KR101617806B1 - Method for Setting Position of Picker Head for Semiconductor Manufacturing Device - Google Patents

Abstract

 The present invention relates to a method for setting an accurate working position of a picker head for picking up a semiconductor chip on a wafer in a die bonder apparatus and transferring it to another process position, (A) the vision camera photographs the ejector pin to detect the position of the ejector pin; (b) capturing a first vacuum hole of the collet shaft and detecting a center position of the first vacuum hole in a state where the collet is not mounted on the collet shaft of the picker head; (c) capturing a second vacuum hole of the collet and detecting a position of the second vacuum hole in a state where the collet is mounted on the collet shaft of the picker head; (d) calculating an offset value between a position value of the detected ejector pin, a position value of the center of the first vacuum hole of the collet shaft, and a position value of the second vacuum hole of the collet, Setting a working position of the second vacuum hole; The steps (a), (b), and (c) may be performed in an arbitrary order.

Description

TECHNICAL FIELD [0001] The present invention relates to a method of positioning a picker head for a semiconductor package manufacturing apparatus,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of setting a working position of a picker head in a semiconductor package manufacturing apparatus, and more particularly to a semiconductor package manufacturing apparatus such as a die bonder apparatus which picks up a semiconductor chip at a process position, And a method for setting an accurate working position of the picker head.

In general, a semiconductor package manufacturing process includes a sawing process of cutting a wafer and individualizing the wafer into a die, which is a semiconductor chip, a die bonding process of attaching the individual dies to the substrate, a process of electrically connecting the die and the connection pads of the substrate A molding process for molding the periphery of the die and the die, a process for forming an external connection terminal on the ball pad of the substrate, and the like.

The die bonding step is performed by applying an adhesive to a substrate such as a printed circuit board, a lead frame, and the like, and then pressing the die, which is separated from the wafer and transported, onto the substrate.

In this die bonding process, picking up an individual die on a wafer, carrying it to a substrate, and pressing it to a designated position on the substrate is performed by a picker head (which is also referred to as a " bonding head "). A typical picker head uses a collet having a pneumatic flow path formed at its center to vacuum-adhere a die on a wafer by vacuum suction (this is called a pick-up), moves to a substrate, (This is called "place") while applying a constant pressure to the die.

In recent years, however, miniaturization of the size of the semiconductor chip has necessitated higher precision of the operation. Thus, the pick-up position and the place position between the collet and the semiconductor chip of the picker head must be accurate, so that the defect does not occur during the process.

Particularly, when the type of the semiconductor chip to be worked or the like changes, the collet of the picker head must be changed accordingly. In such a case, the position of the collet may be changed by the replacement work of the collet. In this case, The semiconductor chip can not be accurately picked up or the picked-up semiconductor chip can not be placed at the precise position of the substrate, resulting in a defect.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of positioning a picker head for a semiconductor package manufacturing apparatus capable of accurately setting a pickup position and a position of a semiconductor chip of a picker head.

According to an aspect of the present invention, there is provided a semiconductor device comprising: an ejector pin installed on a lower side of a wafer to lift up a semiconductor chip to be transferred from the wafer; a chuck table on which a substrate on which the semiconductor chip, A collet shaft movably disposed in an arbitrary direction on the wafer and the chuck table so as to penetrate the first vacuum hole in the up and down direction and a collet shaft detachably coupled to the lower portion of the collet shaft, And a second vacuum hole communicating with the first vacuum hole so as to penetrate the semiconductor chip in a vertical direction so as to vacuum adsorb the semiconductor chip; a vision camera provided on the upper side of the picker head; In a semiconductor package manufacturing apparatus including a lighting unit for providing light for the picker head In the method, (a) detecting a position of the ejector pin by which the vision camera capturing the ejector pin and; (b) capturing a first vacuum hole of the collet shaft and detecting a center position of the first vacuum hole in a state where the collet is not mounted on the collet shaft of the picker head; (c) capturing a second vacuum hole of the collet and detecting a position of the second vacuum hole in a state where the collet is mounted on the collet shaft of the picker head; (d) calculating an offset value between a position value of the detected ejector pin, a position value of the center of the first vacuum hole of the collet shaft, and a position value of the second vacuum hole of the collet, Setting a working position of the second vacuum hole; Wherein the steps (a), (b), and (c) are performed in an arbitrary order.
According to the present invention, there is provided a method of positioning a picker head for a semiconductor package manufacturing apparatus, comprising the steps of: (e) photographing a reference point set on a substrate placed on a chuck table by the vision camera and detecting a position with respect to a set reference point Wow; (f) photographing the second vacuum hole of the collet and detecting the position of the second vacuum hole, while the collet is mounted on the collet shaft of the picker head; (g) calculating an offset value between a position value for the detected reference point and a position value of the second vacuum hole of the collet to set a working position of the second vacuum hole of the collet with respect to the set reference point; The steps (e) and (f) may be performed in any order.
Here, the vision camera performing the imaging in the steps (e) and (f) is a vision camera separate from the vision camera performing the imaging in the steps (a), (b), and .
The steps (a), (b), (c), (e), and (f) may be performed in any order.
When the image of the first vacuum hole taken after the step (b) is an ellipse, the inclination of the collet shaft is corrected.

