KR101004378B1 - Light guide plate side serration pattern manufacturing apparatus using laser - Google Patents

Abstract

PURPOSE: A side serration patterning apparatus for a light guide plate using a laser is provided to achieve a stable and precise side serration pattern by fixing a tray and a light guide plate on a work table and moving a laser unit. CONSTITUTION: A side serration patterning apparatus for a light guide plate using a laser comprises a tray(100), a work table(200), a laser unit(400), and a position control unit(500). The tray supports a plurality of light guide plates(A) so that a side of each light guide plate faces upside. The work table supports the location of the tray during side serration patterning. The laser unit irradiates a laser beam to a side of each light guide plate accepted in the tray. The position control unit adjusts the X- and Y-axis positions of the laser unit to form a serration pattern on the side of the light guide plate.

Description

LIGHT GUIDE PLATE SIDE SERRATION PATTERN MANUFACTURING APPARATUS USING LASER}

The present invention relates to a light guide plate side serration pattern processing apparatus, and more particularly, to a light guide plate side serration pattern processing apparatus for processing a serration pattern on a light incident surface side of a light guide plate using a laser.

The display device occupies a key position among the video devices of the information and communication era in the form of a liquid crystal of a mobile phone, a TV screen, a computer monitor.

Display devices are evolving into flat panel displays, such as LCDs and OLEDs, with the development of technology, starting with CRTs.

An LCD is a display device using a modulation of light by a liquid crystal cell that converts a molecular array by applying a voltage to a specific molecular array of the liquid crystal and converts a change in optical properties of the liquid crystal cell that emits light by the molecular array into a visual change.

Here, since the liquid crystal used in the LCD is a light receiving element that does not emit light by itself, a separate light source for emitting the liquid crystal is required. As the light source used in the liquid crystal display device, a cold cathode fluorescent lamp (CCFL), which is a linear light source, is used, but the cold cathode fluorescent lamp (CCFL) has a disadvantage that the price increases as the screen is enlarged. LEDs are expensive, but their use is rapidly increasing due to their long life, excellent color reproducibility, low power consumption and eco-friendly products.

On the other hand, an LCD uses a light guide plate to uniform the luminance distribution on the front of the display. The light guide plate changes a line light source or a point light source incident from a light source into a surface light source. The light flowing from the light source into the light guide plate has a non-uniform light distribution by repeating optical processes such as reflection, total reflection, refraction, and transmission, and induces it to uniform brightness and reduces light loss by using two-dimensional light dispersion pattern. To form a surface light source.

1 is a schematic diagram schematically showing the configuration of a general light guide plate 10.

As illustrated, the light guide plate 10 has a pattern 13 formed in the lower region or the upper region for light dispersion, and a side serration pattern 11 is formed in the light incident region adjacent to the light source 20.

The side serration pattern 11 is formed on the side of the light incidence region of the light guide plate 10 to improve dark areas and hot spots between the LEDs as the spacing between the LEDs 21 as the light sources increases.

Conventionally, in order to process the side serration pattern 11, the light guide plate 10 is manufactured by injection molding using an injection core or processed using a laser.

However, in order to manufacture the light guide plate on which the side serration pattern is formed through injection molding, since the production is performed one by one, there is a disadvantage in that productivity is lowered due to low product yield.

In addition, the method for processing the side serration pattern 11 using a conventional laser, as described in Korean Patent Application No. 10-2007-0016203, a moving assembly in which a light guide plate is accommodated moves on a table and a serration pattern is formed. have. However, according to the disclosed method, since the laser assembly is performed while the mobile assembly accommodating the light guide plate moves left and right, processing errors may occur due to vibration generated during the movement. In this case, there is a problem of inferior processing reliability.

An object of the present invention is to solve the above-described problems, the side serration pattern processing apparatus that can form a side serration pattern on a plurality of light guide plates at a time by using a laser in a state that the tray on which the plurality of light guide plates are mounted is fixed. To provide.

