A match plate 140 including a plurality of pushers 142 for connecting to the boards 122 may be disposed. The match plate 140 may be operated by a driver 144 as shown in FIG. 1, and the semiconductor elements 10 are connected to the socket boards 122. Can pressurize.

The test tray 20 may be provided between the interface module 120 and the match plate 140, and the test tray 20 includes a plurality of insert assemblies for accommodating the semiconductor devices 10 ( 30) may be provided. The insert assemblies 30 may have openings for accommodating the semiconductor devices 10, and although not shown in detail, a support film for supporting the semiconductor devices 10 ( Not shown) may be provided. The support film may be formed so that external connection terminals of the semiconductor devices 10, for example, solder balls, protrude downward, and guide holes for guiding the positions of the semiconductor devices 10 may be provided. .

Meanwhile, as shown, the base board 114, the interface module 120, and the match plate 140 are disposed in a horizontal direction, but the base board 114, the interface module 120, and the match The arrangement direction of the plate 140 can be variously changed. For example, the base board 114, the interface module 120, and the match plate 140 may be disposed in a vertical direction, and the base board 114 is disposed above the interface module 120 And the match plate 140 may be disposed under the interface module 120. Accordingly, the scope of the present invention will not be limited by the arrangement direction and order of the base board 114, the interface module 120, and the match plate 140.

Test sockets 126 for connection with the semiconductor devices 10 may be disposed on the socket boards 122. Although not shown in detail, the test sockets 126 may include contact terminals for connection with external connection terminals of the semiconductor devices 10. For example, pogo pins may be used as the contact terminals. However, since the contact terminals can be implemented in various forms, the scope of the present invention will not be limited by the configuration of the contact terminals.

Under the socket boards 122, power supply elements for inspection of the semiconductor elements 10 and passive elements such as resistors, capacitors, amplifiers, etc. for analog/digital conversion of the inspection signals and output signals Can be mounted.

The interface board 124 may have openings exposing the socket boards 122 downward as shown, and the socket boards 122 may be connected to the base board 114 through the openings. I can. For example, the socket boards 122 may be electrically connected to the base board 114 by a plurality of male and female connectors 116 and 128.

The temperature of the socket boards 122 may be increased by the power supply elements and passive elements, and the temperature control pipes 130 may be used to adjust the temperature of the socket boards 122. have. For example, when a high-temperature process is performed on the semiconductor devices 10, the socket boards 122 are heated so that the temperature of the semiconductor devices 10 easily rises to an inspection temperature required for the high-temperature process. And maintained, and when performing a low-temperature process, the temperature of the semiconductor devices 10 can be easily lowered and maintained to an inspection temperature required for the low-temperature process.

According to an embodiment of the present invention, the temperature control pipes 130 may be disposed parallel to each other as shown in FIG. 2, and both ends of the temperature control pipes 130 contain the temperature control fluid. It may be connected to the supply pipe 132 and the recovery pipe 134 for supply and recovery. In addition, as shown, the temperature control pipes 130 are disposed on the socket boards 122 between the test sockets 126, but differently, the temperature control pipes 130 It may be disposed between the socket boards 122. However, the arrangement method of the temperature control pipes 130 may be variously changed, and the scope of the present invention will not be limited by the arrangement of the temperature control pipes 130 as shown.

The temperature control fluid for adjusting the temperature of the socket boards 122 may be provided to the temperature control pipes 130. A liquid or gaseous heat transfer medium may be used as the temperature control fluid. The temperature control pipes 130 may be connected to a temperature control module 150, and the temperature control module 150 includes a heater for heating the temperature control fluid and a cooler for cooling the temperature control fluid. I can.

According to an embodiment of the present invention, air may be used as the temperature control fluid. In this case, although not shown, the air is supplied to the temperature control pipes 130 in a space adjacent to the socket boards 122, that is, the A plurality of injection holes for injecting the air into the test chamber 102 may be provided. For example, the injection holes may inject the air laterally toward the socket boards 122. Further, although not shown, the interface module 120 may include a temperature sensor (not shown) for measuring the temperature of the socket boards 122, and the flow rate and temperature of the temperature control fluid are the temperature It may be adjusted according to the temperature of the socket boards 122 measured by a sensor. For example, the temperature sensor may be mounted on the interface board 124 to contact one of the socket boards 122, or may be directly mounted on one of the socket boards 122. In addition, a non-contact temperature sensor may be used, and in this case, the location of the temperature sensor may be variously changed.

In addition, according to an embodiment of the present invention, the test apparatus 100 is disposed at the edge portions of the test chamber 102 as shown in FIG. 2 to transmit a temperature control gas into the test chamber 102. It may include a plurality of spray nozzles 160 to spray. The temperature control gas may be used to control the temperature inside the test chamber 102, and in particular, may be used to facilitate temperature control of the socket boards 122.