According to another aspect of the present invention, there is provided a semiconductor device, comprising: an ejector pin installed on a lower side of a wafer to lift up a semiconductor chip to be transferred from the wafer; a chuck table on which a substrate on which the semiconductor chip, A collet shaft which is installed on the upper side of the chuck table so as to be movable in an arbitrary direction and through which the first vacuum hole penetrates, and a collet shaft which is detachably coupled to the lower portion of the collet shaft and communicates with the first vacuum hole at the center And a second vacuum hole formed vertically so as to penetrate the semiconductor chip to vacuum-adsorb the semiconductor chip, a vision camera provided on the upper side of the picker head, and a light for photographing the vision camera In a method of setting a working position of the picker head in a semiconductor package manufacturing apparatus including a lighting unit (A) photographing a reference point set on a reference point set on a chuck table or a substrate placed on a chuck table, and detecting a position with respect to the reference point; (b) capturing a second vacuum hole of the collet and detecting a position of the second vacuum hole in a state where the collet is mounted on the collet shaft of the picker head; (c) calculating an offset value between a position value of the collet detected at the step (a) and a position of the second vacuum hole of the collet, and setting a position of the second vacuum hole of the collet with respect to the reference point Including; Wherein the steps (a) and (b) are performed in an arbitrary order. A method of positioning a picker head for a semiconductor package manufacturing apparatus is provided.
In this case, before the step (a) or (b) is performed, the collet is not mounted on the collet shaft of the picker head, and the vision camera photographs the first vacuum hole of the collet shaft, (D) of detecting the position of the first vacuum hole and performing a position setting in the step (c), and further adding an offset value between the center position of the first vacuum hole and the second vacuum hole of the collet And the work position of the second vacuum hole of the collet with respect to the reference point can be calculated.
And correcting the inclination of the collet shaft when the image of the first vacuum hole taken after the step (d) is elliptical.
According to another aspect of the present invention, there is provided a method of positioning a picker head for a semiconductor package manufacturing apparatus, the method comprising: (e) photographing the ejector pin to detect a position of an ejector pin; (f) the vision camera captures a second vacuum hole of the collet to detect the position of the second vacuum hole; (g) calculating an offset value between a position value of the detected ejector pin, a position value of the center of the first vacuum hole of the collet shaft, and a position value of the second vacuum hole of the collet, Setting a working position of the second vacuum hole; The steps (e) and (f) may be performed in an arbitrary order.
Here, the vision camera performing the imaging in the steps (e) and (f) is a vision camera separate from the vision camera performing the imaging in the steps (a) and (b).
The steps (a), (b), (e), and (f) may be performed in any order.

According to the present invention, an offset value between the first vacuum hole of the collet and the reference point of the substrate on the ejector pin or the chuck table and the offset value between the second vacuum hole of the collet and the center of the first vacuum hole of the collet shaft And the working position of the collet with respect to the ejector pins or the substrate on the chuck table can be accurately set according to the offset values.

Therefore, even if the size of the semiconductor chip is miniaturized, the collet of the picker head can accurately pick up the semiconductor chip to be transferred on the wafer and accurately mount on the substrate on the chuck table.

