KR100257926B1 - Multi-layer film for circuit board and multi-layer circuit board using the same and pakage for semiconductor device - Google Patents

Abstract

The present invention provides a multilayer circuit board which can be manufactured in a simple process and a multilayer film for forming a circuit board suitable for use therein. The solution means is that the conductor layer 16 is formed of the required wiring pattern 16a, the via hole 18 is formed in the thermosetting resin layer 12 and the adhesive layer 14 provided on both sides thereof, and the wiring pattern 16a is formed. One side of the core substrate 24 having the vias 20 formed by filling the via holes in the circuit board forming multilayer film 10 having the vias 20 filled with the vias 18 filled with the conductive material to be connected thereto, or The required number of layers are laminated on both sides via the adhesive layer 14 on the surface of the multilayer film 10 and thermally compressed, and between the wiring patterns 16a via the vias 20 provided on the multilayer film 10 and the core substrate 24. Is electrically connected.

Description

Multilayer film for circuit board formation and multi-layer circuit board and package for semiconductor device using same

The present invention relates to a multilayer film for forming a circuit board, and a package for a multilayer circuit board and a semiconductor device using the same.

The build-up method shown in Figs. 10 to 13 is known as a method of forming multilayer wiring patterns of multilayer circuit boards suitable for high density mounting.

In this build-up method, a conductor layer is formed on a core substrate 1 such as a glass epoxy substrate by sputtering or plating, and the conductor layer is etched to form a wiring pattern 2 (Fig. 10).

The photosensitive resist 3 is coated on the wiring pattern 2, and the via hole 4 is formed in the photosensitive resist 3 by photolithography (Fig. 11).

Next, a conductor layer is formed on the photosensitive resist 3 including the via hole 4 by plating, sputtering, or the like. The conductor layer is etched to form a wiring pattern 5, which is then formed on the core substrate 1. The wiring pattern 2 and the via hole 4 are made conductive (Fig. 12).

In addition, the photosensitive resist 6 is applied onto the resist by including the wiring pattern 5 formed on the photosensitive resist 3, and the wiring pattern 7 is formed by the above-described process (Fig. 13). Repeat.

According to the build-up method, it is possible to form a fine wiring pattern in a multilayer.

However, in the build-up method, since the process of photolithography is repeated to form a pattern sequentially, there is a problem that the process is complicated and long, resulting in high cost.

Accordingly, the present invention has been made to solve the above problems, and an object thereof is to provide a multilayer circuit board, a package for a semiconductor device, and a circuit board-forming multilayer film suitable for use in the same, which can be manufactured by a simple process. have.

1 is a view showing a cross-sectional structure of a multilayer film for forming a circuit board.

2 is a cross-sectional view of a wiring pattern formed on a multilayer film for forming a circuit board.

3 is a sectional view of a state in which vias are formed;

4 is an assembly diagram of a unit substrate and a core substrate.

5 is a cross-sectional view of a multilayer circuit board.

Fig. 6 is a sectional view showing another embodiment of the multilayer circuit board.

Fig. 7 is an assembly view showing another embodiment of the multilayer circuit board.

8 is an explanatory diagram showing an example of a package for a semiconductor device;

9 is an explanatory diagram showing another example of a package for a semiconductor device;

10 is a process chart of the build-up method.

11 is a process chart of the build-up method.

12 is a process chart of a build-up method.

Fig. 13 is a flowchart of the buildup method.

The present invention has the following configuration in order to achieve the above object.

In other words, the multilayer film for forming a circuit board according to the present invention is characterized in that an adhesive layer made of thermoplastic resin is formed on both sides of the thermosetting resin layer, and a conductor layer is formed on one adhesive layer of the adhesive layer.

The thermosetting resin layer may be formed of a thermosetting (non-thermoplastic) polyimide resin, and the adhesive layer may be formed of a thermoplastic polyimide resin.

The conductor layer may be formed of a plating layer formed on the sputtering layer and the sputtering layer.

The plating layer of the said conductor layer can also be formed with copper.

In the multilayer circuit board according to the present invention, the conductor layer has a required wiring pattern, a via hole is formed in the thermosetting resin layer and the adhesive layer provided on both sides thereof, and the via hole has a via filled with a conductive material connected to the wiring pattern. The multilayered film for forming a circuit board is laminated in plural sheets through an adhesive layer on the surface of the multilayer film, and thermally compressed, and the wiring patterns are electrically connected through the vias.

