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KR101881376B1 - An dressing apparatus - Google Patents

An dressing apparatus Download PDF

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Publication number
KR101881376B1
KR101881376B1 KR1020160000966A KR20160000966A KR101881376B1 KR 101881376 B1 KR101881376 B1 KR 101881376B1 KR 1020160000966 A KR1020160000966 A KR 1020160000966A KR 20160000966 A KR20160000966 A KR 20160000966A KR 101881376 B1 KR101881376 B1 KR 101881376B1
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KR
South Korea
Prior art keywords
dressing
connection
support portion
polishing
support
Prior art date
Application number
KR1020160000966A
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Korean (ko)
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KR20170081928A (en
Inventor
진영일
Original Assignee
에스케이실트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to KR1020160000966A priority Critical patent/KR101881376B1/en
Publication of KR20170081928A publication Critical patent/KR20170081928A/en
Application granted granted Critical
Publication of KR101881376B1 publication Critical patent/KR101881376B1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/095—Cooling or lubricating during dressing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

An embodiment includes a body having a hollow and having a gear formed on an outer circumferential surface thereof, a dressing portion spaced from an inner circumferential surface of the body, disposed in the hollow, and a connecting portion connecting the dressing portion and the body, The rotational force or the frictional force of the body and the dressing portion is reduced.

Description

Dressing device {AN DRESSING APPARATUS}

An embodiment relates to a dressing apparatus of a wafer polishing apparatus.

Generally, a pad (PAD) and a slurry are used for the wafer polishing process, and the distribution of the abrasive particles over the pad may be one of the important factors determining the quality of the polishing. The fibrous or small pores located on the pad can support the abrasive particles because they provide sufficient frictional force to inhibit abrasive particles from falling off due to centrifugal forces.

For the desired polishing quality it is necessary to manage the pad top surface. For example, it is necessary to keep the upper surface of the pad flexible, to keep the fibers upright, and to ensure that there are abundant open pores.

A device for combing or cutting a pad surface to maintain the surface of the pad in this state is called a pad dressing device.

The embodiment provides a dressing apparatus capable of dressing a desired area of an anticipatory half or a lower half.

A dressing apparatus according to an embodiment includes a body having a hollow and having a gear formed on an outer circumferential surface thereof; A dressing portion spaced from an inner circumferential surface of the body and disposed in the hollow; And a connection portion connecting the dressing portion and the body, wherein the connection portion reduces a rotational force or a frictional force between the body and the dressing portion when the body rotates.

The connection portion includes a first end connected to the dressing portion; A second end connected to an inner circumferential surface of the body; And a bearing disposed between the first end and the second end.

The connection portion being disposed in the hollow portion, the supporting portion being engaged with the dressing portion; And a bearing disposed between the support portion and the inner circumferential surface of the body.

The support may be in the form of a line or a rod aligned with a reference line, and the reference line may be a straight line passing through two points of the inner circumferential surface of the body facing each other and a hollow center of the body.

The dressing portion is detachable to the support portion, and the dressing portion can be coupled to the support portion at a different bonding position.

A first connecting part having a ring shape and having one end connected to an inner circumferential surface of the body; A ring-shaped second connection portion located inside the first connection portion and surrounding the other end of the first connection portion; A bearing ball disposed between the first connection portion and the second connection portion; And a support portion coupled to the first points of the inner circumferential surface of the second connection portion facing each other and coupled with the dressing portion.

Or the connection part has a ring-shaped first connection part, one end of which is connected to the inner circumferential surface of the body; And a ring-shaped second connection portion located inside the first connection portion and surrounding the other end of the first connection portion; And a support portion coupled to the dressing portion, wherein the first connection portion and the second connection portion are formed of a magnetic material having the same polarity.

The dressing portion may be divided into a first dressing block disposed on the upper surface of the support portion and a second dressing block disposed on the lower surface of the support portion.

