Nothing Special   »   [go: up one dir, main page]

KR102077867B1 - 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 - Google Patents

열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 Download PDF

Info

Publication number
KR102077867B1
KR102077867B1 KR1020130104793A KR20130104793A KR102077867B1 KR 102077867 B1 KR102077867 B1 KR 102077867B1 KR 1020130104793 A KR1020130104793 A KR 1020130104793A KR 20130104793 A KR20130104793 A KR 20130104793A KR 102077867 B1 KR102077867 B1 KR 102077867B1
Authority
KR
South Korea
Prior art keywords
resin composition
epoxy resin
printed wiring
insulating layer
mass
Prior art date
Application number
KR1020130104793A
Other languages
English (en)
Korean (ko)
Other versions
KR20140031136A (ko
Inventor
겐지 가와이
유키 야마모토
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50607323&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR102077867(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20140031136A publication Critical patent/KR20140031136A/ko
Application granted granted Critical
Publication of KR102077867B1 publication Critical patent/KR102077867B1/ko

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Epoxy Resins (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
KR1020130104793A 2012-09-03 2013-09-02 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판 KR102077867B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-193114 2012-09-03
JP2012193114A JP6205692B2 (ja) 2012-09-03 2012-09-03 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板

Publications (2)

Publication Number Publication Date
KR20140031136A KR20140031136A (ko) 2014-03-12
KR102077867B1 true KR102077867B1 (ko) 2020-02-14

Family

ID=50607323

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130104793A KR102077867B1 (ko) 2012-09-03 2013-09-02 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판

Country Status (3)

Country Link
JP (1) JP6205692B2 (ja)
KR (1) KR102077867B1 (ja)
TW (3) TWI836345B (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5624184B1 (ja) * 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP6398283B2 (ja) * 2014-04-18 2018-10-03 味の素株式会社 樹脂組成物
JP6503633B2 (ja) * 2014-04-24 2019-04-24 味の素株式会社 回路基板の製造方法
JP6844311B2 (ja) * 2016-03-28 2021-03-17 味の素株式会社 樹脂組成物
JP7114214B2 (ja) * 2016-05-24 2022-08-08 味の素株式会社 接着フィルム
JP7418941B2 (ja) * 2016-08-19 2024-01-22 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP6776749B2 (ja) 2016-09-12 2020-10-28 味の素株式会社 樹脂組成物
JP7258453B2 (ja) * 2017-03-31 2023-04-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP7119290B2 (ja) * 2017-05-30 2022-08-17 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置
JP6988588B2 (ja) 2018-03-08 2022-01-05 味の素株式会社 樹脂組成物、シート状積層材料、プリント配線板及び半導体装置
JP6627944B2 (ja) * 2018-10-09 2020-01-08 味の素株式会社 回路基板の製造方法
WO2020116512A1 (ja) * 2018-12-04 2020-06-11 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、樹脂付き銅箔、硬化物、および電子部品
JP2023063949A (ja) 2021-10-25 2023-05-10 味の素株式会社 樹脂組成物
KR20240050687A (ko) * 2022-10-12 2024-04-19 한국전기연구원 열가소성 고분자를 포함하는 절연체 조성물

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063256A (ja) * 2004-08-30 2006-03-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びこれを用いた積層板
JP2012012534A (ja) * 2010-07-02 2012-01-19 Dic Corp 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0782348A (ja) 1993-07-22 1995-03-28 Hitachi Chem Co Ltd エポキシ樹脂組成物及びその硬化物
JPH10275983A (ja) * 1997-03-31 1998-10-13 Ibiden Co Ltd 多層プリント配線板
JP4058672B2 (ja) * 2002-02-28 2008-03-12 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
JP2004210936A (ja) * 2002-12-27 2004-07-29 Tdk Corp プリプレグ、シート状樹脂硬化物及び積層体
JP4983228B2 (ja) * 2005-11-29 2012-07-25 味の素株式会社 多層プリント配線板の絶縁層用樹脂組成物
JP2009040919A (ja) * 2007-08-09 2009-02-26 Sekisui Chem Co Ltd 熱硬化性樹脂組成物、及びこれを用いてなる樹脂フィルム、積層板、プリプレグ
WO2010013741A1 (ja) * 2008-07-31 2010-02-04 積水化学工業株式会社 エポキシ樹脂組成物、プリプレグ、硬化体、シート状成形体、積層板及び多層積層板
JP5396805B2 (ja) 2008-10-07 2014-01-22 味の素株式会社 エポキシ樹脂組成物
TWI621638B (zh) * 2008-11-28 2018-04-21 味之素股份有限公司 Resin composition
TWI494364B (zh) * 2009-01-30 2015-08-01 Ajinomoto Kk Resin composition
TWI506082B (zh) * 2009-11-26 2015-11-01 Ajinomoto Kk Epoxy resin composition
JP5408046B2 (ja) * 2010-06-10 2014-02-05 味の素株式会社 樹脂組成物
US8669333B2 (en) * 2010-07-02 2014-03-11 Dic Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
JP6308713B2 (ja) * 2012-08-07 2018-04-11 味の素株式会社 樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006063256A (ja) * 2004-08-30 2006-03-09 Dainippon Ink & Chem Inc エポキシ樹脂組成物及びこれを用いた積層板
JP2012012534A (ja) * 2010-07-02 2012-01-19 Dic Corp 熱硬化性樹脂組成物、その硬化物、活性エステル樹脂、半導体封止材料、プリプレグ、回路基板、及びビルドアップフィルム

Also Published As

Publication number Publication date
TWI756552B (zh) 2022-03-01
TW201942246A (zh) 2019-11-01
TW201418358A (zh) 2014-05-16
JP2014047318A (ja) 2014-03-17
TWI677528B (zh) 2019-11-21
TWI836345B (zh) 2024-03-21
TW202222889A (zh) 2022-06-16
JP6205692B2 (ja) 2017-10-04
KR20140031136A (ko) 2014-03-12

Similar Documents

Publication Publication Date Title
KR102077867B1 (ko) 열경화성 에폭시 수지 조성물, 절연층 형성용 접착 필름 및 다층 프린트 배선판
JP6572983B2 (ja) エポキシ樹脂組成物
JP5651941B2 (ja) エポキシ樹脂組成物
TWI410442B (zh) A resin composition for an insulating layer of a multilayer printed circuit board
JP5396805B2 (ja) エポキシ樹脂組成物
JP4983228B2 (ja) 多層プリント配線板の絶縁層用樹脂組成物
JP5573869B2 (ja) 多層プリント配線板の層間絶縁層用樹脂組成物
JP6500284B2 (ja) 印刷回路基板用樹脂組成物、これを用いた樹脂ワニス、接着フィルム、プリプレグ及びプリント配線板
KR102077863B1 (ko) 수지 조성물
KR102128231B1 (ko) 경화성 수지 조성물
JP2013234328A (ja) エポキシ樹脂組成物
KR20130138688A (ko) 수지 조성물
WO2007097209A1 (ja) エポキシ樹脂組成物
KR20140027493A (ko) 프리프레그, 적층판, 반도체 패키지 및 적층판의 제조 방법
KR102126657B1 (ko) 경화성 수지 조성물
KR102078523B1 (ko) 수지 조성물
JP6915639B2 (ja) 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP6763788B2 (ja) 熱硬化性エポキシ樹脂組成物、絶縁層形成用接着フィルム及び多層プリント配線板
JP2015086293A (ja) プリプレグ及び多層プリント配線板
JP2014009356A (ja) エポキシ樹脂組成物、これから製造された絶縁フィルム、及びこれを備えた多層プリント基板

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant