KR101786531B1

KR101786531B1 - A method for manufacturing a patch type wearable temperature sensor

Info

Publication number: KR101786531B1
Application number: KR1020150154972A
Authority: KR
Inventors: 이왕훈; 계지원; 한동철; 신한재
Original assignee: 재단법인 구미전자정보기술원
Priority date: 2015-11-05
Filing date: 2015-11-05
Publication date: 2017-10-18
Also published as: KR20170052895A

Abstract

A patch type wearable temperature sensor manufacturing method is disclosed. A method of manufacturing a patch-type wearable temperature sensor according to the present invention comprises the steps of: applying a conductive ink on a substrate; Transferring the conductive ink applied on the substrate to an adhesive film having an adhesive force on the lower surface or both the upper surface and the lower surface; And attaching the metal electrode to the conductive ink transferred to the adhesive film.

Description

TECHNICAL FIELD [0001] The present invention relates to a patch type wearable temperature sensor,

The present invention relates to a patch type wearable temperature sensor manufacturing method. More specifically, the present invention relates to a patch type wearable temperature sensor manufacturing method which is simple in manufacturing process.

A wearable device means a device made of a flexible material and wearable by a user. For example, various types of devices, such as clothing, shoes, gloves, glasses, hats, ornaments, etc., that can be worn by a person or an animal can be a wearable device.

Wearable devices are creating new markets. In order to realize them, miniaturization, weight saving and low power driving of electric and electronic devices are essential. In addition, when approaching from a material point of view, it is required to develop a technology capable of flexibly or extensively flexing in various directions and realizing an electric / electronic device that does not deteriorate in such a situation.

In the currently developed wearable device or sensors applied thereto, not only the manufacturing process is complicated, but also a cost problem caused by a complicated manufacturing process is significant. In addition, since the manufacturing cost is high, the consumer price is also high. In such a situation, there is a need to provide a product that is simple in manufacturing process and low in price to an acceptable level for the popular spread of wearable devices.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing a patch type wearable temperature sensor having a simple manufacturing process.

It is another object of the present invention to provide a patch type wearable temperature sensor manufacturing method capable of reducing manufacturing cost and time.

According to an aspect of the present invention, there is provided a method of manufacturing a patch-type wearable temperature sensor, including: applying a conductive ink on a substrate; Transferring the conductive ink applied on the substrate to an adhesive film having an adhesive force on the lower surface or both the upper surface and the lower surface; And attaching a metal electrode to the conductive ink transferred to the adhesive film.

In an embodiment, the adhesive on the upper surface of the adhesive film preferably includes a medical skin contact allowable adhesive.

In an embodiment, it is preferable that a removable adhesive film protective layer is further provided on the upper surface of the adhesive film.

In one embodiment of the present invention, the metal electrode is made of a metal selected from the group consisting of Ag, Au, Pt, Al, Zn, Fe, Cu, Sn, Ni and Pb.

In one embodiment of the present invention, it is preferable that the patch-type wearable temperature sensor manufacturing method further includes the step of attaching a heat-melting adhesive resin to the upper surface of the adhesive film so as to cover the conductive ink having the metal electrode attached thereto and heat- .

According to the present invention as described above, a patch-type wearable temperature sensor can be manufactured by a simple manufacturing process.

Further, according to the present invention, the cost and time required for manufacturing the temperature sensor can be reduced.

1 is a flowchart of a method of manufacturing a patch type wearable temperature sensor according to an embodiment of the present invention.
2 is a schematic view illustrating a method of manufacturing a patch type wearable temperature sensor according to an embodiment of the present invention.
3 (a) to 3 (d) illustrate an embodiment of a temperature sensor manufactured according to a patch-type wearable temperature sensor manufacturing method according to an embodiment of the present invention.
4 is a graph illustrating a temperature characteristic of a patch wearable temperature sensor according to an embodiment of the present invention.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Wherein like reference numerals refer to like elements throughout.