In addition, another object of the present invention is to provide a side serration pattern processing apparatus that can form a side serration pattern by simply adjusting the position of the laser to correspond to various sizes of the light guide plate.

One aspect of the present invention for achieving the above technical problem relates to a side serration pattern processing apparatus for processing a serration pattern using a laser on the side of the light guide plate. The side serration pattern processing apparatus of the present invention includes a tray for receiving and supporting a plurality of light guide plates such that the side surfaces of the light guide plate are disposed upwards; A processing table for supporting the position of the tray portion while the side serration pattern is processed; A laser unit provided at one side of the processing table and irradiating the laser to side surfaces of the plurality of light guide plates accommodated in the tray unit; It characterized in that it comprises a position adjusting unit for adjusting the position of the X-axis and Y-axis of the laser unit to process the serration pattern on the side of the light guide plate.

According to an embodiment, the laser unit is provided to be movable left and right on the X axis, and the X axis is provided to reciprocally move on the Y axis.

According to one embodiment, the laser unit, the height is adjusted up and down according to the size of the light guide plate to adjust the focus for forming a serration pattern.

According to one embodiment, the processing table is provided with a tray support for supporting the position of the tray portion, the tray surface of the tray support portion is projected to the upper surface when the tray is transported to support the transfer, the position of the tray is fixed When the serration pattern is processed on the side surface of the light guide plate, a ball bearing floating unit is provided.

According to one embodiment, the outer peripheral edge of the tray support portion is provided with a guide block for guiding the transfer of the tray, the inner peripheral surface of the guide block is provided with a ball bearing in contact with the tray at a predetermined interval.

According to one embodiment, a pin receiving groove is formed on a rear surface of the tray, and at least one fixing pin is formed at one side of the tray support to accommodate the pin receiving groove to fix a position of the tray.

According to one embodiment, provided on one side of the processing table further comprises a dust removal unit for discharging dust and odor generated during the side serration pattern processing through the laser unit.

According to one embodiment, the dust removal unit is adjusted in height corresponding to the height of the laser unit.

According to one embodiment, the processing table is provided on one side of the processing table is further provided with a tray before and after the side serration pattern processing, the preparation table to remove the foreign material on the surface of the light guide plate processed the side serration pattern The foreign material removing unit is provided.

In the side serration pattern processing apparatus according to the present invention, since the position of the tray and the light guide plate is fixed on the processing table, the laser portion moves to the left and right and up and down, and the serration pattern is processed, thereby making the side serration pattern more stable and precise. It can be processed.

In addition, since the processing is performed in a state where the plurality of light guide plates are accommodated together in the tray, the plurality of light guide plates may be processed at once. Accordingly, the processing yield can be improved.

In addition, since the focus is adjusted by adjusting the height of the laser irradiation part up and down, the serration pattern can be easily processed by being compatible with light guide plates of different sizes.

In addition, since the dust generated during the laser processing is sucked and removed immediately, the lens of the laser irradiation unit can be kept clean at all times.

In addition, since the processing of the light guide plate is completed, the foreign material on the surface is removed while in contact with the foreign material removal portion to reduce the work burden of the operator and to keep clean while minimizing the surface damage of the light guide plate.

