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KR100514425B1 - 접착 부재, 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기 - Google Patents

접착 부재, 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기 Download PDF

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Publication number
KR100514425B1
KR100514425B1 KR10-2000-7011579A KR20007011579A KR100514425B1 KR 100514425 B1 KR100514425 B1 KR 100514425B1 KR 20007011579 A KR20007011579 A KR 20007011579A KR 100514425 B1 KR100514425 B1 KR 100514425B1
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KR
South Korea
Prior art keywords
resin
semiconductor chip
layer
adhesive member
substrate
Prior art date
Application number
KR10-2000-7011579A
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English (en)
Korean (ko)
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KR20010042822A (ko
Inventor
노부아키 하시모토
Original Assignee
세이코 엡슨 가부시키가이샤
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Publication of KR20010042822A publication Critical patent/KR20010042822A/ko
Application granted granted Critical
Publication of KR100514425B1 publication Critical patent/KR100514425B1/ko

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    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
KR10-2000-7011579A 1999-02-18 2000-02-09 접착 부재, 반도체 장치 및 그 제조 방법, 회로 기판 및 전자 기기 KR100514425B1 (ko)

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FR2863767B1 (fr) * 2003-12-12 2006-06-09 Commissariat Energie Atomique Support memoire irreversible a deformation plastique et procede de realisation d'un tel support
JP2006100752A (ja) * 2004-09-30 2006-04-13 Sanyo Electric Co Ltd 回路装置およびその製造方法
KR102492533B1 (ko) 2017-09-21 2023-01-30 삼성전자주식회사 지지 기판, 이를 이용한 반도체 패키지의 제조방법 및 이를 이용한 전자 장치의 제조 방법
TWI714905B (zh) * 2018-11-08 2021-01-01 瑞昱半導體股份有限公司 電路裝置與電路設計及組裝方法
CN114023704B (zh) * 2022-01-05 2022-04-01 长鑫存储技术有限公司 非导电膜及其形成方法、芯片封装结构及方法
CN114374101A (zh) * 2022-01-12 2022-04-19 业成科技（成都）有限公司 连接结构和形成连接结构的方法

Citations (2)

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Publication number Priority date Publication date Assignee Title
JPH0513119A (ja) * 1991-07-04 1993-01-22 Sharp Corp 電子部品接続用テープコネクタ
JPH09266229A (ja) * 1996-03-28 1997-10-07 Matsushita Electric Ind Co Ltd 半導体装置の実装方法および半導体装置の実装体

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Publication number Priority date Publication date Assignee Title
JPH1013002A (ja) * 1996-06-20 1998-01-16 Matsushita Electric Ind Co Ltd 半導体素子の実装方法
JPH1084014A (ja) * 1996-07-19 1998-03-31 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JPH10199930A (ja) * 1996-12-28 1998-07-31 Casio Comput Co Ltd 電子部品の接続構造および接続方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0513119A (ja) * 1991-07-04 1993-01-22 Sharp Corp 電子部品接続用テープコネクタ
JPH09266229A (ja) * 1996-03-28 1997-10-07 Matsushita Electric Ind Co Ltd 半導体装置の実装方法および半導体装置の実装体

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KR20010042822A (ko) 2001-05-25
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WO2000049652A1 (fr) 2000-08-24
WO2000049652A8 (fr) 2000-10-26

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