The polishing apparatus according to any one of claims 1 to 3, wherein the polishing surface of each of the first and second dressing blocks is provided with a groove, and the supporting portion may include a plurality of engaging grooves spaced from each other, the dressing portion being inserted into a groove provided in the polishing surface, And may further include a coupling hole for coupling with any one of the coupling grooves.

The dressing apparatus may further include at least one auxiliary connection unit connecting the body and the dressing block.

The other end of the first connection portion may have a protrusion protruding in the vertical direction, and the second connection portion may surround the protrusion of the first connection portion.

The first dressing block includes a first seating portion on which the upper end of the support portion is seated and a second seating portion on the opposite side of the polishing surface of the second dressing block on which the lower end portion of the support portion is seated. And the opposite surface of the polishing surface of the first dressing block and the surface opposite to the polishing surface of the second dressing block may be in contact with each other.

The embodiment can control the area to be dressed in the half or half of the supposition by dressing the desired area of the supposition half or the bottom half.

1 is a perspective view of a pad dressing apparatus according to an embodiment.
2 is a plan view of the pad dressing apparatus shown in Fig.
Fig. 3 shows a sectional view of the pad dressing apparatus shown in Fig. 2 in the AB direction.
4 is a sectional view of the dressing portion in the CD direction.
5 shows a cross-sectional view of a dressing apparatus according to another embodiment.
6 shows a top view of a dressing apparatus according to another embodiment.
Fig. 7 shows a perspective view of a wafer polishing apparatus including a dressing apparatus according to an embodiment.
8 shows the movement trajectory of the dressing apparatus during the dressing process.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure may be referred to as being "on" or "under" a substrate, each layer It is to be understood that the terms " on "and " under" include both " directly "or" indirectly " do. In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings. The same reference numerals denote the same elements throughout the description of the drawings.

FIG. 1 is a perspective view of a pad dressing apparatus 100 according to an embodiment. FIG. 2 is a plan view of the pad dressing apparatus 100 shown in FIG. 1, and FIG. 3 is a plan view of the pad dressing apparatus 100 , And Fig. 4 shows a sectional view of the dressing portion in the CD direction.

Referring to FIGS. 1 to 4, the pad dressing apparatus 100 includes a body 110, a dressing portion 120, and a connection portion 130.

The body 110 may be in the form of a ring in the form of a closed loop having a hollow 111 and a gear 101 may be provided on the outer circumferential surface (or the outer surface).

The gear 101 is positioned at a predetermined position on the sun gear sun of the polishing apparatus 400 when the pad dressing apparatus 100 is placed on the lower stage 410 (see FIG. 4) of the polishing apparatus 400 the body 110 can be engaged with the internal gear 414 of the wine gear 412 by rotation of the sun gear 412 and the internal gear 414, Direction.

The body 110 can rotate clockwise or counterclockwise by rotation of the sun gear 412 and the internal gear 414 and rotate around the sun gear 412 on the lower stage 410 .

The body 110 may be made of a material such as metal (e.g., stainless steel, or ceramic).

The dressing portion 120 may be disposed in the hollow 111 of the body 110 and serves to dress the polishing pad 401 (see FIG. 4) of the wafer polishing apparatus. The dressing portion 120 includes a body 110 But it is not limited thereto.

For example, the dressing portion 120 may include at least one dressing segment, the dressing segment may include a plurality of fine grooves, and cutting particles received in the fine grooves, wherein the cutting particles have a high hardness , Such as diamond or cubic boron nitride.

The connection part 130 is disposed in the hollow of the body 110 and is coupled to the dressing part 120 and connects the dressing part 120 and the body 110 to each other.

The connection part 130 reduces the rotational force or the frictional force of the body 110 transmitted to the dressing part 120 when the body 110 rotates. Therefore, even if the body 110 rotates clockwise or counterclockwise, the dressing part 120 does not rotate together with the body 110 by the connection part 130.

The connection portion 130 includes a first end portion 132 connected to the dressing portion 120, a second end portion 134 connected to the inner circumferential surface of the body 110, and a first end portion 132 and a second end portion 134, As shown in FIG.