1 is a schematic diagram schematically showing a configuration of a general light guide plate;
Figure 2 is a perspective view showing the configuration of the side serration pattern processing apparatus according to the present invention,
Figure 3 is an enlarged perspective view showing the configuration of the tray used in the side serration pattern processing apparatus according to the present invention,
4 is an exemplary view illustrating a tray movement process between a processing table and a preparation table of a side serration pattern processing apparatus according to the present invention;
Figure 5 is an enlarged perspective view showing the configuration of the tray support of the processing table of the side serration pattern processing apparatus according to the present invention,
6a and 6b is an exemplary view showing the operation of the ball bearing floating unit of the side serration pattern processing apparatus according to the present invention,
Figure 7 is a perspective view showing the configuration of the dust removal unit of the side serration pattern processing apparatus according to the present invention,
8 is an exemplary view showing various serration patterns formed by the side serration pattern processing apparatus according to the present invention;
9 is an exemplary view showing an operation process of the foreign material removing unit of the side serration pattern processing apparatus according to the present invention.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiment of the present invention may be modified in various forms, the scope of the invention should not be construed as limited to the embodiments described in detail below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings and the like may be exaggerated to emphasize a more clear description. It should be noted that the same members in each drawing are sometimes shown with the same reference numerals. Detailed descriptions of well-known functions and configurations that are determined to unnecessarily obscure the subject matter of the present invention are omitted.

2 is a perspective view showing the entire configuration of the side serration pattern processing apparatus 1 according to the present invention.

As shown, the side serration pattern processing apparatus 1 according to the present invention includes a tray 100 in which a plurality of light guide plates A are accommodated, and a tray 100 so as to process a serration pattern on the side surface of the light guide plate A. FIG. Position to adjust the position of the processing table 200 for supporting the position of the laser beam, the laser portion 400 for irradiating the laser to the light guide plate A, and the position of the laser portion 400 provided on one side of the processing table 200. Adjusting unit 500, the dust removal unit 600 to remove the dust and odor generated by the laser processing, and the foreign material removal unit 700 for cleaning the light guide plate (A) formed with the side serration pattern to remove the foreign matter It includes.

Figure 3 is an enlarged perspective view showing an enlarged configuration of the tray 100 according to the present invention, Figure 4 is a perspective view showing the configuration of the processing table 200 and the preparation table 300 according to the present invention, Figure 5 Is a perspective view illustrating a configuration of the tray support part 220 of the machining table 200.

As shown in FIG. 3, the tray 100 accommodates a plurality of light guide plates A together to process side serration patterns on the plurality of light guide plates A at a time. The tray 100 includes a tray main body 110 in which a light guide plate A is accommodated, a separation preventing bar 120 coupled to an opening of the tray main body 110 to prevent the light guide plate A from being separated, and a tray main body. A plurality of protective covers 130 and 140 are provided inside the 110 to protect the light guide plate A surface.

The tray body 110 is provided in a box shape so that the plurality of light guide plates A may be accommodated. One side of the tray body 110 is provided with an opening 110a open to allow the light guide plate A to be drawn in and drawn out. The tray body 110 is accommodated upright so that the side surface of the light guide plate A faces upward. The plurality of light guide plates A are sequentially stacked adjacent to each other.

In this case, a thermoplastic resin B is provided between the neighboring light guide plates A to protect the surface of the light guide plate A, and a plurality of light guide plates A are disposed between both side surfaces of the tray body 110 and the outermost light guide plates A. Protective plates 130 and 140 are provided. The first protection plate 130 is disposed in contact with the light guide plate A disposed at the outermost side, and the second protection plate 140 is disposed between the first protection plate 130 and the side surface of the tray body 110.

The second protective plate 140 is in contact with the gap adjusting bolt 113 formed on both sides of the tray body 110 and presses the plurality of light guide plates A to the inside to minimize the gap between the light guide plates A. The first protective plate 130 and the second protective plate 140 prevents the spacer bolt 113 from directly contacting the light guide plate A to prevent damage to the light guide plate A surface.

Both sides of the tray body 110 is provided with a handle 111 so that the operator can easily move the tray body 110. The worker may press the tray body 110 through the handle 111 to move the tray body 110 between the processing table 200 and the preparation table 300.

Spacing adjusting bolt 113 is provided on both sides of the tray body 110, the length is adjusted by the operator to minimize the gap between the light guide plate (A). As a result, the side serration patterns are processed in a state where the plurality of light guide plates A are in close contact with each other.

Here, the height of the tray body 110 and the protective plates (130, 140) is preferably provided lower than the height of the light guide plate (A).

