KR101152887B1 - Fixing apparatus for substrate and apparatus for inspecting a substrate having the same - Google Patents

Abstract

According to the present invention, a plurality of first substrate fixing parts and second substrate fixing parts having slits formed on one surface facing each other and formed to face each other are formed in the inserting direction of the substrate, and the first substrate fixing part and the second substrate fixing part are disposed on the slits. Including fixing means for fixing both sides of the substrate to be inserted,
The present invention relates to a substrate holding apparatus and a substrate inspection apparatus including the same, in which one substrate can be inserted and fixed at an accurate position and the substrate is prevented from being broken / broken when being fixed.

Description

Substrate fixing apparatus, substrate inspection apparatus including the same, and substrate inspection method using the same {FIXING APPARATUS FOR SUBSTRATE AND APPARATUS FOR INSPECTING A SUBSTRATE HAVING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate fixing apparatus, and more particularly, to a substrate fixing apparatus which is fixed by pneumatics after a substrate is inserted and accompanied by a cleaning process, and a substrate inspection apparatus including the same.

In general, the substrate fixing device is variously used in the process of manufacturing and inspecting a printed circuit board (PCB), a semiconductor substrate, and an LCD panel.

However, the conventional substrate fixing device is composed of a configuration of lifting the substrate to the desired position by lifting the vacuum chuck and then put down, the configuration of the equipment is very complicated, there is a disadvantage that the inspection is not easy because the substrate is not fixed to the desired position.

In addition, when two or more substrates are adsorbed according to the type of the substrate, the plurality of substrates are lifted up to the equipment, so that it is not easy to grasp the total quantity.

In addition, particles are inevitably generated during manufacture or transportation of the substrate, and there is a problem that a cleaning process must be further involved to remove the particles.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate fixing apparatus capable of inserting and fixing only one substrate at an accurate position and a substrate inspection apparatus including the same.

Still another object of the present invention is to provide a substrate fixing apparatus which prevents breakage of the substrate by fixing the substrate using pneumatic pressure.

It is still another object of the present invention to provide a substrate holding apparatus which may involve a cleaning process for removing particles when the substrate is inserted.

In order to achieve the above object, one feature of the present invention is a plurality of first substrate fixing part and the second substrate fixing part which is formed spaced apart from each other and facing each other are formed in the insertion direction of the substrate, the first substrate The fixing part and the second substrate fixing part include fixing means for fixing both sides of the substrate inserted into the slit.

In this case, the first substrate fixing part and the second substrate fixing part include an upper part and a lower part separated by the slit, and the upper part is formed with a space in which an air cylinder can move, and one end of the space part is an upper surface of the slit. Passing through and the other end is configured to be connected to the first through hole.

And the air cylinder is mounted on the lower elastic member.

In addition, the upper end is formed with an upper air injection hole connected to the space portion on the opposite surface, the upper air injection hole is formed higher than the end when the air cylinder is lowered to the maximum.

In order to achieve the above object, another feature of the present invention includes a substrate inspection apparatus including a substrate holding apparatus.

In order to achieve the above object, another feature of the present invention is a first step of inserting a substrate in a slit formed on one surface facing the first substrate fixing portion and the second substrate fixing portion spaced apart from each other, and the substrate is inserted And driving a compressor to lower the air cylinders mounted inside the first substrate fixing unit and the second substrate fixing unit to fix the substrate, and the first substrate fixing unit and / or the second substrate fixing unit. A third step of injecting air to the substrate through an air injection hole formed in the government, and a fourth step of determining whether the substrate is defective; And a fifth step of raising the air cylinder and removing the substrate.

According to the present invention, one substrate can be inserted and fixed at an accurate position, and there is an advantage in that breakage of the substrate is prevented during fixing.

In addition, it is possible to remove particles at the same time the substrate is fixed, the configuration has the advantage of being simple.

1 is a perspective view of a substrate fixing apparatus according to an embodiment of the present invention,
2 is a plan view of the substrate holding apparatus of one embodiment of the present invention,
3 is a cross-sectional view along AA direction of FIG. 1,
4 is a cross-sectional view showing a configuration in which air is released from the first substrate fixing part according to an embodiment of the present invention;
5 is a schematic diagram showing a process of removing particles of a substrate by a substrate holding apparatus according to an embodiment of the present invention,
6 is a perspective view of a substrate fixing apparatus according to another embodiment of the present invention.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description.

It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms.

The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the second component may be referred to as a first component, and similarly, the first component may also be referred to as a second component.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected or connected to that other component, but it may be understood that other components may be present in between. Should be.