1 is a flowchart of a method of manufacturing a patch type wearable temperature sensor according to an embodiment of the present invention. Referring to FIG. 1, conductive ink is applied onto a prepared substrate (S110). In this case, the substrate may be a substrate made of an insulating material, for example, a glass substrate. However, the present invention is not limited thereto, and any conductive ink can be applied to the substrate. Further, for uniform application of the conductive ink, the substrate is preferably a flat substrate.

The conductive ink may preferably be a P-type conductive polymer material, more preferably a conductive polymer ink using PEDOT / PSS [poly (ethylenedioxythiophene) doped with poly (styrene sulfonic acid)] or polyfluorene, or a water- it may be a conductive polymer ink containing poly (4-styrenesulfonate) (PSS) nanoparticles. The conductive ink may also be a transparent conductive ink.

The conductive ink applying step (S110) may be performed, for example, by applying a conductive ink to the substrate in a circular shape with a diameter of 1 mm. However, these examples are merely examples of the present invention, and it is apparent that the diameter (size) and the shape of the ink to be applied may vary depending on the purpose of manufacture, the use, and the like. After ink application, although not shown, it may further include an ink drying step. The drying step may be carried out at room temperature.

After the conductive ink is applied, an ink transferring step is performed (S120). The ink transfer step may transfer the ink on the substrate onto the film by contacting the adhesive film on top of the applied conductive ink. The adhesive film includes a surface that is in contact with the applied conductive ink (hereinafter referred to as "lower surface " for convenience) and a surface that is not in contact with the applied conductive ink (hereinafter referred to as an upper surface for convenience). The bottom surface is capable of transferring the conductive ink to the adhesive film, and the top surface is for attaching the manufactured patchable wearable temperature sensor to the patient's body or the like at a later time. Here, depending on the use of the temperature sensor, the adhesive film may have an adhesive force only on one side of the lower surface, and may have adhesive force on both the lower surface and the upper surface.

The adhesive film may be a form in which the adhesive itself is applied to the film itself, or may further include an adhesive layer as an additional layer in the film. Here, among the faces of the adhesive film, the face on the side not in contact with the applied conductive ink, that is, the adhesive on the upper face, is preferably a medical skin contact permitting adhesive suitable for application to the patient's skin. This takes into consideration the case where the upper surface of the adhesive film is attached to the patient's body (for example, forehead, torso, arm, leg, or other position on the body) as described above.

Further, the adhesive on the upper surface may include a hydrogel. The hydrogel may include some or all of water, glycerol, acrylate / acrylamide copolymer, and / or other components. Such a hydrogel provides excellent skin adhesive properties and can act as a thermal conduit between the patch wearable temperature sensor according to the present invention and the skin of the patient to provide improved thermal conduction properties.

Further, the upper surface of the adhesive film may further include a removable adhesive film protective layer. It is preferable that the adhesive film protective layer is a film that can be easily removed from the upper surface of the adhesive film since it is removed immediately before adhering to the skin of the patient. For example, the adhesive film protective layer may be a polyolefin coated or silicone coated type of paper or film, but is not limited thereto.

The adhesive film, the adhesive film protective layer, and the like are preferably flexible, and can be adhered to a curved surface such as a skin of a patient, and it is preferable that the adhesive film is bent or is comfortable to wear while maintaining adhesiveness.

When the ink transfer step S120 is completed, the electrode formation step S130 is performed. The electrode formation step S130 may be performed by connecting metal electrodes to one side and the other side of the conductive ink transferred to the adhesive film. The metal electrode may comprise at least one metal selected from the group including, for example, Ag, Au, Pt, Al, Zn, Fe, Cu, Sn, Ni and Pb.

In addition, although not shown, it may further include an encapsulation step after the electrode forming step S130. The encapsulation step may be performed for the purpose of minimizing the influence of the humidity depending on the use purpose of the temperature sensor. For example, the encapsulation step may be performed by forming electrodes on both sides of the conductive ink, bonding the hot melt adhesive resin to the upper surface of the adhesive film on which the electrodes are formed, and heat-treating the adhesive resin. It is not. The heat-meltable adhesive resin is a thermoplastic resin in a solid state at room temperature, and is a resin that is applied to the adherend in a liquid state at a high temperature and exhibits adhesion while being cooled and solidified after compression. For example, Surlyn (Solaronix, SX 1170-25 Hot Melt ), But is not limited thereto. In this experiment, the heat treatment environment conditions were maintained at 120 ° C for 2 minutes to encapsulate. However, the heat treatment environment conditions (for example, the heat treatment temperature and the heat treatment time) can be arbitrarily set depending on the use of the temperature sensor, But is not limited thereto.