Although not shown in the back of the tray body 110, the pin receiving groove (not shown) is formed in a predetermined depth. The pin receiving groove (not shown) accommodates the position fixing pin 227 of the machining table 200 to fix the position of the tray body 110.

On the other hand, the opening (110a) of the tray body 110 is coupled to the departure prevention bar 120 to prevent the departure to the outside of the light guide plate (A) accommodated therein. The separation prevention bar 120 is coupled to both ends of the bar coupling protrusion 110b formed at both sides of the opening 110a to support the light guide plate A.

As shown in FIGS. 2 and 4, the processing table 200 has a tray such that a side serration pattern is formed on the light guide plate A by irradiating a laser from the laser unit 400 with the tray 100 fixed thereto. Support the position of (100). In addition, the machining table 200 is provided with a laser unit 400 and a position adjusting unit 500 for adjusting the position of the laser unit 400. As a result, a serration pattern may be formed on the side surface of the tray 100 while the tray 100 is fixed on the processing table 200.

The machining table 200 has a predetermined area and has a machining table body 210 provided adjacent to the preparation table 300. The tray support part 220 for fixing the position of the tray 100 is provided in the center area of the processing table main body 210, and the position adjusting part 500 and the laser part 400 are located at the edge area of the processing table main body 210. Is provided.

The tray support part 220 fixes the tray 100 transferred from the preparation table 300 to a processing position where the side serration pattern is processed. The tray support 220 is a guide block 221 for guiding the transfer of the tray 100, as shown in enlarged in Figure 4 and the ball bearing formed on the plate surface of the tray support 220 to help the smooth transfer of the tray 100 Floating unit 225 and a position fixing pin 227 for fixing the position of the tray 100.

The guide block 221 is formed to protrude a certain height from the plate surface of the machining table 200 to guide the tray 100 to the machining position. The guide block 221 is in contact with the side of the tray 100 when the tray 100 is transferred from the preparation table 300 to the tray support 220 to guide the tray 100 to be transferred in a predetermined path.

At this time, the inner surface of the guide block 221 is provided with a plurality of side ball bearings 223 at regular intervals to reduce the contact area with the tray 100 to minimize the frictional force in contact with the tray 100. The side ball bearing 223 reduces the frictional force due to the surface contact between the guide block 221 and the tray 100 to linear contact so that the tray 100 is transferred with less force.

Ball bearing floating unit 225 is a plurality of light guide plate (A) is loaded so that the operator can transfer the heavy weight tray 100 to the processing position with a small force.

6A and 6B are exemplary views illustrating an operation process of the ball bearing floating unit 225. As shown in the figure, the ball bearing floating unit 225 lifts or lowers the ball bearing 225a on the receiving groove 225b formed on the plate surface of the tray support 220 to assist the transfer of the tray 100. The ball bearing 225a is protruded to the upper surface of the receiving groove 225b by the supply of air and rotates idlely. As a result, the ball bearing 225b is in contact with the lower region of the tray 100 transferred from the preparation table 300 to the processing table 200, so that the tray 100 is smoothly transferred even if the operator applies little force.

On the other hand, when the tray 100 is located at the processing position, the ball bearing floating unit 225 stops supplying air. As a result, the ball bearing 225a is accommodated into the receiving groove 225b as shown in FIG. 6B and the tray 100 is in contact with the plate surface of the tray support part 220.

Position fixing pin 227 is formed in the pin receiving groove (not shown) on the back of the tray 100, which is formed to protrude from the plate surface of the tray support 220 to be transferred from the preparation table 300 to fix the position of the tray 100 Let's do it. Position fixing pin 227 is accommodated in the pin receiving groove (not shown) so that the tray 100 is no longer moved, the laser is irradiated from the laser unit 400 and the tray 100 while the side serration pattern is processed Do not change the position of). As a result, the side serration pattern is processed at the correct position to minimize the machining error.