On the other hand, when an element is referred to as being "directly connected" or "directly connected" to another element, it should be understood that there are no other elements in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

In addition, it is to be understood that the accompanying drawings in this application are shown enlarged or reduced for convenience of description.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in detail with reference to the drawings. Like reference numerals designate like elements throughout, and duplicate descriptions thereof will be omitted.

1 is a perspective view of a substrate fixing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of a substrate fixing apparatus according to an embodiment of the present invention, FIG. 3 is a cross-sectional view along AA direction of FIG. 1, and FIG. 4 is an embodiment of the present invention. 5 is a cross-sectional view illustrating a configuration in which air is emitted from a first substrate fixing part according to an example, and FIG. 5 is a schematic view illustrating a process of removing particles from a substrate by a substrate fixing apparatus according to an exemplary embodiment of the present invention.

In the substrate fixing apparatus according to the embodiment of the present invention, a plurality of first substrate fixing parts 100 and second substrate fixing parts 200 are formed in the insertion direction of the substrate P, and the first substrate fixing parts 100 are provided. ) And the second substrate fixing part 200 include fixing means for fixing both sides of the substrate P inserted into the slit S.

In this case, not only a printed circuit board (PCB) but also a substrate formed in a plate shape such as a flexible printed circuit board (FPCB), a semiconductor substrate, and an LCD panel may be used as the substrate P.

The first substrate fixing part 100 and the second substrate fixing part 200 are formed with slits S formed on surfaces facing each other and spaced apart from each other by a predetermined distance. In this case, a predetermined distance between the first substrate fixing part 100 and the second substrate fixing part 200 corresponds to the width of the substrate P, and the interval between the slits S corresponds to the thickness of the substrate P. do.

The first substrate fixing part 100 and the second substrate fixing part 200 are formed in plural in the direction in which the substrate P is inserted, and the first substrate fixing part 100 and the second substrate fixing part ( The number of 200 may be appropriately selected corresponding to the length of the substrate (P).

The first substrate fixing part 100 and the second substrate fixing part 200 are fixedly coupled to the main body 400, and the main body 400 has an opening in which the substrate P is inserted and a jaw on the opposite side. It may be formed in a 'c'-shaped formed, but is not necessarily limited to this configuration is sufficient if the first substrate fixing part 100 and the second substrate fixing part 200 can be fixed to a desired position.

The interval of the slit (S) is formed to correspond to the thickness of the substrate (P) is not possible to insert when two substrates (P) is adsorbed in the transport process can be checked the exact quantity of the substrate (P) Since the substrate P is inserted in the form of a card inserter, there is an advantage that it can be inserted accurately.

At this time, the interval between the first substrate fixing portion 100 and the second substrate fixing portion 200 may be configured to be adjustable according to the size of the substrate, the interval of the slit (S) is also adjusted according to the thickness of the substrate It is desirable to be configured to be.

Referring to FIG. 3, the first substrate fixing part 100 and the second substrate fixing part 200 are divided into an upper end 110 and a lower end 120 based on the slit S. Referring to FIG. Hereinafter, the description will be made based on the first substrate fixing part 100 for convenience of description.

A space 113 through which the air cylinder 111 can move is formed in the upper end 110. The lower end of the space 113 passes through a part of the upper surface 118 of the slit S. It is formed vertically.

The upper end of the space 113 is connected to the outside by the first through hole 115. In this case, the first through hole 115 may be located at an upper end of the space 113, and a point connected to the space 113 may be variously modified. Therefore, when air is introduced into the first through hole 115 from the outside, it is configured to be discharged to the lower end of the space portion 113.

An air cylinder 111 having a size corresponding to the space 113 is inserted into the space 113, and an elastic member 112 is mounted below the air cylinder 111. The elastic member 112 may be used as a silicon ball, but is not necessarily limited thereto, and the elastic member 112 may be variously applied as long as the material does not exert excessive pressure on the substrate.

Therefore, according to the present invention, in addition to the general PCB substrate, it is also possible to apply a substrate that is not easy to handle, such as an LCD panel.

One surface 110a of the first substrate fixing portion 100 facing the second substrate fixing portion 200 is formed to have an upper air injection hole 116 connected to the space portion 113 to be elongated. The pores 116 may be formed to be wider toward the inside and be inclined upward.

The lower part 120 has a lower air injection hole 121 formed on one surface 120a facing the second substrate fixing part 200, and the lower air injection hole 121 is tapered toward the inside. . End 122 of the lower air injection hole 121 may be formed in a cylindrical shape to facilitate manufacturing and air injection.

