KR100720000B1 - Slit forming system using of real time monitering, and forming method thereof - Google Patents

Abstract

The slit processing apparatus according to the present invention is equipped with a reference sample and a processing sample, the work plate capable of three-dimensional fine movement; Processing means for scanning the reference sample and simultaneously forming a pattern identical to a slit pattern of the reference sample in the processing sample; A motor controller for controlling a motor that performs an operation of the processing means; And an integrated control and display unit for controlling the driving of the working plate and the processing means and real-time monitoring of forming a slit pattern in the processing sample.

In this way, the present invention can significantly reduce the processing error of the slit processing, and by shortening the processing time, thereby lowering the product cost due to high yield improvement and easy mass production.

In addition, it is possible to supply a low-cost device, improve the equipment holding capacity of the general slit processing company, and access to the ultra-fine pattern is easy to reduce the need to develop a new slit processing method.

Slit Processing Equipment, Optical Microscope, Blade, Processing Error, Dicing Saw, MEMS

Description

Slit processing device using real-time monitoring and its processing method {SLIT FORMING SYSTEM USING OF REAL TIME MONITERING, AND FORMING METHOD THEREOF}

1 is a view showing a schematic view of a slit processing apparatus using a dicing saw equipment employing a general blade,

      1B is a view of a slit product currently being processed using a dicing saw machine employing a blade

Figure 2 is a photograph of a slit product, which is an individual element for a probe unit using a dicing saw equipment employing a blade,

3 is a schematic view of a ceramic slit processing apparatus according to the present invention,

4A to 4D are views showing that the process of forming the slit pattern by the slit processing apparatus according to the present invention is monitored;

5 is a view illustrating a flowchart of a method of forming a slit pattern using a slit processing apparatus according to the present invention;

6 is a diagram illustrating a logic flow of forming a slit pattern as an embodiment of the slit processing apparatus according to the present invention.

Description of the main parts of the drawing

100: work bench, 110: reference sample, 130: workpiece

230: processing means (blade), 200: reading means (optical microscope)

300: conveying means, 330: motor, 400: processing control

The present invention relates to a ceramic slit processing apparatus and a processing method thereof, and more particularly, to a ceramic slit pattern processing apparatus and a processing method for forming a slit pattern while monitoring in real time without processing errors when forming a slit pattern in the ceramic will be.

The real-time distance control vision system for ceramic processing is the main substrate of the slit in the processing of slit products for probe units, which are individual elements of display inspection equipment. Is a device for precisely moving a certain distance or a random distance on the drawing.

When slits are processed with blades using a dicing saw, a conventional machining equipment, one slit can generally be processed within the tolerances given in the drawing, but at a constant interval or on a drawing When machining hundreds of slits with a random distance shifted, the mechanical error due to the blade position shift of the dicing saw greatly exceeds the allowable error range.

1 is a view showing a schematic view of a slit processing apparatus using a dicing saw equipment employing a general blade.

As shown in FIG. 1, a sample is placed on a working plate and a blade 230 for processing a sample is mounted thereon. The blade is composed of a worm gear, and the blade moves finely in parallel with the working plate by rotation of a worm gear. It is made to structure. However, the worm gear has a limitation in that a large error occurs due to the accumulation of processing errors when forming a slit pattern of several tens of micro units due to the processing error of the thread 235.

FIG. 2 is a photograph of a slit product, which is an individual element for a probe unit, using a dicing saw device employing a blade. As shown in FIG. 2, the total spacing of the processed slit is beyond the limit of allowable error.

Fig. 2 (a) is a photograph after processing a slit with one pitch of 48 占 1 占 퐉 in the drawing, and it is possible to process all within the tolerance range given in the drawing. However, as shown in FIG. 2 (b), when the 15 slits are processed, the cumulative error is 4 μm, which results in a larger error than the processing of hundreds of slits. The slit error range is greatly outside the 5㎛.

As the number of slits increases, the cumulative error increases more and more. The reason is that the blade of the dicing saw currently used is shifted by converting the pre-input distance into the number of revolutions of the spiral and moving the blade. If a mechanical error occurs in the helix, the naturally processed position will have an error.

Therefore, the current slit product, which is an individual element for the probe unit, is processed while artificially correcting the position of the blade at a point outside the tolerance to overcome the limitation of the accumulated error as shown in FIG. Since the processing time is also long due to less than 60% and frequent artificial position correction, the price of the overall slit product is very expensive compared to the actual material and other costs.

