JP3931215B2 - Conductive ball mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an improvement of a conductive ball mounting apparatus, and was developed mainly for an apparatus for removing unnecessary conductive balls held on a conductive ball holding surface of a mounting head.
[0002]
[Prior art]
Conventionally, in a conductive ball mounting device, a method for inspecting and removing unnecessary conductive balls (extra balls, double balls, etc.) adsorbed and held by the mounting head before mounting with a detecting means, or a conductive ball mounted object There has been a method of detecting and removing unnecessary conductive balls (remain balls, etc.) left on the mounting head after being mounted on.
[0003]
However, whether detecting an unnecessary conductive ball before mounting or detecting an unnecessary conductive ball after mounting, only the detection of the presence or absence of the unnecessary conductive ball is detected and the position is detected and removed. There was nothing to do.
[0004]
Several means for removing unnecessary conductive balls have also been disclosed, but they have only been used to apply removal means such as suction, application of vibration, vacuum breakage, and blowing of compressed air to the entire mounting head. In addition, in these removing means, the removal force that acts on the unnecessary conductive balls may exceed the holding force of the unnecessary conductive balls of the mounting head so as not to affect the properly attracted conductive balls. It was not possible to remove only the unnecessary conductive balls. Further, in the re-main ball, since the conductive ball is fitted in the suction hole of the mounting head, it cannot be removed by the conventional removing means. Accordingly, it is necessary to manually remove the conductive ball mounting device.
[0005]
[Problems to be solved by the invention]
In view of this, the present invention provides the detection means with a position on the holding surface of an unnecessary conductive ball that is excessively held by the mounting head that holds the conductive ball by suction at the supply portion, or the mounting portion is conductive to the object to be mounted. The detection means detects the position on the holding surface of the unnecessary conductive ball held without being mounted on the mounting head after the ball is mounted, and the removal means is also a partial removal means. Conductive ball that can be removed by acting partially on the position of the unnecessary conductive ball, and can remove the unnecessary conductive ball accurately and reliably without stopping the conductive ball mounting device An object is to provide a mounting device.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the present invention employs the following means for the conductive ball mounting apparatus.
1stly, the supply part of an electroconductive ball, the mounting head which has a holding surface which adsorbs and hold | maintains an electroconductive ball to a some adsorption | suction hole, the mounting part which supports the to-be-mounted object in which an electroconductive ball is mounted, supply And a moving mechanism that relatively moves the mounting head between the mounting portion and the mounting portion.
Secondly, a conductive ball mounting apparatus for mounting a conductive ball held in a supply unit by a mounting head on an object to be mounted in the mounting unit.
Third, a detecting means for detecting the position of an unnecessary conductive ball on the holding surface is provided.
Fourthly, a partial removal means is provided that partially acts on the position detected by the detection means to remove unnecessary conductive balls.
Fifth, the detection means and the partial removal means are provided in the relative movement path of the mounting head between the supply section and the mounting section.
Sixth, the partial removal means includes a nozzle that applies a suction force or an injection pressure, and a moving mechanism that moves the nozzle relatively laterally with respect to the mounting head.
Seventh, before mounting the conductive ball, the suction force or spray pressure is applied to remove the unnecessary conductive ball. After mounting the conductive ball, the nozzle is applied to the unnecessary conductive ball by the moving mechanism. Remove by touching.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described together with examples according to the drawings. FIG. 1 is a schematic explanatory view showing the entire solder ball mounting apparatus 1. In the embodiment, a solder ball 2 having a diameter of 0.1 mm is used as a conductive ball in the present invention. Of course, the conductive ball in the present invention is not limited to the solder ball 2. In the embodiment, the wafer 31 is used as an object to be mounted. However, it is a matter of course that a printed wiring board such as a BGA board may be used.
[0008]
The solder ball mounting device 1 includes, from the left in FIG. 1, a ball supply device 3 in which a large number of solder balls 2 are stored, a mounting head 4 that holds the solder balls 2 by vacuum suction, and a large number of solder balls 2. And the entire lower surface of the mounting head 4 that holds the entire surface, and the entire surface removing device 5 that removes unnecessary solder balls 22 and 23 and the X-axis moving device 6 of the mounting head 4 (in FIG. 1). (Moving device to the left and right), Z-axis moving device 7 for the mounting head 4 (moving device for the up and down direction in FIG. 1), inspection camera 8 for detecting the positions of unnecessary solder balls 22 and 23, and unnecessary solder balls 22 , 23 and a partial removal device 9 that exerts a higher removal action than the entire surface removal device 5 and a Y-Θ table 32 on which a wafer 31 moving in the Y-Θ axis direction is placed. ing.