The preparation table 300 is disposed adjacent to the processing table 200, and the tray 100 on which the light guide plate A is loaded before the side serration pattern is processed, and the side serration pattern is processed on the processing table 200. The tray 100 on which the light guide plate A is stacked is stacked.

The preparation table 300 provides a work space in which the operator can load the light guide plate A on the tray 100 before the side serration pattern is processed. The worker loads the light guide plate A on the tray 100 in the preparation table 300 and transfers the separation prevention bar 120 to the processing table 200 in a state in which the separation prevention bar 120 is coupled to the tray 100.

In addition, the operator provides a space for cleaning and arranging the light guide plate A on which the side serration pattern processing is completed in the machining table 200.

The plate surface of the preparation table 300 is provided with a feed ball bearing 310 to rotate idle in order to facilitate the transfer of the tray 100. The transfer ball bearing 310 is provided over the entire area of the preparation table 300 at regular intervals.

7 is a perspective view showing the configuration of a laser unit 400 according to the present invention.

The laser unit 400 forms a side serration pattern by irradiating the laser onto the side surface of the light guide plate A positioned at the machining position of the machining table 200. The laser unit 400 includes a laser irradiation unit 410 for irradiating the laser, and a height adjusting unit 420 for supporting the laser irradiation unit 410 and adjusting the height at which the laser is irradiated. The laser irradiation unit 410 is disposed in the lower region of the height adjusting unit 420.

The laser unit 400 irradiates the laser to the side surface of the light guide plate A to process the side serration pattern on the light guide plate A.

The height adjusting unit 420 moves left and right on the X-axis 510 to allow the laser unit 400 to irradiate the laser to the plurality of light guide plates A. In addition, the height adjusting unit 420 is adjusted in height to adjust the focus of the laser irradiation according to the size of the light guide plate (A). The height adjusting unit 420 is provided with a ruler for visual identification, and a micrometer for fine adjustment of the focus lens of the laser is installed.

The position adjusting unit 500 moves the laser unit 400 on the X-axis 510 and the Y-axis 520 so that side serration patterns are simultaneously formed on the plurality of light guide plates A. Referring to FIG.

Position adjusting unit 500 is located in the X-axis direction of the machining table 200, the laser unit 400 is coupled to the X-axis 510, the Y-axis direction of the machining table 200 and the X-axis 510 Includes a Y axis 520 that is movably coupled.

The position adjusting unit 500 moves the laser unit 400 in the X-axis direction and the Y-axis direction according to the shape and depth of the side serration pattern so that the side serration patterns are formed on the plurality of light guide plates A simultaneously.

The laser unit 400 moves left and right along the X axis 510 to irradiate the laser. The X-axis 510 moves along the Y-axis 520 so that the laser unit 400 forms a side serration pattern along the longitudinal direction of the light guide plate A. FIG.

When the X-axis 510 moves along the Y-axis 520, the laser unit 400 moves on the X-axis 510 while the driving of the X-axis 510 is stopped without irradiating the laser to the laser unit 400. The laser is irradiated only when moving.

Here, the position control of the laser unit 400 of the position adjusting unit 500 is automatically precisely controlled according to the shape of the side serration pattern.

8 is an exemplary view showing various examples of side serration patterns a processed in the light guide plate A. FIG.

The position adjusting unit 500 may change the processing width and depth by adjusting the moving speed and the moving position of the laser unit 400 according to the horizontal / vertical aspect ratio of the side serration pattern (a). Thereby, various processing patterns and shapes can be processed using one side serration pattern processing apparatus 1.

The side serration pattern may be selectively processed according to the type of the product to which the light guide plate is applied and the characteristics of each model, and the side serration pattern having different shapes may be combined into one light guide plate.

On the other hand, one side of the laser unit 400 includes a dust removal unit 600 to remove dust and odor generated during side serration pattern processing. The dust removing unit 600 is provided at one side of the laser unit 400 as shown in FIG. 7 to collect dust generated during laser processing and remove odors.