For example, the connection portion 130 includes a support portion 132 disposed in the hollow 111 and engaged with the dressing portion 120, and a bearing 136 disposed between the support portion 132 and the inner peripheral surface of the body 110 can do.

The bearing 136 has a ring-shaped first connection portion 136a having one end connected to the inner circumferential surface of the body 110 and a ring-shaped member 136 disposed inside the first connection portion 136a and surrounding the other end of the first connection portion 136a. 2 connecting portion 136b and a bearing ball 136c disposed between the first connecting portion 136a and the second connecting portion 136b.

The other end of the first connection portion 136a may have protrusions 136a1 and 136a2 protruding in the vertical direction. For example, the other end of the first connection portion 136a may have a first protrusion 136a1 protruding upward and a second protrusion 136a2 protruding downward. The first protrusion 136a1 and the second protrusion 136a1 136a2 may face each other.

The second connection portion 136b may surround the protrusions 136a1 and 136a2 of the first connection portion 136a and the bearing ball 136c may protrude from the protrusions 136a1 and 136a2 of the first connection portion 136a, (136b).

The bearing ball 136c can reduce the frictional force between the first connecting portion 136a and the second connecting portion 136b and the frictional force between the first connecting portion 136a and the second connecting portion 136b becomes smaller, Even if the body 110 connected to the connection portion 136a rotates, the dressing portion 120 connected to the second connection portion 136b hardly rotates.

For example, pressure is applied to the dressing apparatus 100 by the load of the polishing pad polishing step of the polishing pad 420. Even if a small frictional force is applied between the first connecting portion and the second connecting portion, The dressing portion 120 does not rotate or rotate.

The support portion 132 is disposed in the hollow 111 of the body 110 and can couple two different first points on the inner circumferential surface of the second connection portion 136b and is coupled to the dressing portion 120. [ The support 132 may be in the form of a line or a bar, but is not limited thereto.

The support portion 132 may be positioned to align with the reference line 201. The reference line 201 may be a straight line passing through two different points P1 and P2 on the inner circumferential surface of the body 110 and a center 202 of the hollow 111 of the body 110. [

For example, the support portion 132 may have a line shape or a bar shape that is aligned or arranged along the reference line 201.

The dressing portion 120 is detachable to the support portion 132 and can adjust the position where the dressing portion 120 is coupled to the support portion 132. The dressing portion 120 can be coupled to the support portion 132 at different engagement positions.

For example, the dressing portion 120 may have a circular or polygonal shape, but is not limited thereto and may be embodied in various shapes.

The center of the dressing portion 120 may be aligned between the center of the support portion 132 and one end of the support portion 132 or may be aligned between the center of the support portion 132 and the other end of the support portion 132. [

The coupling position of the dressing portion 120 can be determined according to the distance between the center of the dressing portion 120 and the center of the support portion 132.

For example, the dressing portion 120 may be coupled to the support portion 132 so as to be spaced apart from one end or the other end of the support portion 132. Or the dressing portion 120 may be coupled to the support portion 132 such that the support portion 132 contacts one end or abuts against the other end of the support portion 132. [

The dressing portion 120 may include a first dressing block 122, a second dressing block 124, and a fitting 126. For example, the dressing portion 120 can be divided into a first dressing block and a second dressing block 124, and the first and second dressing blocks 122 and 124 divided by the engaging holes 126 can be engaged .

The first dressing block 122 may be disposed on the support portion 132 and may be coupled to the support portion 132 by the first engagement portion 127a.

The second dressing block 124 may be disposed below the support 132 and may be coupled to the support 132 by a second engagement aperture 127b.

The first dressing block 122 may be for dressing the polishing pad 401 attached to the upper half 420 and the second dressing block 124 may be for dressing the polishing pad 402 attached to the lower half 410. [ For example.