[0009]
The X-axis moving device 6 (moving device to the left and right in FIG. 1) of the mounting head 4 and the Z-axis moving device 7 (moving device in the vertical direction in FIG. 1) of the mounting head 4 are the supply unit in the present invention. That is, the moving mechanism moves the mounting head 4 relatively between the ball supply device 3 and the mounting portion, that is, the Y-Θ table 32. Of course, it suffices if it is relatively movable, so that the Y-Θ table 32 or the like may move, or both of them may move.
[0010]
The movement of the mounting head 4 in the X-axis moving device 6 and the Z-axis moving device 7 is as follows: the upward movement of the ball supply device 3; the vertical movement for attracting the ball; the upward movement of the Y-Θ table 32; There is up and down movement for.
[0011]
The Y-Θ table 32 has a Θ-axis drive unit installed on the Y-axis drive table, and is configured to be movable in the Y-axis direction (front-rear direction in the figure) and Θ-axis direction (rotation direction). Used for alignment when mounting.
[0012]
In the mounting head 4, a ball holding surface 11 in which a plurality of suction holes 15 for sucking and holding the solder balls 2 are arranged in a matrix is formed on the lower surface of the mounting head 4. The mounting head 4 is connected to a vacuum source (not shown), and sucks and holds the solder balls 2 in the suction holes 15 formed in the ball holding surface 11 by the negative pressure from the vacuum source.
[0013]
The entire surface removal device 5 is provided with a suction nozzle that sucks and removes unnecessary solder balls 22 on the ball holding surface 11 of the mounting head 4. The suction nozzle has the width of the ball holding surface 11 in the front-rear direction of FIG. It is composed of a corresponding horizontally long nozzle. In the embodiment, the size of the suction opening of the suction nozzle is the length of the ball holding surface 11, specifically, the length of 220 mm when the wafer 31 is 8 inches, and the opening width is 2 mm.
[0014]
The entire surface removal device 5 is equipped with a lifting device (not shown). As the entire surface removing device 5 is lifted by the lifting device and the mounting head 4 is lowered, the two are relatively close to each other, and the mounting head 4 is above the entire surface removing device 5 in a direction intersecting the longitudinal direction of the suction nozzle. By moving laterally, the unnecessary solder balls 22 that act on the entire surface of the ball holding surface 11 of the mounting head 4 act on the unnecessary solder balls 22 and try to remove the unnecessary solder balls 22.
[0015]
In the embodiment, the speed of the lateral movement of the mounting head 4 during the ball removing operation by the entire surface removing device 5 is 30 mm / second, and the time during which the suction nozzle having a width of 2 mm can directly act on one unnecessary solder ball 22. Is approximately 0.07 seconds. In this embodiment, suction under this condition does not cause the suction force of the entire surface removing device 5 to exceed the suction force of the suction holes 15 and does not remove the solder balls 2 that have been properly sucked into the suction holes 15.
[0016]
The inspection camera 8 detects the position of the unnecessary solder ball 22. To be precise, the ball of the unnecessary solder ball 22 held excessively by the mounting head 4 that holds the solder ball 2 by suction with the ball supply device 3. The position on the holding surface 11 or the position on the ball holding surface 11 of the unnecessary solder ball 23 held without being mounted on the mounting head 4 after mounting the solder ball 2 on the wafer 31 at the mounting portion is detected. Is.
[0017]
That is, the detection of the unnecessary solder balls 22 and 23 by the inspection camera 8 is performed both on the forward path (movement path before mounting the ball) and the return path (movement path after mounting the ball) of the mounting head 4. FIG. 4A is an inspection image detected by the inspection camera 8 in the forward path. The solder ball 2 that is properly attracted and held and the unnecessary solder ball 22 that is a surplus ball are detected on the ball holding surface 11. ing. On the other hand, FIG. 4B is an inspection image detected by the inspection camera 8 on the return path, and the remaining balls that have not been mounted are detected on the ball holding surface 11 as unnecessary solder balls 23. In the figure, reference numeral 15 denotes an adsorption hole.
[0018]
The partial removal device 9 that partially acts on the positions of unnecessary solder balls 22 and 23 on the ball holding surface 11 includes a cylindrical partial suction nozzle 10 having a circular suction port opened on the upper surface, The partial suction nozzle 10 is connected to a vacuum source (not shown) via a suction passage 16. The suction opening diameter of the partial suction nozzle 10 is 0.8 mm, and the outside air flowing from almost the entire circumference of the unnecessary solder ball 22 acts by being positioned so as to surround the unnecessary solder ball 22. Compared with the case where outside air flows in from the short direction like a suction nozzle, a stronger removal force can be obtained. Accordingly, when the suction is stopped for longer (1 second or longer) than the entire surface removal device 5, the suction opening may be smaller than the suction nozzle of the entire surface removal device 5, and the suction nozzle of the entire surface removal device 5 It can be removed with a higher suction force and exhibits a higher removing action than the entire surface removing device 5.
