KR101976730B1 - Test socket module for semiconductor package - Google Patents

Abstract

The present invention provides a socket module for testing a semiconductor package, which comprises: an upper socket electrically connected to a semiconductor package; a current carrying substrate having a laminated body including an insulating layer laminated in a plurality of layers and a current carrying rod penetrating to be installed on the laminated body and electrically connected to the upper socket; a guide plate having a first coupling region to which the current carrying substrate is coupled and a second coupling region to which an installation object is coupled; and a lower socket disposed in a low side of the current carrying rod and electrically connected to the semiconductor package through the upper socket and the current carrying rod.

Description

TEST SOCKET MODULE FOR SEMICONDUCTOR PACKAGE [0001]

The present invention relates to a socket module for testing semiconductor packages.

In general, a semiconductor package completed by a manufacturing process is checked if the operating characteristics are properly implemented through a test (inspection) process, and then shipped when it is classified as a good product.

In this inspection process, the semiconductor package to be inspected is not directly connected to the test board, but is connected to the test board through a component called a socket module.

To this end, the socket module should have a structure to facilitate the electrical connection between the semiconductor package and the test board. Furthermore, the socket module must have a structure suitable for being mechanically installed on the test board. In order to make the structure, a cutting process is required to cut off the main parts of the socket module to be removed.

It is an object of the present invention to provide a socket module which is capable of eliminating the cutting process during manufacturing process of major parts of a socket module and thus manufacturing a corresponding part at a lower cost, And a socket module for package testing.

According to an aspect of the present invention, there is provided a socket module for testing a semiconductor package, comprising: an upper socket electrically connected to a semiconductor package; A laminated body including an insulating layer laminated in a plurality of layers; and a current carrying rod penetrating the laminated body and electrically connected to the upper socket; A guide plate having a first engagement region to which the conductive substrate is coupled and a second engagement region to which the installation object is coupled; And a lower socket disposed below the energizing rod and electrically connected to the semiconductor package through the upper socket and the energizing rod.

Here, the conductive substrate may be fitted to the first coupling region.

Here, the first coupling region may include a hollow insertion hole into which the conductive substrate is inserted.

The guide plate may further include a press-fit protrusion protruding from an inner circumferential surface of the hollow insertion hole, and the conductive substrate may further include a press-fit groove formed on an outer periphery of the laminated body to receive the press-fit protrusion.

The guide plate may further include a restriction jaw protruding from the inner circumferential surface of the hollow insertion hole, and the energizing substrate may further include an engaging jaw protruding from the laminated body and disposed to engage with the limiting jaw .

Here, the second engagement region may have a lower height than the stacked body.

The guide plate may further include a fixing pin integrally protruding from the second coupling region to be inserted into the mounting object.

According to another aspect of the present invention, there is provided a socket module for testing a semiconductor package, comprising: a body made of an insulating material; a conductive rod disposed through the body and having a lower end electrically connected to upper and lower sockets electrically connected to the upper socket; A conductive substrate; And a guide plate formed separately from the energizing substrate and coupled to the energizing substrate, the guide plate being formed of a different material from the body.

Here, the guide plate may include a hollow insertion hole into which the conductive substrate is inserted.

The guide plate may further include a press-fit protrusion protruding from an inner circumferential surface of the hollow insertion hole, and the conductive substrate may further include a press-fit groove formed on an outer periphery of the laminated body to receive the press-fit protrusion.

According to the socket module for testing a semiconductor package according to the present invention configured as described above, the current-carrying substrate and the guide plate are separately fabricated by assembling the current-collecting board and the guide plate, unlike the conventional method of cutting a part of a rectangular parallelepiped- You can complete the socket module.

Thereby, since the cutting process is eliminated, it is possible to improve the fact that a large processing cost is required for the cutting process. As a result, the manufacturing cost of the socket module can be drastically reduced, and the manufacturing process time can be shortened.

1 is an assembled perspective view of a socket module 100 for testing a semiconductor package according to an embodiment of the present invention.
2 is an exploded perspective view of the socket module 100 for testing the semiconductor package of FIG.
3 is an exploded perspective view of the conductive plate 130 and the guide plate 150 of FIG.
FIG. 4 is a cross-sectional view of the connection state of the conductive plate 130 and the guide plate 150 according to the line (IV-IV) of FIG.

Hereinafter, a socket module for testing a semiconductor package according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the present specification, the same or similar reference numerals are given to different embodiments in the same or similar configurations.

FIG. 1 is an assembled perspective view of a socket module 100 for testing a semiconductor package according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the socket module 100 for testing the semiconductor package of FIG.

Referring to these figures, the semiconductor package test socket module 100 may include an upper socket 110, a conductive substrate 130, a guide plate 150, and a lower socket 170. The socket module 100 for testing a semiconductor package may be configured as an assembly of the energizing substrate 130 and the guide plate 150. [

The upper socket 110 is formed to have a larger area than the semiconductor package to support the semiconductor package (not shown). The upper socket 110 is configured to mediate an electrical connection between the semiconductor package and the conductive substrate 130.