In the multilayer circuit board according to the present invention, the conductor layer is formed of a required wiring pattern, a via hole is formed in the thermosetting resin layer and the adhesive layer provided on both sides thereof, and the via hole is filled with a conductive material connected to the wiring pattern. The above-mentioned multilayer film for forming a circuit board having a plurality of layers is laminated on the one side or both sides of a core substrate having a via formed by filling a via hole with a conductive material through an adhesive layer on the surface of the multilayer film, and thermally compressed. And the wiring patterns are electrically connected to each other via vias provided in the core substrate.

The conductive material may be formed using a copper paste.

The core substrate may be formed of a ceramic substrate.

The core substrate may be formed of a resin substrate.

In addition, a wiring pattern may be formed on the surface of the core substrate or inside thereof to electrically connect the wiring pattern of the multilayer film via vias.

The semiconductor device package according to the present invention is characterized in that an external connection terminal for electrically connecting the wiring pattern is formed on one surface of the multilayer circuit board, and a mounting portion of the semiconductor element is formed on the other surface.

By forming the circuit board-forming multilayer film laminated on the core substrate into a frame shape, the mounting portion of the semiconductor element may be formed in a cavity shape.

The external connection terminal can be formed of a solder bump to form a package for a BGA type semiconductor device.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail according to an accompanying drawing.

1 shows a cross-sectional structure of a multilayer film 10 for forming a circuit board.

12 is a thermosetting resin layer. As the thermosetting resin layer 12, it is preferable to use a polyimide resin exhibiting non-thermoplasticity. The thermosetting resin layer 12 is formed to a thickness of 25 ~ 100μm to obtain the required strength.

14a and 14b are adhesive layers made of thermoplastic resins formed by coating on both sides of the thermosetting resin layer 12. It is preferable to use thermoplastic polyimide resin for the contact bonding layers 14a and 14b, and it softens by applying the heat of 200 degreeC or more, and shows adhesiveness. The thickness of the adhesive layers 14a and 14b is preferably around 10 μm.

As a material used for the thermosetting resin layer 12, Ubirex (trademark), Apical (trademark), etc. are good.

For example, Ubilex's tensile modulus is 900 Kg / mm ² (25 ° C.) and 350 Kg / mm ² (300 ° C.). At Apical it has a strength of 325 Kg / mm ² (25 ° C.).

These polyimides are precisely called non-thermoplastic polyimides, and the glass transition temperature (Tg) and the pyrolysis temperature are approaching. Keep it. Moreover, since these polyimides harden | cure an imidation reaction by heat processing (cure), they are also called thermosetting polyimide. In this invention, these polyimide is called thermosetting resin.

On the other hand, the thermoplastic polyimide has a glass transition temperature (Tg), and at the temperature of Tg or more, plasticization, that is, mechanical strength is considerably lowered and becomes flexible at a temperature above Tg. For example, the thermoplastic polyimide PI-Ah (Tg 200 ° C) manufactured by Mitsui Otsu Chemical Co., Ltd. has a tensile strength of 1 Kg / mm ² or less at a temperature of 200 ° C or higher.

Since the thermoplastic polyimide softens at a temperature of Tg or more, adhesion is possible, and at the same time, it is possible to embed the copper wiring pattern in the softened thermoplastic polyimide resin.

16 is a conductor layer, and is formed in thickness of about 5 micrometers on one adhesive layer 14a.

The conductor layer 16 is preferably formed by forming a copper thin film by sputtering, for example, and then forming a copper plating film on the thin film by electroplating to have a thickness of about 5 m.

By forming the thickness of the conductor layer 16 to about 5 μm, it is possible to form a very fine wiring pattern excellent in physical and chemical strength.

In some cases, only the copper thin film by the sputtering method may be used as the conductor layer 16.

When forming a copper thin film on a polyimide resin by sputtering method, in order to improve adhesiveness with a polyimide resin, a chromium thin film and a nickel thin film are formed by sputtering method by a well-known method, Form a thin film. Alternatively, after roughening the surface of the polyimide resin, a copper thin film may be formed by sputtering.

The multilayer film for forming a circuit board can be suitably used as a constituent material of the multilayer circuit board to be described later.

Next, an embodiment of the multilayer circuit board will be described at the same time as the manufacturing method thereof.