The first dressing block 122 may have a first groove 125a through which the first engaging hole 127a is inserted and the first engaging hole 127a may be formed on the first surface of the first dressing block 122, And the first engagement hole 127a inserted in the first groove 125a can be coupled to the upper surface of the support portion 132. [

 A second groove 125b into which the second coupling hole 127b is inserted may be provided on one surface of the second dressing block 124 such as the polishing surface 124a and the second coupling hole 127b may be provided on the second surface of the second dressing block 124, The second engaging portion 127b inserted into the second groove 125b can be inserted into the groove 125b and can be engaged with the lower surface of the support portion 132. [ For example, each of the first and second coupling members 127a and 127b may be a bolt, a screw, or the like, but is not limited thereto.

The first and second coupling means 127a and 127b coupled with the support portion 132 can be completely inserted into the first and second grooves 125a and 125b. When the first and second coupling means 127a and 127b protrude out of the first and second grooves 125a and 125b, the pad polishing does not interfere with the protruded first and second coupling means 127a and 127b I receive it.

The support portion 132 may include first engagement grooves 132a spaced apart from the upper surface at a predetermined interval and the support portion 132 may have second engagement grooves 132b formed at a predetermined distance apart from the support portion 132 can do.

The first engagement grooves 132a and the second engagement grooves may be arranged to face each other or align with each other in the vertical direction.

The first coupling hole 127a may be engaged with at least one of the first coupling grooves 132a and the second coupling hole 127a may be coupled with at least one of the second coupling grooves 132b.

For example, each of the first and second coupling grooves 132a and 132b may be formed with a thread groove for coupling with the first and second coupling holes 127a and 127b.

4, a first seating part 412 on which the upper end of the support part 132 is seated may be provided on the opposite surface 122-1 of the polishing surface 122a of the first dressing block 122, The second seating portion 414 on which the lower end of the support portion 132 is seated may be provided on the opposite surface 124-1 of the polishing surface 124a of the second dressing block 124. [

For example, the upper end portion of the support portion 132 can be fitted into the first seat portion 412, and the lower end portion of the support portion 132 can be fitted into the second seat portion 414. [ The opposite surface 122-1 of the polishing surface 122a of the first dressing block 122 and the opposite surface 124-1 of the polishing surface 124a of the second dressing block 124 can be in contact with each other.

Since the second surface 122-1 of the first dressing block 122 and the second surface 124-1 of the second dressing block 124 are in contact with each other, The dressing blocks 122 and 124 can be uniformly received and the dressing for one region of the polishing pad with which the first and second dressing portions 122 and 124 abut can be stably and uniformly performed.

In another embodiment, the first connection portion 136a and the second connection portion 136b may be a magnetic body having the same polarity (for example, N-pole or S-pole).

3) may be omitted, and the first connection portion 136a and the second connection portion 136b may be magnetic bodies having the same polarity (for example, N-pole or S-pole).

5 shows a cross-sectional view of a dressing apparatus 200 according to another embodiment.

The same reference numerals as those in FIG. 3 denote the same components, and the same components are simply described or omitted.

Referring to FIG. 5, the embodiment shown in FIG. 5 may be the same as the embodiment of FIG. 3 except for the connecting portion 130 '.

The connection portion 130 'includes a first end portion 132 connected to the dressing portion 120 and a second end portion 134 connected to the inner circumferential surface of the body 110 and a second end portion 134 connected to the first end portion 132 and the second end portion And a magnetic body portion 136 'disposed between the magnetic body portions 136'.

For example, the connection part 130 includes a support part 132 disposed in the hollow 111 and coupled with the dressing part 120, and a magnetic body part 136 'disposed between the support part 132 and the inner circumferential surface of the body 110. [ . ≪ / RTI >

The magnetic body portion 136 'includes a ring-shaped first magnetic body portion 136a' having one end connected to the inner circumferential surface of the body 110 and a ring-shaped first magnetic body portion 136a 'located inside the first magnetic body 136a' And a ring-shaped second magnetic body portion 136b 'surrounding the other end, and the first magnetic body portion and the second magnetic body portion may have the same polarity.