An object of the present invention for solving the above problems is to improve the yield and shorten the machining time by overcoming the limitation of the cumulative error due to the distance movement of the blade, which is a problem in machining the slit, MEMS (micro- Using a process such as electro-mechanical-system, a reference sample in which the blades are moved is prepared in advance, and the position of the manufactured reference sample is identified in real time through an optical microscope to accurately determine the actual position of the ceramic to be processed. The object of the present invention is to provide a slit processing apparatus and a processing method thereof, which allow precise processing by moving by a distance of a reference sample.

According to a first aspect of the present invention, there is provided a work table on which a slitted workpiece is mounted; A reference sample aligned with the workpiece on the work table and defining a machining pattern corresponding to the slit pattern of the workpiece to be machined; Reading means for reading the processing pattern of the reference sample; Machining means rigidly coupled to the reading means for machining the workpiece; Conveying means for conveying said working table or said reading means; And a processing control section for performing real-time slit processing of the workpiece with the processing means as the reading means reads the processing pattern.

In addition, the reference sample is preferably manufactured by MEMS (Micro Electro Mechanical Systems), and the reading means is also preferably an optical microscope.

In addition, preferably, the processing means may include a blade for processing the workpiece and a motor for driving the blade, and the processing control unit reads the processing pattern of the reference sample and processing the workpiece. It is also desirable to include a monitorable display device and a control device for controlling the drive of the reading means, work table and processing means.

And a second aspect according to the present invention is a method of reading a predetermined pattern by means of reading means and slitting the workpiece accordingly, comprising: (a) a slit pattern aligned with the workpiece and the workpiece and formed on the workpiece; Providing a reference sample having a corresponding processing pattern; (b) providing a reference to reading means to align the reference position of the reference with the reference sample; (c) reading the processing pattern while moving the reading means relative to the reference sample; (d) slitting the workpiece when the reference is aligned with the slit of the processing pattern; And (e) repeating (c) and (d).

Furthermore, the reading means is preferably an optical microscope, and the reference sample is also preferably made of a slit pattern by MEMS (Micro Electro Mechanical Systems).

In addition, the step of processing may be made by a processing means including a blade for processing the workpiece, and a motor unit for driving and moving the blade up and down, preferably the step of reading the processing pattern and the workpiece The step of slit processing may be characterized in that the real-time monitoring.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic view of a ceramic slit processing apparatus according to the present invention.

As shown in FIG. 3, the worktable 100 on which the slitted workpiece 130 is mounted, the workpiece pattern aligned with the workpiece 130, and the machining pattern corresponding to the slit pattern of the workpiece 130 to be processed are defined. The reference sample 110, the reading means 200 for reading the processing pattern of the reference sample, the processing means for processing the workpiece 130 is firmly coupled to the reading means 200, the upper work table 100 Or the processing control unit 500 for transferring the reading means 200 in real time slit processing of the workpiece 130 with the processing means 230 as the reading means 200 reads the processing pattern. Include.

Here, the work table 100 can be mounted to the workpiece 130 at a predetermined distance from the reference sample 110, the work table 100 is a three-dimensional fine movement in the X, Y and Z axis by the transfer means It is structured to make it possible. In this case, the conveying means 300 preferably includes a motor 330, a motor controller, and a precision moving device, which enables the formation of a processing pattern of several tens of micro-units of the sample, and is more precise by fine adjustment. This is because control is easy.

In addition, it is preferable that the worktable 100 moves for the machining of the workpiece 130. This means that when the processing means 200 for processing the workpiece 130 moves, the machining error is more unstable due to vibration caused by the movement. This is because there is a high possibility of a lot. Therefore, the worktable 100, which is stably fixed to the support shaft, is moved by the transfer means 300 including a fine precision moving device (not shown), whereby more precise and stable work can be performed.

As shown in FIG. 3, the reference sample 110 and the workpiece 130 are mounted at a predetermined distance on the upper surface of the work table 100, and a processing means (slit) is provided on the workpiece 130 to allow the slits to be processed on the workpiece 130. 230) is installed.

The processing means 230 is composed of a blade and a motor for driving the blade, and the upper part of the reference sample 110 is provided with a reading means 200 made of an optical microscope capable of scanning a pattern of several micrometers at a high resolution. The processing means 230 for processing the slit pattern, which is spaced apart from the optical microscope by a predetermined distance and fixedly connected, is provided on the upper portion of the workpiece 130.