The end 122 of the lower air injection hole 121 may be connected to the second through hole 123 to be connected to the outside. However, such a configuration may be variously modified, and may be freely deformed if air is introduced into the end of the lower air injection hole 121.

Referring to FIGS. 1 and 3, the first substrate fixing part 100 and the second substrate fixing part 200 exemplify only the case where the upper end 110 and the lower end 120 correspond to each other 1: 1. Depending on the shape, two or more upper ends 110 may be coupled to one lower end 120. At this time, it is obvious that the lower air injection hole 121 formed in the lower end 120 is extended by the length of the extended lower end 120.

Hereinafter, with reference to FIG. 4 will be described in detail the configuration for fixing the side of the substrate inserted into the slit (S) and the configuration in which air is released.

As shown in FIG. 4, the first through hole 115 and the second through hole 123 are connected to the compressor 300 installed outside to supply air. In this case, a plurality of compressors 300 may be installed and connected to the first through hole 115 and the second through hole 123, respectively.

First, when the air cylinder 111 fixes the substrate P, air is supplied from the compressor 300 to the space portion 113 through the first through hole 115. It descends by air pressure. At this time, since the elastic member 112 is mounted below the air cylinder 111, the elastic member 112 presses and fixes the side surface of the substrate P inserted into the slit S.

In this case, if air is continuously supplied to maintain the air, the air may leak into the minute gap between the space 113 and the air cylinder 111 and be discharged to the slit S to be injected into the center of the substrate P. have. For this purpose, the spacing of the slits S may be manufactured to be wider than the thickness of the substrate P.

In addition, since the upper air injection hole 116 is formed higher than the height when the air cylinder 111 descends to the maximum, the elastic member 112 presses the substrate P. Air is sprayed toward. In addition, since the upper air injection hole 116 is tapered, air is sufficiently injected to the center of the substrate P to remove particles remaining on the substrate P.

Since the compressor 300 is connected to the lower air injection hole 121 of the lower end 120, when the valve 310 is opened after the substrate is fixed, air is injected onto the lower surface of the substrate P to expose the substrate P. There is an advantage in that it can remove all the particles remaining on the bottom.

Referring to FIG. 5, the substrate P may be formed by the upper air jetting holes 116 formed at the upper ends of the first substrate fixing part 100 and the second substrate fixing part 200 and the lower air jetting holes 121 formed at the lower ends thereof. Since the air is evenly sprayed on the upper and lower surfaces of), all the fine particles remaining on the substrate are removed. In this case, reference numerals denote the upper end 210 and the lower end 220, the upper air injection hole 216, and the lower air injection hole 221 of the second substrate fixing part 200.

In this case, the particles of the substrate may be removed by adjusting the air pressure in consideration of the material or type of the substrate P and the remaining state of the particles.

This configuration allows the substrate to be fixed to the inspection apparatus while the cleaning process can be performed at the same time.

6 is a perspective view of a substrate fixing apparatus according to another embodiment of the present invention.

Substrate fixing device according to another embodiment of the present invention is integrally formed with a plurality of upper ends (120) and the upper end of the lower end portion 120 and the lower end portion 120 is formed in the longitudinal direction of the lower air injection hole (121) ( 110).

One end of the lower air injection hole 121 is connected to a compressor and supplies air to the lower air injection hole 121.

Hereinafter, since the configuration of the upper end 110 and the lower end 120, the insertion method and the cleaning process of the substrate are the same as in the above-described embodiment, further description will be omitted to avoid duplication.

The substrate fixing apparatus according to the embodiment of the present invention can be mounted and used in the substrate inspection apparatus. In this case, the board inspection apparatus may be applied to various inspection apparatuses for inspecting a substrate, such as a printed circuit board inspection apparatus, an LCD panel inspection apparatus, and an LED package inspection apparatus, and the configuration of the inspection apparatus itself may be applied as it is known. Any further details are omitted.

In the substrate inspection method using the substrate fixing apparatus according to the embodiment of the present invention, the substrate is inserted into the slit S formed on one surface of the first substrate fixing part 100 and the second substrate fixing part 200 spaced apart from each other. After the substrate is inserted, the compressor 300 is driven to lower the air cylinder 111 mounted in the first substrate fixing part 100 and the second substrate fixing part 200. A second step of fixing the substrate, a third step of injecting air to the substrate through air injection holes formed in the first substrate fixing portion and / or the second substrate fixing portion 200, and the substrate is defective. The fourth step of determining the presence and absence, and the fifth step of raising the air cylinder 111 and pull out the substrate.