[0019]
The removal operation of the unnecessary solder balls 22 and 23 by the partial suction nozzle 10 is performed as follows. Unnecessary solder balls 22 such as extra balls and double balls in the forward path are sucked and removed, and unnecessary solder balls 23 such as return balls in the backward path are removed by bringing the partial suction nozzle 10 into contact therewith. The partial removing device 9 is equipped with an air cylinder 12 for raising and lowering the partial suction nozzle 10 and a Y-axis moving mechanism 13 for moving in the front-rear direction in FIG.
[0020]
FIG. 3A is a diagram showing a removing operation at the partial suction nozzle 10 before mounting the ball. As shown in the figure, the tip of the partial suction nozzle 10 is positioned so as to surround the lower part of the unnecessary solder ball 22, and the solder ball 2 that is normally held in the suction hole 15 has a ball protrusion amount of 100 microns in diameter. 2 is about 90 microns, so that the suction speed of the external suction from the periphery of the tip of the partial suction nozzle 10 is increased by sucking the tip of the partial suction nozzle 10 as close to the ball holding surface 11 as possible without interfering with the tip. Thus, the unnecessary solder balls 22 are surely removed. Of course, the removal force of the partial suction nozzle 10 is set to be weaker than the suction force of the suction hole 15 in order not to remove the solder ball 2 normally held in the suction hole 15.
[0021]
FIG. 3B is a diagram showing the removal operation by the partial suction nozzle 10 after the ball is mounted, and the diameter of the ball diameter becomes maximum in the vertical direction of the unnecessary solder ball 23 protruding from the ball holding surface 11. The tip of the partial suction nozzle 10 is raised above the height (it may contact the ball holding surface 11), and the unnecessary solder ball 23 is surrounded by the inner edge of the suction opening of the partial suction nozzle 10 to the diameter of the suction opening. And the unnecessary solder ball 23 is removed from contact with the inner edge of the partial suction nozzle 10.
[0022]
In the embodiment, the entire surface removal device 5, the inspection camera 8, and the partial removal device 9 are provided in the movement path of the mounting head 4 between the ball supply device 3 and the Y-Θ table 32. However, in the present invention, the moving route may be a relative one.
[0023]
Next, the operation of the partial removal apparatus as well as the operation of the solder ball mounting apparatus 1 will be described. First, the X-axis moving device 6 is operated, and the mounting head 4 is moved above the ball supply device 3. Next, the mounting head 4 is lowered by the operation of the Z-axis moving device 7, and the solder ball 2 is adsorbed from the ball supply device 3 to the adsorption hole 15 provided in the ball holding surface 11 of the mounting head 4, and the solder ball 2. Is lifted by the Z-axis moving device 7 again.
[0024]
After the ascent, the mounting head 4 starts moving rightward in FIG. 1 by the X-axis moving device 6 and reaches above the entire surface removing device 5. Here, the lifting / lowering device of the entire surface removing device 5 is operated to approach the lower surface of the mounting head 4 and the unnecessary solder balls 22 are removed from the entire surface of the ball holding surface 11.
[0025]
After the removing operation of the entire surface removing device 5, the mounting head 4 continues to move further to the right in FIG. 1 by the X-axis moving device 6 and reaches above the inspection camera 8. Here, the inspection camera 8 takes an image of the ball holding surface 11 and unnecessary solder held by the mounting head 4 that holds the solder ball 2 by suction with the ball supply device 3 by image processing based on the shooting data. The position of the ball 22 on the ball holding surface 11 is recognized and detected.
[0026]
Thus, when the unnecessary solder ball 22 that cannot be removed by the entire surface removing device 5 is found, the mounting head 4 reaches above the partial removing device 9 and the ball holding surface 11 of the unnecessary solder ball 22 by the partial removing device 9. A partial removal operation is performed on. Specifically, based on the detection result of the inspection camera 8, the mounting head 4 is moved by the X-axis moving device 6, and the partial suction nozzle 10 is moved by the Y-axis moving mechanism 13, so that partial suction is performed below the unnecessary solder balls 22. The nozzle 10 is aligned, and the partial suction nozzle 10 is lifted by the air cylinder 12 and is removed by applying a suction force close to the unnecessary solder ball 22.
[0027]
After the unnecessary solder ball 22 is removed, the mounting head 4 further moves to the right in the drawing and moves above the ball mounting position of the Y-Θ table 32. Next, the mounting head 4 is lowered by the Z-axis moving device 7 to perform a ball mounting operation on the wafer 31.