As an example, air may be used as the temperature control gas. In particular, when air is used as the temperature control gas, the test chamber 102 may be provided with at least one outlet for discharging the injected temperature control gas to the outside. In addition, in order to further improve the temperature control effect of the socket boards 122 by the air, the pushers 142 and the insert assemblies 30 may be provided with a plurality of holes for passing the air. have.

As described above, when air is used as the temperature control fluid and the temperature control gas, the air preferably has a dew point lower than the test temperature required for the low temperature process of the semiconductor devices 10. This is to prevent condensation from being generated by the air injected inside the test chamber 102. In addition, when air is used as the temperature control fluid and the temperature control gas, the injection nozzles 160 may be connected to the temperature control module 150.

Unlike the above, when an inert gas such as nitrogen is used as the temperature control fluid and/or the temperature control gas, the outlet of the test chamber 102 includes a separate recovery pipe (not shown) for recovering the inert gas. Can be connected.

According to the embodiments of the present invention as described above, the test apparatus 100 for inspecting the electrical characteristics of the semiconductor elements 10 includes a test module 110 for inspecting the semiconductor elements 10 and the An interface module 120 for connection between the semiconductor devices 10 and the test module 110 may be included. The interface module 120 is disposed adjacent to the plurality of socket boards 122 and the socket boards 122 for connection with the semiconductor devices 10 to control the temperature of the socket boards 122. It may include a plurality of temperature control pipes 130 for adjustment. In addition, temperature control gas for temperature control of the socket boards 122 may be injected into the test chamber 102 in which the inspection process of the semiconductor devices 10 is performed.

As described above, the temperature of the socket boards 122 can be easily adjusted to a desired level by using the temperature control pipes 130 and the temperature control gas, through which the temperature of the semiconductor elements 10 It can be easily raised or lowered to the test temperature, and can be kept constant at the test temperature. As a result, the reliability of the semiconductor devices 10 can be greatly improved in the electrical characteristics inspection.

Although the above has been described with reference to the preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention described in the following claims. You will understand that there is.

10: semiconductor element 20: test tray
30: insert assembly 100: test device
102: test chamber 110: test module
112: test head 114: base board
120: interface module 122: socket board
124: interface board 126: test socket
130: temperature control pipe 132: supply pipe
134: recovery pipe 140: match plate
142: pusher 150: temperature control module
160: spray nozzle

Claims (17)

delete delete delete delete delete A test chamber providing a space for electrically inspecting the semiconductor devices accommodated in the test tray;
A test module that provides inspection signals for inspecting the semiconductor elements and inspects the semiconductor elements based on output signals from the semiconductor elements;
And an interface module for transferring the test signals and output signals between the test module and the semiconductor devices,
The interface module,
A test socket connected to the semiconductor devices is mounted on the upper side, and a plurality of socket boards on which a power supply device and a passive device for signal conversion are mounted are mounted on the bottom,
An interface board on which the socket boards are mounted,
And temperature control pipes disposed between the socket boards or on the socket boards, and providing a temperature control fluid for adjusting the temperature of the socket boards raised by the power supply element and the passive element. Semiconductor device testing device The semiconductor device test according to claim 6, wherein the temperature control pipes are arranged parallel to each other, and both ends of the temperature control pipes are connected to a supply pipe and a recovery pipe for supplying and recovering the temperature control fluid. Device. The semiconductor device testing apparatus of claim 6, wherein when air is used as the temperature control fluid, the temperature control pipe includes a plurality of injection holes for injecting the air into the test chamber. 9. The apparatus of claim 8, wherein the air is injected toward the socket boards. The semiconductor device testing apparatus of claim 6, wherein test sockets for connection with the semiconductor devices are disposed on the socket boards. The apparatus of claim 6, wherein the test module comprises a base board connected to the socket boards through a plurality of connectors in the test chamber. The semiconductor device testing apparatus of claim 6, further comprising a temperature sensor for measuring the temperature of the socket boards. The semiconductor device testing apparatus of claim 6, further comprising a plurality of spray nozzles disposed at edges of the test chamber and spraying a temperature control gas into the test chamber. 14. The semiconductor device testing apparatus of claim 13, wherein the test chamber is provided with at least one outlet for discharging the injected temperature control gas to the outside of the test chamber. 14. The semiconductor device testing apparatus according to claim 13, wherein air is used as the temperature control gas. The method of claim 13, further comprising a match plate disposed in the test chamber and provided with a plurality of pushers for closely contacting the semiconductor elements with the socket boards,
The semiconductor device testing apparatus, wherein the pushers are provided with a plurality of holes for passing the temperature control gas. The method of claim 13, wherein the test tray is equipped with insert assemblies to accommodate the semiconductor devices,
A semiconductor device testing apparatus, characterized in that the insert assemblies are provided with a plurality of holes for passing the temperature control gas.

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