Specifically, the upper socket 110 may have a base 111, a conductive pad 113, and a reference hole 115. The base 111 is a generally rectangular plate. The base 111 is formed of a BT-resin material and can be elastically deformed. The conductive pad 113 may be a conductive material, for example, a conductive material embedded on a base material made of rubber. The conductive pillars may be provided in a plurality corresponding to the terminals of the semiconductor package. The reference hole 115 is an open portion of the base 111. The reference hole 115 provides a space into which alignment pins (not shown) for alignment between the upper socket 110, the energizing substrate 130, and the lower socket 170 are inserted.

The conductive substrate 130 is an object on which the upper socket 110 is seated. The current-carrying substrate 130 may have a body 131. The body 131 is a generally rectangular plate. The body 131 may be formed by stacking a plurality of insulating layers 131a (FIG. 3) by a PCB process. In this case, the body 131 is also referred to as a laminated body. Thereby, the laminated body 131 can have a hard material property compared to the upper socket 110 or the lower socket 170. [

The energizing rod 133 may be provided so as to penetrate the laminated body 131 in the vertical direction. The plurality of energizing rods 133 may be regularly arranged in correspondence with the conductive columns of the conductive pads 113 of the upper socket 110. The upper end 133a of the energizing rod 133 is exposed on the upper surface of the laminated body 131 and is electrically connected to the conductive pad 113. [ Similarly, a lower end (not shown) of the energizing rod 133 is exposed to the lower surface of the laminated body 131 and electrically connected to the electrode 173 of the lower socket 170. The reference hole 139 opened through the laminated body 131 is positioned corresponding to the reference hole 115 of the upper socket 110 described above.

The guide plate 150 is configured to be a target to which the current-carrying substrate 130 is coupled. The guide plate 150 may be formed separately from the conductive substrate 130 and may have a different material. Specifically, if the laminated body 131 of the conductive substrate 130 is formed by a PCB manufacturing process using a PCB manufacturing material, the guide plate 150 may be injection molded with a plastic resin.

The guide plate 150 may be divided into a first engaging region 151 and a second engaging region 156. If the first coupling region 151 is substantially the center portion of the guide plate 150, the second coupling region 156 may be a peripheral portion where the first coupling region 151 is located on both sides. At this time, the second coupling region 156 has a height lower than the height of the laminated body 131. Thereby, the second coupling region 156 and the laminated body 131 have a step difference from each other to form a stepped structure.

The conductive substrate 130 is coupled to the first coupling region 151 and the mounting object (not shown) is coupled to the second coupling region 156. The mounting object may be a socket guide (not shown) arranged to enclose the second engagement area 156 to secure the socket module 100 placed on a test board (not shown). In order to engage with the socket guide, a securing pin 157 inserted into the socket guide may integrally protrude from the second engaging area 156 in the second engaging area 156.

The lower socket 170 is disposed below the energizing board 130 to electrically connect the energizing rod 133 and the test board. To this end, the lower socket 170 may have a base 171 and an electrode 173, and a reference hole 175. The base 171 may be configured to be substantially similar to the base 111 of the upper upper socket 110. A plurality of electrodes 173 may be provided on the base 171 in correspondence with the energizing rod 133. The electrode 173 can be electrically connected to the semiconductor package through the conductive rod 113 of the conductive substrate 130 and the conductive pad 113 of the upper socket 110. [ The reference hole 175 may be formed corresponding to the reference hole 139 of the laminated body 131.

Bonding may be used for the connection of the upper socket 110 and the current-carrying board 130, or for the connection of the lower socket 170 and the current-carrying board 130. Concretely, an adhesive may be applied between the bases 111 and 171 and the laminated body 131 in a state where the alignment pins for aligning them are sandwiched in the respective reference holes 115, 139 and 175, have.

In this configuration, the current-carrying substrate 130 and the guide plate 150 to which the current-carrying substrate 130 is mounted are independently manufactured and coupled to each other. The guide plate 150 may have characteristics different from those of the current-carrying board 130 when the current-carrying board 130 is to be coupled and the socket guide is an object to which the guide plate 150 is coupled . Specifically, the guide plate 150 has a lower height than the conductive substrate 130, so that the socket guide can be prevented from interfering with a carrier (not shown) containing the semiconductor package.

Here, since the guide plate 150, which should be different from the current-carrying substrate 130, is not formed as a single member with the current-carrying substrate 130, it is not necessary to cut the peripheral portion of the current-carrying substrate 130 You do not have to. It is only necessary to connect the energizing substrate 130 and the guide plate 150, which are manufactured separately according to respective required structures and functions, to each other. Thereby, it is possible to prevent a high machining cost that has been caused by cutting the peripheral portion of the conductive substrate 130 to match the shape of the guide plate 150. Further, it is possible to save the time required for the cutting process.

