KR101726114B1 - 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 - Google Patents
알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 Download PDFInfo
- Publication number
- KR101726114B1 KR101726114B1 KR1020157020481A KR20157020481A KR101726114B1 KR 101726114 B1 KR101726114 B1 KR 101726114B1 KR 1020157020481 A KR1020157020481 A KR 1020157020481A KR 20157020481 A KR20157020481 A KR 20157020481A KR 101726114 B1 KR101726114 B1 KR 101726114B1
- Authority
- KR
- South Korea
- Prior art keywords
- photosensitive resin
- solder resist
- resin composition
- resist composition
- compound
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Laminated Bodies (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310038669.5A CN103969947B (zh) | 2013-01-31 | 2013-01-31 | 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 |
CN201310038669.5 | 2013-01-31 | ||
PCT/CN2013/081148 WO2014117496A1 (zh) | 2013-01-31 | 2013-08-09 | 碱显影型感光性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20150102105A KR20150102105A (ko) | 2015-09-04 |
KR101726114B1 true KR101726114B1 (ko) | 2017-04-11 |
Family
ID=51239615
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020157020481A KR101726114B1 (ko) | 2013-01-31 | 2013-08-09 | 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6118426B2 (ja) |
KR (1) | KR101726114B1 (ja) |
CN (1) | CN103969947B (ja) |
TW (1) | TWI516869B (ja) |
WO (1) | WO2014117496A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107003604B (zh) * | 2014-10-15 | 2020-08-11 | 奇美实业股份有限公司 | 感光性树脂组成物、彩色滤光片的制造方法、彩色滤光片以及液晶显示装置 |
KR102329943B1 (ko) * | 2016-03-16 | 2021-11-22 | 동우 화인켐 주식회사 | 네가티브 감광형 수지 조성물 및 이로부터 제조된 광경화 패턴 |
CN107490936A (zh) * | 2016-06-09 | 2017-12-19 | 株式会社田村制作所 | 固化涂膜的形成方法 |
JP6995469B2 (ja) * | 2016-09-02 | 2022-01-14 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
KR101952865B1 (ko) | 2016-10-10 | 2019-02-27 | 삼성전기주식회사 | 팬-아웃 반도체 패키지 및 감광성 수지 조성물 |
WO2019031322A1 (ja) * | 2017-08-09 | 2019-02-14 | 互応化学工業株式会社 | 多層プリント配線板の製造方法及び多層プリント配線板 |
CN109976092B (zh) * | 2017-12-27 | 2022-04-01 | 太阳油墨(苏州)有限公司 | 固化性树脂组合物、干膜、固化物、及印刷电路板 |
WO2020090565A1 (ja) * | 2018-10-30 | 2020-05-07 | 互応化学工業株式会社 | 絶縁膜形成用の樹脂組成物、絶縁膜形成用の樹脂組成物の製造方法、ドライフィルム、プリント配線板、及びプリント配線板の製造方法 |
CN113196171B (zh) * | 2018-12-19 | 2024-04-23 | 太阳控股株式会社 | 固化性树脂组合物、干膜、固化物和电子部件 |
CN118259540A (zh) * | 2022-12-28 | 2024-06-28 | 太阳油墨(苏州)有限公司 | 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005152736A (ja) | 2003-11-25 | 2005-06-16 | Mitsui Chemicals Inc | 配線基板の塗布方法 |
JP2007128059A (ja) | 2005-10-04 | 2007-05-24 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性フィルム |
JP2010250127A (ja) | 2009-04-16 | 2010-11-04 | Goo Chemical Co Ltd | アルカリ現像可能な硬化性組成物及びその硬化物 |
JP2011231257A (ja) * | 2010-04-28 | 2011-11-17 | Kyocera Chemical Corp | 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61243869A (ja) | 1985-04-19 | 1986-10-30 | Taiyo Ink Seizo Kk | レジストインキ組成物 |
TW268031B (ja) * | 1993-07-02 | 1996-01-11 | Ciba Geigy | |
JP2001048982A (ja) * | 1999-08-09 | 2001-02-20 | Mitsubishi Gas Chem Co Inc | 感光性樹脂。 |
JP2002256060A (ja) | 2001-02-28 | 2002-09-11 | Tamura Kaken Co Ltd | 感光性樹脂組成物及びプリント配線板 |
JP3596492B2 (ja) | 2001-08-08 | 2004-12-02 | 松下電器産業株式会社 | ボンディング方法 |
EP1413926A3 (en) * | 2002-09-30 | 2004-10-27 | Tamura Kaken Corporation | Photosensitive resin composition and printing wiring board |
JP2004300173A (ja) * | 2003-03-28 | 2004-10-28 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及びそれを用いたプリント配線板 |
JP4471149B2 (ja) * | 2003-10-10 | 2010-06-02 | 日本化薬株式会社 | 感光性樹脂組成物及びその硬化物の製造法 |
JP2007279489A (ja) * | 2006-04-10 | 2007-10-25 | Hitachi Chem Co Ltd | 感光性樹脂組成物、レジストパターンの製造方法、フレキシブル基板及び電子部品 |