FIGS. 1 to 6 are cross-sectional views illustrating main parts of a semiconductor package manufacturing apparatus (die bonding apparatus) to which a method of positioning a picker head according to the present invention is applied.
FIGS. 7 to 11 are diagrams for explaining a method of positioning a picker head according to an embodiment of the present invention; FIG. 7 is a perspective view of the picker head according to the present invention; FIG. Reference points, and the like.

Hereinafter, a method of positioning a picker head for a semiconductor package manufacturing apparatus according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

First, the structure of a semiconductor package manufacturing apparatus (die bonding apparatus) to which a method of positioning a picker head according to the present invention is applied will be described with reference to FIG. 1 includes a base 10 configured to be horizontally movable in the X-axis direction on the body of the semiconductor package manufacturing apparatus, a wafer table 20 mounted on the base 10, A first illumination unit 40 provided on one side of the wafer table 20 and a supporting member 55 of a main body of the semiconductor package manufacturing apparatus, A second illuminating unit 60 provided on one side of the chuck table 50 and a second illuminating unit 60 provided on the wafer table 10 while being moved in the X and Y directions from above the base 10 and the chuck table 50. [ A first vision camera 81 fixedly mounted on the upper side of the main body of the semiconductor package manufacturing apparatus; Which is configured to be movable in the X-axis direction on the upper side of the main body 2 comprises a vision camera (82).

The wafer table 20 is fixedly mounted on the base 10 and moves with the base 10. A wafer on which a plurality of individual semiconductor chips (C) are formed is seated on the upper surface of the wafer table (20).

An ejector pin (31) for lifting the semiconductor chip (C) of the wafer to be moved is formed at the center of the ejector (30) so as to protrude upward. The ejector 30 functions to move the semiconductor chip C to be moved up and down with a certain distance up and down with respect to the wafer table 20 by a linear motion device so that the semiconductor chip C can be easily separated .

The first illumination unit 40 emits light upward from one side of the wafer table 20 to provide light for photographing the first vision camera 81. The second illumination unit (60) is installed on one side of the chuck table (50) to provide light for photographing the second vision camera (82).

The picker head 70 performs a pickup operation for vacuum chucking and fixing the semiconductor chip C on the wafer placed on the wafer table 20 and a pickup operation for transferring the semiconductor chip C to the chuck table 50, A collet shaft 71 which is coupled to a linear motion system constituted at an upper portion of the main body and moves in an arbitrary direction of the X, Y and Z axes, And a collet 75 detachably coupled to the lower end of the collet shaft 71 to vacuum-adhere the semiconductor chip C.

A first vacuum hole 72 is formed in the center of the collet shaft 71 so as to pass through the collet shaft 71 in a vertical direction (Z-axis direction). Although not shown in the drawing, the first vacuum hole 72 is connected to an external air pressure forming device to function as a pneumatic flow path forming a vacuum pressure. The upper end of the collet shaft 71 is provided with a light transmitting member 73 that can prevent light leakage through the upper end of the first vacuum hole 72 and transmit light for photographing.

The collet 75 has a conical shape with a sharp bottom end, and a second vacuum hole 76 communicating with the first vacuum hole 72 is formed at the center so as to penetrate in the vertical direction. Here, the second vacuum hole 76 has a diameter smaller than the diameter of the first vacuum hole 72. The collet 75 is replaced with the collet 75 when the kind or size of the semiconductor chip C to be processed is changed. When the collet 75 is replaced, the method of positioning the picker head 70 of the present invention And sets the correct pickup position and place position of the collet (75).

The picker head 70 constructed as described above vacuum-chucks the semiconductor chip C on the wafer while moving to the pick-up position and the place position set by the controller (not shown) of the semiconductor package manufacturing apparatus, (S) of the workpiece W is continuously and repeatedly performed.

An embodiment of a method for setting the work position of the picker head 70 in the semiconductor package manufacturing apparatus having the above-described configuration will be described in detail as follows.

First, as shown in FIG. 1, the base 10 is moved to place the ejector 30 immediately below the first vision camera 81, and then the first vision camera 81 moves the ejector 30 And the position of the ejector pin 31 is detected (see the image of FIG. 7). Of course, the wafer is not seated on the wafer table 20 at this time.