[0028]
After the ball mounting operation, the mounting head 4 enters the return path toward the ball supply device 3, but when it reaches the upper side of the inspection camera 8 during the return path, the unnecessary solder ball 23 remaining on the mounting head 4 is recognized by the inspection camera 8. The position on the ball holding surface 11 is detected. Here, when the remaining unnecessary solder balls 23 are detected, the mounting head 4 moves upwardly of the partial removal device 9 and the partial removal device 9 performs a partial removal operation on the ball holding surface 11. Is called. Specifically, according to the detection result of the inspection camera 8, the partial suction nozzle 10 is aligned below the position of the unnecessary solder ball 23 by the same operation as that performed in the outward path, and is lifted by the air cylinder 12 and remains unnecessary. The solder ball 23 is surrounded by its tip opening, and the mounting head 4 is moved by the X-axis moving device 6 so that the partial suction nozzle 10 is brought into contact with the remaining unnecessary solder ball 23 and removed.
[0029]
Thereafter, the mounting head 4 returns to the ball supply device 3 and a series of operations of the solder ball mounting device 1 is completed. During the series of operations, in the embodiment, the unnecessary solder balls 22 and 23 are detected twice by the inspection camera 8 in the forward path and the backward path. However, in the present invention, either one may be selected according to the purpose. . Further, the removal operation using the entire surface removal device 5 may be omitted.
[0030]
As described above, the case of using the partial suction nozzle 10 that is removed by suction has been described as an example of the partial removal device 9. However, in the present invention, the unnecessary conductivity is removed as the partial removal device 9 that removes the unnecessary conductive balls 22 and 23. The present invention can also be used when using an injection nozzle that removes the balls 22 and 23 by applying an injection pressure, or when using an adsorption member or a gripping member that removes the balls 22 and 23 by directly acting on the unnecessary conductive balls 22 and 23.
[0031]
【The invention's effect】
According to the present invention, the detecting means is electrically conductive to the object to be mounted at the position on the holding surface of the unnecessary conductive ball held excessively by the mounting head that holds the conductive ball by suction at the supply portion, or at the mounting portion. Since the position on the holding surface of the unnecessary conductive ball held without being mounted on the mounting head after mounting the ball is detected, the partial removal means can be directly operated.
[0032]
Since the partial removal means can be adopted as the unnecessary conductive ball removal means, the position of the conductive ball detected by the detection means can be partially acted on without stopping the conductive ball mounting device. Thus, a conductive ball mounting apparatus capable of accurately and reliably removing unnecessary conductive balls is obtained.
[Brief description of the drawings]
FIG. 1 is a schematic explanatory view showing the entire solder ball mounting apparatus according to the present embodiment. FIG. 2 is a front explanatory view showing a partial removing apparatus. FIG. 3 is an explanatory view showing the relationship between unnecessary solder balls and partial suction nozzles. (A) shows the removing operation before the ball is mounted, and (B) is a diagram showing the removing operation after the mounting.
FIGS. 4A and 4B are plan explanatory views showing inspection images with a detection camera, where FIG. 4A is a view showing an inspection image before mounting a ball, and FIG. 4B is a view showing an inspection image after mounting;
[Explanation of symbols]
1. . . . . . 1. Solder ball mounting device . . . . . 2. Solder balls . . . . . 3. Ball supply device . . . . . 4. Installation head . . . . . 5. Whole surface removal device . . . . . X-axis moving device 7. . . . . . Z-axis moving device 8. . . . . . . Inspection camera9. . . . . . Partial removal apparatus 10. . . . . Partial suction nozzle 11. . . . . Ball holding surface 12. . . . . Air cylinder 13. . . . . Y-axis moving mechanism 14. . . . . Suction passage 15. . . . . Adsorption hole 16. . . . . Suction passages 22, 23. . Unnecessary solder balls 31. . . . . . Wafer 32. . . . . . Y-Θ table

Claims (1)

  A conductive ball supply unit, a mounting head having a holding surface for sucking and holding the conductive ball in a plurality of suction holes, a mounting unit for supporting an object on which the conductive ball is mounted, a supply unit and a mounting unit In a conductive ball mounting device for mounting a conductive ball held by a mounting head on a mounting object on a mounting object, a moving mechanism for relatively moving the mounting head between Detection means for detecting the position of the unnecessary conductive ball, and partial removal means for partially removing the unnecessary conductive ball by acting on the position detected by the detection means, The partial removal means is provided in a relative movement path of the mounting head between the nozzle for applying a suction force or an injection pressure and a moving mechanism for moving the nozzle relatively to the mounting head. Before mounting the sex balls, An unnecessary conductive ball is removed by applying an attractive force or an injection pressure, and after the conductive ball is mounted, the nozzle is brought into contact with the unnecessary conductive ball and removed by the moving mechanism. Ball mounting device.

Images