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KR101387862B1 - 기판의 처리 방법, 프로그램, 컴퓨터 기억매체 및 기판 처리 시스템 - Google Patents

기판의 처리 방법, 프로그램, 컴퓨터 기억매체 및 기판 처리 시스템 Download PDF

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Publication number
KR101387862B1
KR101387862B1 KR1020090009667A KR20090009667A KR101387862B1 KR 101387862 B1 KR101387862 B1 KR 101387862B1 KR 1020090009667 A KR1020090009667 A KR 1020090009667A KR 20090009667 A KR20090009667 A KR 20090009667A KR 101387862 B1 KR101387862 B1 KR 101387862B1
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KR
South Korea
Prior art keywords
resist pattern
substrate
heat treatment
temperature
dimension
Prior art date
Application number
KR1020090009667A
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English (en)
Korean (ko)
Other versions
KR20090103705A (ko
Inventor
마사히데 다도코로
구니에 오가타
메구미 조사카
Original Assignee
도쿄엘렉트론가부시키가이샤
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Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20090103705A publication Critical patent/KR20090103705A/ko
Application granted granted Critical
Publication of KR101387862B1 publication Critical patent/KR101387862B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020090009667A 2008-03-28 2009-02-06 기판의 처리 방법, 프로그램, 컴퓨터 기억매체 및 기판 처리 시스템 KR101387862B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2008-087901 2008-03-28
JP2008087901A JP5186264B2 (ja) 2008-03-28 2008-03-28 基板の処理方法、プログラム、コンピュータ記憶媒体及び基板処理システム

Publications (2)

Publication Number Publication Date
KR20090103705A KR20090103705A (ko) 2009-10-01
KR101387862B1 true KR101387862B1 (ko) 2014-04-22

Family

ID=41307596

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090009667A KR101387862B1 (ko) 2008-03-28 2009-02-06 기판의 처리 방법, 프로그램, 컴퓨터 기억매체 및 기판 처리 시스템

Country Status (2)

Country Link
JP (1) JP5186264B2 (ja)
KR (1) KR101387862B1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5391055B2 (ja) * 2009-12-25 2014-01-15 東京エレクトロン株式会社 半導体装置の製造方法及び半導体装置の製造システム
JP5107372B2 (ja) * 2010-02-04 2012-12-26 東京エレクトロン株式会社 熱処理装置、塗布現像処理システム、熱処理方法、塗布現像処理方法及びその熱処理方法又は塗布現像処理方法を実行させるためのプログラムを記録した記録媒体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273586A (ja) 2003-03-06 2004-09-30 Toshiba Corp パターン形成方法および該パターン形成方法を用いた半導体装置の製造方法
JP2005129761A (ja) 2003-10-24 2005-05-19 Toshiba Corp ホールパターン形成方法及び半導体装置の製造方法
JP2008004591A (ja) 2006-06-20 2008-01-10 Tokyo Electron Ltd 基板の処理方法、プログラム、コンピュータ読み取り可能な記録媒体及び基板の処理システム

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273586A (ja) 2003-03-06 2004-09-30 Toshiba Corp パターン形成方法および該パターン形成方法を用いた半導体装置の製造方法
JP2005129761A (ja) 2003-10-24 2005-05-19 Toshiba Corp ホールパターン形成方法及び半導体装置の製造方法
JP2008004591A (ja) 2006-06-20 2008-01-10 Tokyo Electron Ltd 基板の処理方法、プログラム、コンピュータ読み取り可能な記録媒体及び基板の処理システム

Also Published As

Publication number Publication date
KR20090103705A (ko) 2009-10-01
JP5186264B2 (ja) 2013-04-17
JP2009245996A (ja) 2009-10-22

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