2 is a view for explaining a method of manufacturing a patch type wearable temperature sensor according to an embodiment of the present invention. Referring to FIG. 2, a substrate (for example, glass) and an adhesive film are prepared, and conductive ink is coated on the substrate (S110). Next, (a1) to (a6) correspond to the ink transfer step (S120). As described in detail with reference to FIG. 1, by contacting the adhesive film on the substrate on which the conductive ink is applied, Transferring the image onto the substrate. (a6) shows a state in which the conductive ink is transferred onto the adhesive film.

Next, (b) corresponds to the electrode formation step (S130), and electrodes can be formed by attaching metal electrodes to one side and the other side of the conductive ink transferred to the adhesive film.

Next, (c) corresponds to an encapsulation step, and the heat-meltable adhesive resin can be encapsulated by adhering it to the top of the adhesive film on which the electrode is formed and heat-treating.

3 (a) to 3 (d) illustrate an embodiment of a temperature sensor manufactured according to a patch-type wearable temperature sensor manufacturing method according to an embodiment of the present invention. FIG. 3 (a) is a temperature sensor manufactured according to the method of manufacturing a temperature sensor according to an embodiment of the present invention, and FIGS. 3 (b) to 3 (d) This is an example applied to an object.

4 is a graph illustrating a temperature characteristic of a patch wearable temperature sensor according to an embodiment of the present invention. The temperature was measured by a digital multimeter using a thermo-hygrostat to gradually increase the temperature within a temperature range of 10 to 40 占 폚, and the change in resistance of the temperature sensor according to an embodiment of the present invention. As a result of measurement, it was confirmed that the total resistance decreased with increasing temperature. Specifically, the sensitivity was 779 mΩ / in the range of about 264 ~ 288 Ω, and the linearity was decreased by 96.1%. Unlike intrinsic semiconductors, extrinsic semiconductors have energy levels that allow electrons to be in the forbidden band. As a result, electrons move smoothly between the impurity energy level and the conduction band or valence band. In the case of the p-type semiconductor, the impurity energy level is formed close to the valence band since it has the Fermi energy level as shown in the following equation (1).

Where Ef is the p-type semiconductor Fermi level energy, Efi is the intrinsic Fermi level energy, k is the Boltzmann constant, T is the absolute temperature, P0 is the hole concentration of the p-type semiconductor, and Ni is the intrinsic carrier concentration. When energy is applied from the outside, the electrons of the valence band are excited, and corresponding holes are formed in the valence band to increase the electric conduction.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

Claims

Applying a conductive ink on the substrate;
Transferring the conductive ink applied on the substrate to an adhesive film having an adhesive force on the lower surface or both the upper surface and the lower surface; And
And attaching a metal electrode to the conductive ink transferred to the adhesive film,
Further comprising a drying step of drying the conductive ink applied on the substrate,
The conductive ink is a conductive polymer material including PEDOT / PSS [poly (ethylenedioxythiophene) doped with poly (styrene sulfonic acid)],
Wherein the temperature change is detected through resistance change of the PEDOT / PSS according to temperature change.

The method according to claim 1,
Wherein the adhesive on the upper surface of the adhesive film comprises a medical skin contact allowable adhesive.

The method according to claim 1,
Wherein the adhesive film is further provided with a removable adhesive film protective layer on the upper surface of the adhesive film.

The method according to claim 1,
Wherein the metal electrode is made of any one metal selected from the group consisting of Ag, Au, Pt, Al, Zn, Fe, Cu, Sn, Ni and Pb.

The method according to claim 1,
In the patch type wearable temperature sensor manufacturing method,
And attaching a heat-meltable adhesive resin to the upper surface of the adhesive film so as to cover the conductive ink having the metal electrode attached thereto, followed by heat treatment.