For example, each of the first and second magnetic body portions 136a 'and 136b' may be N-poled or S-poled.

For example, the first magnetic body portion 136a 'may be a magnet having N poles and S poles, and the second magnetic body portion 136b' may be a magnet having N poles and S poles, and the first magnetic body portion 136a 'And the second magnetic body portion 136b may have the same polarity and a repulsive force acts between the first magnetic body 136a' and the second magnetic body 136b 'so that they are spaced apart from each other And the dressing portion 120 connected to the second magnetic body can rotate or rotate even if the body 110 connected to the first magnetic body 136a 'rotates, so that there is no friction between the first magnetic body and the second magnetic body, I never do that.

The connecting portion according to another embodiment may further include a bearing ball (not shown) positioned between the first magnetic body 136a 'and the second magnetic body 136b'.

6 shows a top view of a dressing apparatus 300 according to another embodiment. The same reference numerals as in Fig. 2 denote the same components, and the same components are simply described or omitted.

6, the dressing apparatus 300 may further include at least one auxiliary connection portion 610a, 610b in the embodiment 100, 200 of FIG. 2 or FIG. 6 shows a first auxiliary connection portion 610a located on one side of the connection portion 130 and a second auxiliary connection portion 610b located on the other side of the connection portion 130. However, Or more auxiliary connections.

Each of the auxiliary connection portions 610a and 610b may have the same configuration as the connection portion 130 shown in FIG. 3 or the connection portion 130 'shown in FIG. 5, and the connection portions 130 shown in FIG. The description of the connection unit 130 'can be equally applied to the auxiliary connection units 610a and 610b.

The support portions of the auxiliary connection portions 610a and 610b connect the two different second points on the inner circumferential surface of the second connection portions 136b and 136b 'and are aligned with the support portions 132 of the connection portions 130 and 130' .

The first and second coupling grooves 132a and 132b may be formed in the support portions of the auxiliary connection portions 610a and 610b and the first and second grooves 122 and 124 may be formed in the first and second dressing blocks 122 and 124. [ And the supporting portions of the auxiliary connecting portions 610a and 610b and the first and second dressing blocks 122 and 124 may be coupled by the coupling portions 127a and 127b. The auxiliary connection portions 610a and 610b shown in FIG. 6 may serve to stably support the dressing block 120. FIG.

FIG. 7 shows a perspective view of a wafer polishing apparatus 400 including a dressing apparatus 100, 200, or 300 according to an embodiment. Referring to FIG. 7, the wafer polishing apparatus 400 includes a lower stage 410 disposed to face each other, an upper stage 420, a sun gear 412 disposed in a central region of the lower stage 410, And an inner gear 414 disposed around the inner gear 410 and a dressing apparatus 100-300 disposed on the lower stage 410 to engage with the sun gear and the internal gear.

In the polishing process of the wafer, the carrier accommodating the wafer is disposed on the lower stage 410. In the dressing process, the dressing apparatus 100, 200, or 300 is disposed on the lower stage 410, The sun gear 412 and the internal gear 414 rotate while the dressing apparatuses 100, 200, and 300 are pressed.

 In FIG. 7, one dressing apparatus 100, 200, or 300 is disposed on the bottom plate 410, but not limited thereto, and a plurality of dressing apparatuses may be disposed on the bottom plate 410.

The bodies 110 of the dressing devices 100, 200 and 300 are rotated and revolved simultaneously by the rotation of the sun gear 412 and the internal gear 414, And the dressing block 120, the dressing block 120 hardly rotates and can only revolve.