As shown in Fig. 2, the conductor layer 16 of the multilayer film 10 for forming a circuit board is etched to form a wiring pattern 16a, and a thermosetting resin layer 12 and an adhesive layer (excimer laser or the like) The via holes 18 are formed in the required portions of the wiring pattern 16a so as to expose the back surface of the wiring pattern 16a at 14a and 14b.

As shown in Fig. 3, the via hole 18 is filled with copper paste and silver paste, or metal particles such as gold, silver, copper, nickel, and lead are made of a resin (a thermoplastic resin, for example, a thermoplastic polyimide resin). A via 20 is formed by filling a conductive material such as a conductive resin mixed therein to form a unit substrate 22 made of a multilayer film.

Next, as shown in Fig. 4, the core substrate 24 is interposed between the required number of unit substrates 22 formed as described above.

The core substrate 24 is formed with a via hole at a predetermined position in advance, and the via 20 is filled with the conductive material as described above.

As the core substrate 24, a resin substrate such as a glass epoxy substrate or a ceramic substrate can be used. In the case of using a ceramic substrate, a conductive material that fills the via hole of the ceramic substrate can also be conventionally used, such as tungsten or molybdenum.

Reference numeral 26 denotes a protective film in which an adhesive layer 14 made of thermoplastic resin is formed on one surface of the thermosetting resin layer 12. The protective film 26 is formed with a perforation 27 for arranging an external connection terminal (for example, a solder ball) for connecting an electronic component or a mounting board.

By pressing and heating the unit substrate 22, the core substrate 24, and the protective film 26, the multilayered circuit board 30 having the required number of unit substrates 22 shown in FIG. Can be formed. The uppermost exposed pattern 16a is covered with the solder resist 31 except for electronic component connection parts such as semiconductor devices and semiconductor elements, but a protective film as described above may be deposited.

In addition, by providing an external connection terminal, for example, a solder bump 32, in the through hole 27 of the protective film 26, a BGA type multilayer wiring board or a package for a semiconductor device can be provided. In this case, the semiconductor device or semiconductor device in which the semiconductor device is packaged is electrically connected to and mounted on the wiring pattern on the uppermost layer.

The wiring patterns 16a of each layer are electrically connected through the vias 20.

As is apparent from Fig. 5, each wiring pattern 16a is sandwiched between the adhesive layers 14 on both sides, and when the thermocompression bonding is performed, the adhesive layer 14, which is a thermoplastic resin, is embedded in the adhesive layer 14 by softening. Since bubbles and the like are not rolled on both sides of the pattern 16a and sufficient insulation between adjacent wiring patterns 16a is ensured, a highly reliable multilayer circuit board or a package for a semiconductor device can be provided.

Since each unit substrate 22 needs to form the wiring pattern 16a separately, compared with the build-up method which requires pattern formation successively, a process becomes simple and a cost can be reduced.

In addition, since the core substrate 24 is provided, the entirety of the center layer of the multilayer circuit board is not flexible, and thus the entirety of the core substrate 24 can be prevented.

A resin material constituting the thermosetting resin layer 12, the adhesive layer 14, and the vias 20. When a polyimide resin is used in common, the coefficient of thermal expansion coincides so that there is no thermal deformation and a more reliable multilayer circuit board. Alternatively, a package for a semiconductor device can be provided.

The core substrate 24 itself is formed on a multilayer ceramic wiring board or a multilayer printed wiring board in which wiring patterns are also formed in the substrate, and the unit substrate 22 is stacked on the core substrate 24 to form a required number of multilayer circuits. It may be a package for a substrate or a semiconductor device.

The wiring pattern may also be formed on the surface of the core substrate 24 as described above.

6 shows a unit pattern 22 formed on the front and back surfaces of the core substrate 24 with wiring patterns 16b electrically connected by vias 20, and formed on one surface of the core substrate 24 as described above. Is thermally compressed to show a stacked multilayer circuit board 30.

In addition, the protective film 26 having the perforations 27 is thermo-compressed in correspondence with one end of the wiring pattern located on the lower surface and the upper surface of the laminate.

By providing an external connection terminal, for example, a solder bump or a spherical insulator coated with a metal coating on the surface of the perforation 27 of one protective film 26, a BGA type multilayer circuit board can be formed.

Of course, if a lead pin (not shown) is provided in the perforation 27 can be formed of a PGA type multilayer circuit board.