First, the first step is to insert the substrate into the slit (S), which is easier to insert and can be inserted in the correct position compared to the conventional configuration to pick up the substrate and seated on the inspection device, while the height of the slit (S) is Since it is configured to correspond to the substrate P, there is no problem that two or more substrates are misinserted, and thus the accuracy of the quantity can be obtained.

Thereafter, the second step is to drive the compressor 300 to blow air into the space 113 to pressurize and fix the side surface of the substrate P inserted into the slit S by lowering the air cylinder 111. to be. At this time, since the elastic member 112 is mounted on the lower end of the air cylinder 111, the fixing is possible without applying excessive force to the inserted substrate P.

The third step is a cleaning process in which air of the compressor 300 is discharged to the outside of the first substrate fixing part 100 and the second substrate fixing part 200 in a state where the substrate is fixed to remove particles of the substrate.

Since the air of the compressor 300 is ejected into the gap between the upper air jetting hole 116 and the slit S and is injected toward the center of the substrate, there is an effect of removing particles generated during the manufacturing process of the substrate. At this time, since the air is ejected from the lower air jet hole 121 located in the lower portion of the substrate, it is possible to remove particles formed in the lower portion of the substrate.

The fourth step is an inspection step of the substrate, and various inspection methods may be selected according to the type of the substrate. For example, when the substrate is a PCB, the copper foil layer may be etched to check whether there is a short circuit in the patterned circuit. In the case of an LCD panel, the electrode pattern may be formed and the thickness may be inspected.

At this time, since the substrate is inserted in the correct position by the first substrate fixing part 100 and the second substrate fixing part 200, there is an advantage that the substrate is accurately aligned with the inspection position of the inspection apparatus.

Finally, the fifth step is to extract the substrate after the inspection, turn off the compressor 300, open the vacuum valve of the vacuum pump (not shown) to lift the air cylinder 111 to the upper side and then the substrate The process is completed by pulling in the opposite direction of the insertion.

100: first substrate fixing portion 110: upper portion
111: air cylinder 112: elastic member
113: space portion 115: first through hole
116: upper air injection hole 200: second substrate fixing part
300: compressor

Claims (15)

A plurality of first substrate fixing parts and second substrate fixing parts having slits formed on one surface facing each other and facing each other are formed in the insertion direction of the substrate,
The first substrate fixing portion and the second substrate fixing portion includes a fixing means for fixing both sides of the substrate inserted into the slit. The method of claim 1, wherein the first substrate fixing portion and the second substrate fixing portion are divided into upper and lower portions by the slit,
The upper end portion is formed inside the space that can move the air cylinder, the space portion is formed through the upper surface of the slit and the substrate fixing device that the end is connected to the through hole. The substrate holding apparatus of claim 2, further comprising a compressor connected to the through hole to inject air. The substrate holding apparatus of claim 2, wherein the air cylinder is mounted on an elastic member at a lower portion thereof. The substrate of claim 2, wherein the upper end is formed with an upper air injection hole connected to the space part on the opposite surface, and the upper air injection hole is formed at a position higher than an end when the air cylinder descends to the maximum. Fixing device. The method of claim 2,
The lower end portion of the substrate fixing device is formed with a lower air injection hole on the opposite surface. The substrate fixing apparatus of claim 6, wherein the lower air jetting hole is wider inwardly. The substrate fixing apparatus of claim 2, wherein a plurality of upper ends are coupled to the lower ends. The apparatus of claim 2, wherein the lower end portion is integrally formed in a 'c' shape in which a direction in which the substrate is inserted is opened. 10. The substrate fixing apparatus of claim 9, wherein lower end air injection holes are formed on one side of the lower end of the lower air injection hole. The substrate fixing apparatus of claim 1, wherein a distance between the first substrate fixing unit and the second substrate fixing unit is adjustable. A substrate inspection apparatus comprising a substrate holding apparatus according to any one of claims 1 to 11. A first step of inserting the substrate into slits formed on opposite surfaces of the first substrate fixing part and the second substrate fixing part spaced apart from each other;
A second step of fixing the substrate by lowering an air cylinder mounted inside the first substrate fixing part and the second substrate fixing part by driving a compressor after the substrate is inserted;
A third step of injecting air to the substrate through air injection holes formed in the first substrate fixing portion and / or the second substrate fixing portion;
A fourth step of determining whether the substrate is defective; And
And a fifth step of raising the air cylinder and removing the substrate. The method of claim 13, wherein the first substrate fixing part and the second substrate fixing part are formed in plural in the insertion direction of the substrate. The method of claim 13, wherein the air cylinder has a lower elastic member mounted thereon.

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