JP4783678B2 (ja) * | 2006-06-01 | 2011-09-28 | 富士フイルム株式会社 | 感光性組成物及びその製造方法、感光性フィルム、感光性積層体、並びに、永久パターン形成方法、及びプリント基板 |
JP4840865B2 (ja) | 2006-11-07 | 2011-12-21 | 太陽ホールディングス株式会社 | アルカリ現像可能な感光性樹脂組成物およびそれを用いたプリント配線板 |
JP4978787B2 (ja) * | 2007-08-09 | 2012-07-18 | Dic株式会社 | 感光性樹脂組成物及び新規酸基含有ビニルエステル樹脂 |
CN100482752C (zh) * | 2008-01-30 | 2009-04-29 | 深圳市容大电子材料有限公司 | 一种感光防焊油墨组合物、其应用及含有其的线路板 |
CN101344724A (zh) * | 2008-09-01 | 2009-01-14 | 深圳市容大电子材料有限公司 | 一种感光成像组合物、其制备方法及其用途 |
JP5387896B2 (ja) * | 2009-06-05 | 2014-01-15 | 日立化成株式会社 | 感光性樹脂組成物及びこれを用いた感光性エレメント |
JP5583941B2 (ja) * | 2009-09-30 | 2014-09-03 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP5422427B2 (ja) * | 2010-02-08 | 2014-02-19 | 太陽ホールディングス株式会社 | 積層構造体及びそれに用いる感光性ドライフィルム |
JP5466522B2 (ja) * | 2010-02-08 | 2014-04-09 | 太陽ホールディングス株式会社 | 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
-
2013
- 2013-01-31 CN CN201310038669.5A patent/CN103969947B/zh active Active
- 2013-05-24 TW TW102118413A patent/TWI516869B/zh active
- 2013-08-09 WO PCT/CN2013/081148 patent/WO2014117496A1/zh active Application Filing
- 2013-08-09 KR KR1020157020481A patent/KR101726114B1/ko active IP Right Grant
- 2013-08-09 JP JP2015555545A patent/JP6118426B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005152736A (ja) | 2003-11-25 | 2005-06-16 | Mitsui Chemicals Inc | 配線基板の塗布方法 |
JP2007128059A (ja) | 2005-10-04 | 2007-05-24 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性フィルム |
JP2010250127A (ja) | 2009-04-16 | 2010-11-04 | Goo Chemical Co Ltd | アルカリ現像可能な硬化性組成物及びその硬化物 |
JP2011231257A (ja) * | 2010-04-28 | 2011-11-17 | Kyocera Chemical Corp | 感光性樹脂組成物及びそれを用いたフレキシブルプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN103969947B (zh) | 2016-05-04 |
WO2014117496A1 (zh) | 2014-08-07 |
JP6118426B2 (ja) | 2017-04-19 |
JP2016513268A (ja) | 2016-05-12 |
TWI516869B (zh) | 2016-01-11 |
CN103969947A (zh) | 2014-08-06 |
TW201430492A (zh) | 2014-08-01 |
KR20150102105A (ko) | 2015-09-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101726114B1 (ko) | 알칼리 현상형 감광성 수지 조성물, 그의 드라이 필름 및 그의 경화물, 및 그들을 사용하여 형성된 프린트 배선판 | |
KR101362489B1 (ko) | 광 경화성·열 경화성 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는 인쇄 배선판 | |
JP5043516B2 (ja) | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線 | |
JP6248139B2 (ja) | 感光性樹脂組成物およびその硬化物、ならびにプリント配線板 | |
JP4865911B2 (ja) | カルボキシル基含有樹脂を含有する硬化性組成物及びその硬化物並びにカルボキシル基含有樹脂を得る方法 | |
JP2008146043A (ja) | 感光性組成物 | |
JP5952904B2 (ja) | アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 | |
JP5113298B2 (ja) | 光硬化性・熱硬化性樹脂組成物及びそれを用いて得られるプリント配線板 | |
JP5632603B2 (ja) | カルボキシル基含有樹脂、それを含有する組成物及び硬化物、並びにカルボキシル基含有樹脂の製造方法 | |
JP2010066444A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP5484772B2 (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP4167599B2 (ja) | 硬化性樹脂及びそれを含有する硬化性樹脂組成物 | |
JP2010078949A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP2010031072A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP2004085984A (ja) | 光硬化性組成物及び感光性熱硬化性樹脂組成物並びにその硬化物 | |
CN118575131A (zh) | 碱性显影型树脂组合物、其光固化性的干膜及其固化物以及使用其而形成的印刷电路板 | |
CN118259549A (zh) | 碱性显影型树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 | |
CN118749086A (zh) | 感光热固化显影性树脂组合物、其干膜及其固化物以及使用其而形成的印刷电路板 | |
JP2010013518A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP2004295026A (ja) | 硬化性樹脂組成物 | |
JP2010066541A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP2010078753A (ja) | アルカリ現像可能な硬化性組成物及びその硬化物 | |
JP2008233747A (ja) | 硬化性組成物及びその硬化物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
X091 | Application refused [patent] | ||
AMND | Amendment | ||
X701 | Decision to grant (after re-examination) | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20191226 Year of fee payment: 4 |