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KR101726114B1 - 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 - Google Patents

알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 Download PDF

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Publication number
KR101726114B1
KR101726114B1 KR1020157020481A KR20157020481A KR101726114B1 KR 101726114 B1 KR101726114 B1 KR 101726114B1 KR 1020157020481 A KR1020157020481 A KR 1020157020481A KR 20157020481 A KR20157020481 A KR 20157020481A KR 101726114 B1 KR101726114 B1 KR 101726114B1
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KR
South Korea
Prior art keywords
photosensitive resin
solder resist
resin composition
resist composition
compound
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Application number
KR1020157020481A
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English (en)
Korean (ko)
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KR20150102105A (ko
Inventor
겐지 가토
후아민 구
창홍 우
Original Assignee
타이요 잉크 (쑤저우) 컴퍼니 리미티드
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Publication of KR20150102105A publication Critical patent/KR20150102105A/ko
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Publication of KR101726114B1 publication Critical patent/KR101726114B1/ko

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/285Permanent coating compositions
    • H05K3/287Photosensitive compositions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Laminated Bodies (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020157020481A 2013-01-31 2013-08-09 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 KR101726114B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201310038669.5A CN103969947B (zh) 2013-01-31 2013-01-31 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板
CN201310038669.5 2013-01-31
PCT/CN2013/081148 WO2014117496A1 (zh) 2013-01-31 2013-08-09 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板

Publications (2)

Publication Number Publication Date
KR20150102105A KR20150102105A (ko) 2015-09-04
KR101726114B1 true KR101726114B1 (ko) 2017-04-11

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KR1020157020481A KR101726114B1 (ko) 2013-01-31 2013-08-09 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판

Country Status (5)

Country Link
JP (1) JP6118426B2 (ja)
KR (1) KR101726114B1 (ja)
CN (1) CN103969947B (ja)
TW (1) TWI516869B (ja)
WO (1) WO2014117496A1 (ja)

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CN107003604B (zh) * 2014-10-15 2020-08-11 奇美实业股份有限公司 感光性树脂组成物、彩色滤光片的制造方法、彩色滤光片以及液晶显示装置
KR102329943B1 (ko) * 2016-03-16 2021-11-22 동우 화인켐 주식회사 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴
CN107490936A (zh) * 2016-06-09 2017-12-19 株式会社田村制作所 固化涂膜的形成方法
JP6995469B2 (ja) * 2016-09-02 2022-01-14 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR101952865B1 (ko) 2016-10-10 2019-02-27 삼성전기주식회사 팬-아웃 반도체 패키지 및 감광성 수지 조성물
WO2019031322A1 (ja) * 2017-08-09 2019-02-14 互応化学工業株式会社 多層プリント配線板の製造方法及び多層プリント配線板
CN109976092B (zh) * 2017-12-27 2022-04-01 太阳油墨(苏州)有限公司 固化性树脂组合物、干膜、固化物、及印刷电路板
WO2020090565A1 (ja) * 2018-10-30 2020-05-07 互応化学工業株式会社 絶縁膜形成用の樹脂組成物、絶縁膜形成用の樹脂組成物の製造方法、ドライフィルム、プリント配線板、及びプリント配線板の製造方法
CN113196171B (zh) * 2018-12-19 2024-04-23 太阳控股株式会社 固化性树脂组合物、干膜、固化物和电子部件
CN118259540A (zh) * 2022-12-28 2024-06-28 太阳油墨(苏州)有限公司 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板

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JP2005152736A (ja) 2003-11-25 2005-06-16 Mitsui Chemicals Inc 配線基板の塗布方法
JP2007128059A (ja) 2005-10-04 2007-05-24 Hitachi Chem Co Ltd 感光性樹脂組成物及び感光性フィルム
JP2010250127A (ja) 2009-04-16 2010-11-04 Goo Chemical Co Ltd アルカリ現像可能な硬化性組成物及びその硬化物
JP2011231257A (ja) * 2010-04-28 2011-11-17 Kyocera Chemical Corp 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板

Also Published As

Publication number Publication date
CN103969947B (zh) 2016-05-04
WO2014117496A1 (zh) 2014-08-07
JP6118426B2 (ja) 2017-04-19
JP2016513268A (ja) 2016-05-12
TWI516869B (zh) 2016-01-11
CN103969947A (zh) 2014-08-06
TW201430492A (zh) 2014-08-01
KR20150102105A (ko) 2015-09-04

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