That is, since the optical microscope 200 and the blade 230 are fixedly connected and spaced apart from each other, the reading means 200 reads the same and the position of the blade 230 moves in the same manner. As a result, the same pattern as that of the reference sample 110 can be slitted on the workpiece 130.

In addition, the driving of the blade 230 and the movement or driving of the work table 100 are controlled by the processing control unit 400, which sends a driving signal for driving the processing control unit 400 to the transfer means 300. It is configured to drive the work table 100 by the conveying means 300. In addition, the processes in which reading and processing are performed by the blade 230 and the optical microscope 200 may be monitored in real time by a display device included in the processing controller 400, thereby enabling precise processing and control.

That is, the reference sample 110 read by the optical microscope 200 displays the image data by the display device of the processing control unit 400 and corresponds to the position of the blade 230 provided to the optical microscope 200. The movement signal of the work bench 100 is sent to the transfer means 300 so as to match the coordinates of the image data of the reference sample and the reference sample to be transferred to the work table 100, and the coordinates of the image data of the reference sample and the reference sample match. Then, the stop signal is sent to the transfer means to drive the blade 230 through the motor controller to perform the machining operation. Of course, the control of the motor of the conveying means and the processing means may be installed independently, or may control each motor through a single controller.

When the slit is processed using the slit processing apparatus of the present invention, the pitch error of each slit is ± 0.2μm, the overall pitch error is about ± 0.2μm, the tolerance of the overall pitch is within ± 0.5μm, the yield is The effect is more than 95%.

4A to 4D are views showing that the process of forming the slit pattern by the slit processing apparatus according to the present invention is monitored. 5 and 6 are flowcharts illustrating a method of forming a slit pattern using a slit processing apparatus according to the present invention. Hereinafter, the connection and operation of the present invention will be described in detail in correspondence with the method.

As shown in FIG. 4A, the slit processing apparatus according to the present invention uses the starting point of the reference sample 110 as the reference point of the sample to be processed by the optical microscope 200, and the reference point 430 corresponding to the position of the blade 230. 4B, the movement of the worktable 100 is stopped at this position and the machining control unit 400 is formed so as to form a slit at a position coinciding with the machining pattern of the reference sample 410 and the reference sample. By sending a drive signal of the blade 230 to the motor controller in, the slit is processed.

Then, as shown in FIG. 4C, when one slit processing is completed, the processing control unit 400 transmits this signal to the motor controller of the transfer means 300 so as to reference the work table 100 on which the reference sample and the workpiece 130 are placed together. The next position is identified and moved by the optical microscope 260 at 110. Then, the stop signal of the blade is transmitted to the motor controller, and the motor controller, which has received the stop command, stops the movement of the work table and simultaneously issues a machining command to the machining means to operate the blade 230 to process the slit.

Finally, as shown in FIG. 4D, when the reference ruler 430 does not match the processing pattern 410 of the reference sample read by the optical microscope, the operation is terminated.

5 is a view illustrating a flowchart of a method of forming a slit pattern using a slit processing apparatus according to the present invention, and FIG. 6 is a diagram illustrating a logic flow of forming a slit pattern as an embodiment.

As shown in Figure 5, the slit processing method according to the present invention, (a) providing a reference sample having a workpiece and a processing pattern aligned with the workpiece and corresponding to the slit pattern formed on the workpiece (S100) ); (b) providing a reference to reading means to align the reference position of the reference with the reference sample (S200); (c) reading the processed pattern while moving the reading means relative to the reference sample (S300); (d) slitting the workpiece when the reference is aligned with the slit of the processing pattern (S400); And (e) repeating (c) and (d).

That is, the reference sample 110 is mounted on the work table 100 and provided (S100), and the work table 100 is moved until the reference position of the reference sample 110 is read by turning on the power (S200). And while the reference sample 110 is read by the reading means 200 (S300), if the coordinates of the reference corresponding to the image of the reference sample and the position of the blade created by the program is to stop the movement of the work table 100 do.

By rotating the blade 230 and lowering at the same time while the worktable 100 is stopped, the slits are processed (S400), and when the processing is finished, the slits are raised again and the next reference sample 110 is read by the reading means (S300). ), It moves until the image and program coordinates coincide. By repeating this process, and if the image of the reference sample 110 does not appear for a predetermined time, the entire work is terminated, thereby processing the same processing pattern as the pattern of the reference sample 110 on the workpiece 130. .