The dust removing unit 600 includes a suction main body 610 having suction holes 610 for sucking dust and odor at regular intervals, and a suction height adjusting unit 620 for adjusting the height of the suction main body 610. . The suction height adjusting unit 620 adjusts the height of the suction main body 610 to correspond to the height of the laser unit 400. As a result, dust generated by the laser unit 400 is effectively collected.

In addition, the foreign material removing unit 800 is provided at one side of the preparation table 300 as shown in FIGS. 2 and 9. The foreign material removing unit 800 is in contact with the light guide plate A on which the side serration pattern is processed by the laser unit 400 and removes foreign substances on the light guide plate A surface.

The foreign material removing unit 700 removes the foreign matter while the brush 710 rotating on the rotation shaft 710 contacts the light guide plate A surface. At this time, by controlling the conveying speed of the tray 100 passing through the foreign matter removing unit 700 and the rotational speed of the brush 710, foreign matters can be effectively removed while preventing damage to the light guide plate A surface.

The operation of the side serration pattern processing apparatus 1 according to the present invention having such a configuration will be described with reference to FIGS. 2 to 9.

First, the tray 100 is stacked on the preparation table 300, and a plurality of light guide plates A are sequentially stacked in the tray 100. At this time, a thermoplastic resin (B) is inserted between the light guide plates (A) to prevent damage to the light guide plates (A). In addition, protective covers 130 and 140 are disposed outside the outermost light guide plate A to prevent damage to the surface of the light guide plate A. FIG.

When the operator receives all of the light guide plate A to be processed, tighten the gap adjusting bolt 113 to minimize the gap between the light guide plate (A). Then, the separation prevention bar 120 is coupled to the opening 110a to fix the position of the light guide plate A.

The tray 100 prepares two or three or more at a time according to the size of the processing table 200.

The worker presses the tray 100 by using the handle 111 of the prepared tray 100 to move the tray 100 from the preparation table 300 to the processing table 200. At this time, the worker can transfer the tray 100 with a small force by the transfer ball bearing 310 on the preparation table 300 and the ball bearing floating unit 225 of the processing table 200.

The tray 100 is brought into contact with the guide block 221 and guided to the machining position, and the tray 100 is positioned at the machining position while the fixing pin 227 is inserted into the pin receiving groove (not shown) of the tray 100. Done.

When the position of the tray 100 is fixed, the laser irradiation unit 410 adjusts the height by the height adjusting unit 420 to focus. When the focus is focused, the laser unit 400 moves left and right along the X axis 510 and irradiates the side surface of the light guide plate A to process the side serration pattern a.

When the laser unit 400 moves from left to right along the X axis 510, the X axis 510 moves along the Y axis. When the movement of the X-axis 510 is completed, the laser unit 400 moves from the right to the left along the X-axis 510 and irradiates the laser to process the side serration pattern a.

In this way, the laser unit 400 moves along the X axis 510, and the X axis 510 moves along the Y axis 520, and the side surfaces of the plurality of light guide plates A fixed to the plurality of trays 100. The serration pattern (a) can be processed at one time.

The dust removal unit 600 collects dust and odor generated from the light guide plate A during laser processing while the machining is in progress. This allows the processing site to be kept clean at all times.

After the side serration pattern processing is completed, the tray 100 moves back to the preparation table 300, passes between the foreign material removing units 700, and foreign substances on the surface of the light guide plate A are removed.

As described above, the side serration pattern processing apparatus according to the present invention is more stable and precise because the position of the tray and the light guide plate is fixed on the processing table and the laser unit moves to the left and right and up and down and processes the serration pattern. The side serration pattern can be processed.

In addition, since the processing is performed in a state where the plurality of light guide plates are accommodated together in the tray, the plurality of light guide plates may be processed at once. Accordingly, the processing yield can be improved.