2, in a state in which the collet 75 is not mounted on the collet shaft 71 of the picker head 70, the picker head 70 is moved just below the first vision camera 81 , The base 10 is moved in the X-axis direction so that the first illumination unit 40 is positioned below the picker head 70. That is, the first vision camera 81, the collet shaft 71, and the first illumination unit 40 are arranged substantially in a straight line.

Then, as shown in Fig. 3, the picker head 70 is moved downward to bring it closer to the first illumination unit 40. Fig. In this state, the first vision camera 81 shoots the collet shaft 71 while emitting light through the first illumination unit 40. At this time, since the first vacuum hole 72 of the collet shaft 71 passes through and passes through the light, the image of the first vacuum hole 72 is obtained, and the first vacuum hole 72 (See the A and B drawings in Fig. 8). At this time, if the detected image of the first vacuum hole 72 appears as an oval shape as shown in A of FIG. 8, it means that the collet shaft 71 is inclined with respect to the vertical axis (Z axis). Therefore, in this case, it is desirable to perform an operation of correcting the inclination of the collet shaft 71 so that the image of the second vacuum hole 76 becomes a full circle as shown in FIG. 8B.

As shown in Fig. 4, the collet 75 is mounted on the lower end of the collet shaft 71 of the picker head 70. As shown in Fig. In this state, when the light is emitted through the first illumination unit 40 and the first vision camera 81 shoots the image, the image of the second vacuum hole 76 of the collet 75 is obtained, The position of the second vacuum hole 76 is detected (see the image of FIG. 9).

When the position values of the ejector pin 31, the center of the second vacuum hole 76 of the collet shaft 71 and the collet 75 are detected, the eccentricity (offset ) Of the ejector pin 31. The position of the second vacuum hole 76 of the collet 75 with respect to the ejector pin 31 can be set through this offset value. Here, the 'position setting' means that the position of the collet 75 or the ejector pin 31 is moved by an offset value to match the position of the ejector pin 31 with the second vacuum hole 76 of the collet 75 And setting the position at this time to the pickup position.

When the pickup position of the collet 75 with respect to the ejector pin 31 is set as described above, the position of the collet 75 with respect to the chuck table 50 is set as follows.

4, the second vision camera 82 is placed on the upper side of the chuck table 50, and light is emitted from a separate light source (not shown) located on the side of the second vision camera 82 The second vision camera 82 photographs the reference point 53 (see FIG. 10) and detects a position value with respect to the reference point 53. Here, the reference point 53 may be the center of the semiconductor chip C on the substrate S placed on the chuck table 50.

5, the picker head 70 is moved to the lower side of the second vision camera 82, the second vision camera 82 emits light at the second illumination unit 60, Captures the picker head 70 and detects the position value of the collet 75 with respect to the second vacuum hole 76 (see the image of FIG. 11).

The controller (not shown) of the semiconductor package manufacturing apparatus calculates the offset value between the positional value of the collet 75 and the position of the second vacuum hole 76 detected as described above, 50) of the collet (75).

In this embodiment, the second vision camera 82 photographs one of the reference points 53 on the chuck table 50 to set the place position. However, as shown in FIG. 6, on the chuck table 50, A semiconductor chip C or a semiconductor chip C is placed on the substrate S after the substrate S on which the chip C is to be placed is placed, It is also possible to set the place position by detecting the center point position of the point to be placed.

Although the position of the second vacuum hole 76 of the collet 75 is detected immediately when the collet 75 is mounted on the collet shaft 71 when the place position is set in the above embodiment, The second vision camera 82 is moved to the position value of the collet shaft 71 with respect to the first vacuum hole 72 before the collet 75 is mounted on the collet shaft 71, And then mount the collet 75 and obtain the position value for the second vacuum hole 76 of the collet 75.

In the embodiment described above, the ejector pin 31 is photographed by using the first vision camera 81 to obtain an image. Then, the first vacuum hole 72 of the collet shaft 71 and the collet 75 The image of the second vacuum hole 76 is acquired in order to set the pickup position and the image of the reference point 53 is acquired using the second vision camera 82 and then the second vacuum hole 76) were set up to set the place location. However, the method of positioning the picker head of the present invention may be implemented by performing the above-described image acquisition steps in an arbitrary order different from the above-described embodiment.