6 is a flowchart illustrating a processing pattern reading step and a slit processing step in the slit processing method according to the present invention.

As shown in FIG. 6, the reference sample 110 manufactured by MEMS (Micro Electro Mechanical Systems) and the ceramic element to be processed are mounted on the working plate 100, and when the power is turned on, the motor operates (S310). The working plate 100 is moved until the optical microscope 260 reads the initial position of the reference sample 110 manufactured by Electro Mechanical Systems (S320). Here, the reference sample is MEMS (Micro Electro Mechanical Systems). It is preferable to manufacture, because the precision of the reference sample 110 by MEMS (Micro Electro Mechanical Systems), the workpiece 130 can also be processed precisely.

The optical microscope 200 reads and compares the image of the reference sample 110 with the coordinates created by the program (S325). If the coordinates of the image of the reference sample 110 and the program match (S330), the PC is a motor controller ( (S335) In other words, the PC controls the movement of the reference sample and the workpiece, and the display device and control so that the process of processing the workpiece corresponding to the reference sample can be monitored. Device.

The motor control unit receiving the control signal from the PC stops the submotor by sending a stop signal to the submotor drive in charge of the movement of the working plate 100, and the PC drives the DC motor to the DC motor control unit 300. The rotation of the blade 230 is started by giving a signal (S440).

The motor controller transmits a signal to the sub-motor drive that is responsible for the up / down movement of the blade 230 so that the blade 230 descends for slit processing. 230, the signal is returned to its original state, and the motor controller transmits a signal to the sub-motor drive that is responsible for the up / down movement of the drill to return the blade 230 to its original state (S450).

By repeating the above process until the end of the machining of all positions processed on the reference sample 110 is repeated, after moving a certain distance, if no further processing point on the reference sample 110 is visible PC The operation is terminated by sending a stop command signal to all submotors.

In the present invention as described above has been described by the specific embodiments, such as specific components and limited embodiments and drawings, but this is provided to help a more general understanding of the present invention, the present invention is not limited to the above embodiments. For those skilled in the art, various modifications and variations are possible from these descriptions.

Therefore, the spirit of the present invention should not be limited to the described embodiments, and all the things that are equivalent to or equivalent to the claims as well as the following claims will belong to the scope of the present invention. .

As described above, when the slit processing apparatus and the processing method according to the present invention are provided, the processing error and the processing time of the slit processing are shortened, thereby improving yield and lowering the product cost, thereby facilitating mass production.

In addition, it is possible to supply a low-cost device, improve the equipment holding capacity of the general slit processing company, and easy access to the ultra-fine pattern will reduce the need to develop a new slit processing method.

Claims (10)

A work bench on which a slitted workpiece is mounted; A reference sample aligned with the workpiece on the work table and defining a machining pattern corresponding to the slit pattern of the workpiece to be machined; Reading means for reading the processing pattern of the reference sample; Machining means rigidly coupled to the reading means for machining the workpiece; Conveying means for conveying said working table or said reading means; And And a processing control section for performing real-time slit processing of the workpiece with the processing means as the reading means reads the processing pattern. The method of claim 1, The reference sample is a slit processing apparatus, characterized in that produced by MEMS (Micro Electro Mechanical Systems). The method of claim 1, And said reading means is an optical microscope. The method of claim 1, And said processing means comprises a blade for processing said workpiece, and a motor for driving said blade. The method of claim 1, The processing control unit includes a display device capable of monitoring reading of the processing pattern of the reference sample and processing of the workpiece; And a control device for controlling the driving of the reading means, work table, and processing means. In the method of reading a predetermined pattern with a reading means and thereby slitting the workpiece, (a) providing a reference sample having a workpiece and a processing pattern aligned with the workpiece and corresponding to a slit pattern formed on the workpiece; (b) providing a reference to reading means to align the reference position of the reference with the reference sample; (c) reading the processing pattern while moving the reading means relative to the reference sample; (d) slitting the workpiece when the reference is aligned with the slit of the processing pattern; And (e) repeating steps (c) and (d). The method of claim 6, And said reading means is an optical microscope. The method of claim 6, The reference sample is a slit processing method characterized in that the slit pattern is produced by MEMS (Micro Electro Mechanical Systems). The method of claim 6, The processing step is a slit processing method, characterized in that the processing means comprising a blade for processing the workpiece and a motor for driving and moving the blade up and down. The method according to any one of claims 6 to 9, Step (c) and (d) is a slit processing method, characterized in that the real-time monitoring.

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