In addition, since the focus is adjusted by adjusting the height of the laser irradiation part up and down, the serration pattern can be easily processed by being compatible with light guide plates of different sizes.

In addition, since the dust generated during the laser processing is sucked and removed immediately, the lens of the laser irradiation unit can be kept clean at all times.

In addition, since the processing of the light guide plate is completed, the foreign material on the surface is removed while in contact with the foreign material removal portion to reduce the work burden of the operator and to keep clean while minimizing the surface damage of the light guide plate.

Embodiment of the side serration pattern processing apparatus of the present invention described above is merely exemplary, and those skilled in the art to which the present invention pertains various modifications and equivalent other embodiments are possible. You will know well. Therefore, it will be understood that the present invention is not limited to the forms mentioned in the above detailed description. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the invention includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

1: light guide plate pattern processing apparatus 100: tray
110: tray body 110a: opening
110b: bar engaging projection 111: handle
113: spacing adjustment bolt 120: separation prevention bar
130: first protective plate 140: second protective plate
200: machining table 210: machining table main body
220: tray support 221: guide block
223: side ball bearing 225: ball bearing floating unit
225a: ball bearing 225b: receiving groove
227: position fixing pin 300: preparation table
310: transfer ball bearing 400: laser portion
410: laser irradiation unit 420: height adjustment unit
500: position adjusting unit 510: X axis
520: Y axis 600: Dust removal unit
700: foreign material removing unit 710: brush
A: Light guide plate
a: side serration pattern
B: thermoplastic resin

Claims (9)

In the side serration pattern processing apparatus for processing a serration pattern using a laser on the side of the light guide plate,
A tray accommodating and supporting the plurality of light guide plates such that the side surfaces of the light guide plate are disposed upward;
A processing table for supporting the position of the tray portion while the side serration pattern is processed;
A laser unit provided at one side of the processing table and irradiating the laser to side surfaces of the plurality of light guide plates accommodated in the tray unit;
It includes a position adjusting unit for adjusting the position of the X-axis and Y-axis of the laser unit to process the serration pattern on the side of the light guide plate,
The processing table is provided with a tray support for supporting the position of the tray,
The tray support plate is provided with a ball bearing floating unit that protrudes upward when the tray is transferred to support the transfer, and the tray portion is fixed so that the ball bearing floating unit is recessed when the serration pattern is processed on the side of the light guide plate. Side serration pattern processing apparatus characterized by the above-mentioned. The method of claim 1,
The laser unit is provided to be movable left and right on the X axis,
The X axis is a side serration pattern processing apparatus, characterized in that provided on the Y axis reciprocating. The method of claim 1,
The laser unit,
Side height serration pattern processing apparatus characterized in that the height is adjusted up and down according to the size of the light guide plate to adjust the focus for forming a serration pattern. delete The method of claim 1,
The outer periphery of the tray support is provided with a guide block for guiding the transfer of the tray,
Side serration pattern processing apparatus characterized in that the inner peripheral surface of the guide block is provided with a ball bearing in contact with the tray at a predetermined interval. The method of claim 5,
Pin receiving groove is formed on the back of the tray,
At least one fixing pin which is accommodated in the pin receiving groove to fix the position of the tray is formed at one side of the tray support portion. The method of claim 1,
The side serration pattern processing apparatus is provided on one side of the processing table further comprises a dust removal unit for discharging dust and odor generated when processing the side serration pattern through the laser portion. The method of claim 7, wherein
The dust removal unit side serration pattern processing apparatus, characterized in that the height is adjustable corresponding to the height of the laser portion. The method of claim 1,
It is provided on one side of the processing table further comprises a preparation table for loading the tray before and after side serration pattern processing,
The preparation table is a side serration pattern processing apparatus, characterized in that the foreign material removal portion for removing the foreign material on the surface of the light guide plate processed the side serration pattern.

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