The coupling structure between the conductive substrate 130 and the guide plate 150 will be described with reference to FIGS. 3 and 4. FIG.

FIG. 3 is an exploded perspective view of the conductive plate 130 and the guide plate 150 of FIG. 2, and FIG. 4 is an exploded perspective view of the connection of the conductive plate 130 and the guide plate 150 according to the line (IV- Fig.

Referring to these drawings, the conductive substrate 130 may be fitted into the first coupling region 151 of the guide plate 150. Specifically, the first coupling region 151 of the guide plate 150 is formed in the hollow insertion hole 152, and the conductive substrate 130 is inserted into the hollow insertion hole 152. Here, the size of the hollow insertion hole 152 is determined corresponding to the energizing substrate 130 in a substantially rectangular shape.

The engaging protrusion 153 may be formed on the guide plate 150 and the press-fit groove 135 may be formed on the energizing substrate 130 to secure the connection between the energizing substrate 130 and the guide plate 150. The press-in projection 153 protrudes from the inner circumferential surface of the hollow insertion hole 152 and may be formed on each of the pair of opposite inner circumferential surfaces of the hollow insertion hole 152. The indentation protrusion 153 may have a generally semicircular cross section. The press-fit groove 135 is formed to receive the press-fit projection 153 in the laminated body 131 of the current-carrying substrate 130. The press-fit groove 135 may be formed to penetrate from the upper surface to the lower surface of the laminated body 131, and may also have a semicircular cross section corresponding to the press-fit protrusion 153.

The guide plate 150 has the limiting jaws 155 and the energizing substrate 130 is fixed to the engaging jaws 150 so that the energizing substrate 130 does not separate from the guide plate 150 in the direction D away from the test board. 137). The restricting jaw 155 protrudes from the inner circumferential surface of the hollow insertion hole 152 and may have a thickness smaller than that of the press-in protrusion 153. The restricting jaw 155 can be located between the pair of indentation protrusions 153. The engaging jaws 137 are formed on the laminated body 131 in correspondence with the limiting jaws 155 and may have a thickness smaller than that of the press-fit grooves 135. The engaging jaw 137 can be positioned between the pair of press-fit grooves 135. [

According to this configuration, the conductive substrate 130 is inserted and joined to the hollow insertion hole 152 of the guide plate 150 along a specific direction D. Concretely, the press-fit groove 135 of the energizing substrate 130 is fitted in correspondence with the press-in protrusion 153 of the guide plate 150. At this time, the engaging step 137 of the energizing substrate 130 corresponds to the limit jaw 155 of the guide plate 150, and the energizing substrate 130 protrudes beyond the guide plate 150 along the specific direction D .

The socket module for testing a semiconductor package as described above is not limited to the configuration and operation of the embodiments described above. The embodiments may be configured so that all or some of the embodiments may be selectively combined so that various modifications may be made.

100: Socket module for semiconductor package test 110: Upper socket
130: energizing substrate 131: laminated body
133: energizing rod 135: press-fit groove
137: engaging jaw 150: guide plate
151: first coupling region 152: hollow insertion hole
153: press-in projection 156: second engagement area
170: Lower socket

Claims (10)

An upper socket electrically connected to the semiconductor package;
A laminated body including an insulating layer laminated in a plurality of layers; and a current carrying rod penetrating the laminated body and electrically connected to the upper socket;
A guide plate having a first engagement region having a hollow insertion hole into which the conductive substrate is fitted, a second engagement region in which the installation object is engaged, and a restriction jaw protruding from the inner circumferential surface of the hollow insertion hole; And
And a lower socket disposed below the energizing rod and electrically connected to the semiconductor package through the upper socket and the energizing rod,
Wherein the energizing substrate further comprises an engaging jaw which is protruded from the laminated body and arranged to engage with the limiting jaw.
delete delete The method according to claim 1,
Wherein the guide plate comprises:
Further comprising a press-fit projection projecting from an inner circumferential surface of the hollow insertion hole,
The current-
And a press-fit groove formed on an outer periphery of the laminated body so as to receive the press-fit projection.
delete The method according to claim 1,
Wherein the second coupling region comprises:
And has a lower height than the stacked body.
The method according to claim 1,
Wherein the guide plate comprises:
Further comprising a fixing pin integrally projecting from the second engagement region so as to be inserted into the mounting object.
An energizing substrate having a body made of an insulating material and having a lower end electrically connected to upper and lower sockets which are arranged to penetrate the body and are electrically connected to upper sockets; And
And a guide plate having a hollow insertion hole into which the conductive substrate is fitted and a press-in projection protruding from an inner circumferential surface of the hollow insertion hole, the guide plate being formed separately from the conductive substrate,
Wherein the conductive substrate further comprises a press-fit groove formed on the outer periphery of the body so as to receive the press-fit projection. delete delete

Images