8 shows the movement trajectory of the dressing apparatus 810 during the dressing process. The dressing device 810 may be any one of the embodiments 100 to 300. [

8, the body 110 of the dressing apparatus 810 rotates by rotating the sun gear 412 of the dressing apparatus 810 and the internal gear 414 together with the rotation 801 and the revolution 802 However, the dressing block 820 of the dressing apparatus 820 does not rotate, but is idle, and one area S1 of the lower half 410 can be polished by revolving the dressing block 820. [

According to the position where the dressing block 820 is coupled to the supporting part, the orbit of the dressing block 820 can be changed and the desired area or position of the lower polishing part 410 can be polished.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to one embodiment. Further, the features, structures, effects, and the like illustrated in the embodiments can be combined and modified by other persons having ordinary skill in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

110: body 120: dressing part
130: connection part 132: support part
136a: first connection part 136b: second connection part
136c: bearing ball 136a ': first magnetic body
136b ': second magnetic body.

Claims (12)

A body formed on an outer circumferential surface of the shaft and engaging with the internal gear of the polishing apparatus and having a hollow body and rotating while revolving around the sun gear;
A dressing unit disposed in the hollow so as to be spaced apart from an inner circumferential surface of the body and dressing the surface plate; And
A first connection part having a ring shape and having one end connected to the inner circumferential surface of the body, a ring-shaped second connection part rotating around the other end of the first connection part, and a second connection part connected to the second connection part to support the dressing part in the hollow And a connecting portion having a supporting portion,
Wherein the connection portion is rotatably coupled to the inner circumferential surface of the body so that the dressing portion is not rotated by reducing the rotational force or the frictional force between the body and the dressing portion when the body rotates. delete delete The method according to claim 1,
The support portion is in the shape of a line or a rod aligned with the reference line,
Wherein the baseline is a straight line passing through two opposing points on an inner circumferential surface of the body and a hollow center of the body. 5. The method of claim 4,
Wherein the dressing portion is detachable to the support portion,
Wherein the dressing portion is attachable to the support portion at a different position. The method according to claim 1,
Wherein the connection portion includes a bearing ball disposed between the first connection portion and the second connection portion; The dressing device further comprising: The method according to claim 1,
Wherein the first connecting portion and the second connecting portion are magnetic bodies having the same polarity. 6. The dressing apparatus according to claim 5,
A first dressing block disposed on an upper surface of the support portion, and a second dressing block disposed on a lower surface of the support portion. 9. The method of claim 8,
Wherein grooves are formed in the polishing surfaces of each of the first and second dressing blocks, and the supporting portions include a plurality of engaging grooves spaced from each other,
The dressing unit includes:
And a coupling hole inserted in the groove provided in the polishing surface and coupled with any one of the plurality of coupling grooves. 9. The method of claim 8,
Further comprising auxiliary connections connecting the body and the dressing blocks. 8. The method according to claim 6 or 7,
And the other end of the first connection portion has a protrusion protruding in a vertical direction,
And the second connection portion surrounds the periphery of the protrusion of the first connection portion. 9. The method of claim 8,
The first dressing block includes a first seating portion on which the upper end of the support portion is seated and a second seating portion on the opposite side of the polishing surface of the second dressing block on which the lower end portion of the support portion is seated. And,
Wherein an opposite surface of the polishing surface of the first dressing block and an opposite surface of the polishing surface of the second dressing block are in contact with each other.
KR1020160000966A 2016-01-05 2016-01-05 An dressing apparatus KR101881376B1 (en)

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KR1020160000966A KR101881376B1 (en) 2016-01-05 2016-01-05 An dressing apparatus

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Application Number Priority Date Filing Date Title
KR1020160000966A KR101881376B1 (en) 2016-01-05 2016-01-05 An dressing apparatus

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KR101881376B1 true KR101881376B1 (en) 2018-07-24

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179600A (en) * 1999-12-20 2001-07-03 Speedfam Co Ltd Dresser

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110106014A (en) * 2010-03-22 2011-09-28 주식회사 엘지실트론 Dresser and double side polishing apparatus of wafer including the same
KR101285923B1 (en) * 2011-12-27 2013-07-12 주식회사 엘지실트론 Grinding apparatus and dressing gear for the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001179600A (en) * 1999-12-20 2001-07-03 Speedfam Co Ltd Dresser

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