For example, an image of the first vacuum hole 72 of the collet shaft 71 and / or the second vacuum hole 76 of the collet 75 is obtained using the first vision camera 81, The ejector pin 31 may be photographed to obtain the positional value with respect to the ejector pin 31. [ An image of the first vacuum hole 72 of the collet shaft 71 and / or the second vacuum hole 76 of the collet 75 is obtained using the second vision camera 82 and then the reference point 53 ) May be obtained.

The steps of setting the pickup position of the collet 75 with respect to the ejector pin 31 using the first vision camera 81 are not performed first and the chuck table 50 Or setting the position of the collet 75 relative to the substrate S on the chuck table 50. [

In the above-described embodiment, the two pickup cameras 81 and 82 are used to set the pickup position and the place position. However, the pickup position and the place position can all be set using one vision camera. In this case, it is preferable that the vision camera is configured to be movable to the upper side of the ejector pin 31 and the upper side of the chuck table 50.

According to the present invention, after the collet 75 is replaced, the second vacuum hole 76 of the collet 75 is offset from the center of the first vacuum hole 72 of the collet shaft 71 by an offset value And the working position of the collet 75 relative to the substrate S on the ejector pin 31 or the chuck table 50 can be accurately set according to these offset values.

10: Base 20: Wafer table
30: Ejector 31: Ejector pin
40: first illumination unit 50: chuck table
60: second illumination unit 70: picker head
71: collet shaft 72: first vacuum hole
75: Collet 76: Second vacuum hole
81: first vision camera 82: second vision camera
C: semiconductor chip S: substrate

Claims (11)

A chuck table provided on a lower side of the wafer and on which an ejector pin for picking up a semiconductor chip to be transferred from the wafer is placed; a chuck table on which a substrate on which the semiconductor chip transferred separated from the wafer is placed, And a second vacuum hole which is detachably coupled to a lower portion of the collet shaft and communicates with the first vacuum hole, the collet shaft being vertically penetrated through the collet shaft, And a collimator for collimating the semiconductor chip formed on the lower surface of the picker head so as to face the picker head, a vision camera provided above the picker head, and a lighting unit for providing light for photographing the vision camera from below the picker head A method for setting a working position of the picker head in a package manufacturing apparatus,
(a) the vision camera photographs the ejector pin to detect the position of the ejector pin;
(b) capturing a first vacuum hole of the collet shaft and detecting a center position of the first vacuum hole in a state where the collet is not mounted on the collet shaft of the picker head;
(c) capturing a second vacuum hole of the collet and detecting a position of the second vacuum hole in a state where the collet is mounted on the collet shaft of the picker head;
(d) calculating an offset value between a position value of the detected ejector pin, a position value of the center of the first vacuum hole of the collet shaft, and a position value of the second vacuum hole of the collet, Setting a working position of the second vacuum hole;
Wherein the steps (a), (b), and (c) are performed in an arbitrary order.
The method according to claim 1, further comprising: (e) photographing a reference point set on a substrate placed on the chuck table by the vision camera and detecting a position with respect to a set reference point;
(f) moving the picker head to a lower side of the vision camera that detects a position with respect to the reference point while the collet is mounted on the collet shaft of the picker head, and the vision camera photographs the second vacuum hole of the collet Detecting the position of the second vacuum hole;
(g) calculating an offset value between a position value of the reference point detected in the step (e) and a position value of the second vacuum hole of the collet obtained in the step (f), and determining an offset value of the second vacuum hole Setting a work location;
Wherein the steps (e) and (f) are performed in an arbitrary order.
The vision camera according to claim 2, wherein the vision camera performing the shooting in steps (a), (b), and (c) is a first vision camera, and the vision camera performing shooting in steps (e) A second vision camera,
Wherein the first vision camera is fixedly mounted on a main body of the semiconductor package manufacturing apparatus, and the second vision camera is installed on the main body so as to be movable in the X axis direction. How to set the location.
3. The method according to claim 2, wherein the steps (a), (b), (c), (e), and (f) are performed in an arbitrary order.
The method according to claim 1, wherein the inclination of the collet shaft is corrected when the image of the first vacuum hole taken after the step (b) is elliptical.
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