As described above, the core substrate 24 is provided to increase the strength and prevent warpage. However, in some cases, the unit substrate 22 is laminated without the core substrate 24, and thus the flexible multilayer circuit is provided. It may be a package for a substrate or a semiconductor device.

7 shows an assembly view in the case where only the unit substrates 22 are laminated.

In this case, the wiring patterns 16a and 16b are formed on both surfaces of the unit substrate 22a serving as the lowermost layer, and the wiring pattern 16b of the surface layer is used as the wiring pattern for external connection.

These multilayer circuit boards can be used as a package for mounting a semiconductor device on which a semiconductor device is mounted, or a semiconductor device in which a semiconductor device is mounted on which a semiconductor element is mounted.

8 and 9 show an example of a package 34 for semiconductor devices.

In the semiconductor device package 34 shown in Fig. 8, the unit substrate 22 formed as described above is formed on one surface of the core substrate 24 in multiple layers. In this case, the unit substrate 22 is formed in a frame shape, and the semiconductor element mounting portion is provided in a cavity shape. The exposed wiring patterns of the semiconductor element 36 and each unit substrate 22 are electrically connected by the wire 38, and the semiconductor element 36 is sealed by the sealing resin 40 by potting or the like to complete the semiconductor device. do.

26 is a protective film, 42 is a protective resist or metal frame protecting the side surfaces of the core substrate 24 and the unit substrate 22. The protective resist 42 or the metal frame may not necessarily be provided.

The semiconductor device package 34 shown in Fig. 9 is formed of a BGA type package in which the unit substrates 22 are laminated in multiple layers such as two layers. The semiconductor element 36 is electrically connected by flip-chip connection to the semiconductor element mounting part of the package upper surface, and the side surface is sealed by the sealing resin 40. As shown in FIG. 42 is a protective resist that seals the side surface of the unit substrate 22. According to this embodiment, it can be formed in a chip size package approximately the size of a semiconductor element.

Although various preferred embodiments of the present invention have been described above, the present invention is not limited to these examples, and various modifications can be made without departing from the spirit of the present invention.

According to the package for a multilayer circuit board or semiconductor device according to the present invention, as described above, each wiring pattern is sandwiched between the adhesive layers on both sides, and when the thermocompression bonding is carried out, the adhesive layer made of thermoplastic resin softens and is buried in the adhesive layer. No bubbles or the like are formed on both sides, so that a highly reliable multilayer circuit board or a package for a semiconductor device can be provided.

Since each unit substrate needs to form a wiring pattern separately, compared with the build-up method which requires pattern formation sequentially, the process can be simplified and cost can be reduced.

Claims (16)

The thermosetting resin layer which has a 1st surface and a 2nd surface, The 1st and 2nd adhesive layer which consists of thermoplastic resin formed in the said 1st surface and the 2nd surface of the said thermosetting resin layer, respectively, The said 1st as a conductive wiring pattern A thermoplastic material in which metal particles are mixed to form a metal layer formed on either one of the first and second adhesive layers, and the conductive vias formed through the thermosetting resin layer and the first and second adhesive layers and electrically connected to the conductive wiring patterns. Comprising a plurality of laminated multilayer film each comprising at least one via hole filled with a conductive material containing a resin, In the plurality of multilayer films, a wiring pattern of one multilayer film is electrically connected to a wiring pattern of another multilayer film through the conductive vias, and at least one wiring pattern is buried in the first and second bonding layers to be in contact with each other. To be laminated to each other by the first and second adhesive layer, At least one of the thermosetting resin layers of the multilayer film is a non-thermoplastic thermosetting polyimide resin, and each adhesive layer is a thermoplastic polyimide resin. The thermosetting resin layer which has a 1st surface and a 2nd surface, The 1st and 2nd adhesive layer which consists of thermoplastic resin formed in the said 1st surface and the 2nd surface of the said thermosetting resin layer, respectively, The said 1st as a conductive wiring pattern A thermoplastic material in which metal particles are mixed to form a metal layer formed on either one of the first and second adhesive layers, and a conductive via formed through the thermosetting resin layer and the first and second adhesive layers and electrically connected to the conductive wiring pattern. At least one first multilayer film each comprising at least one via hole filled with a conductive material comprising a resin; A second multilayer film comprising a first substrate and a second substrate and a core substrate having a via hole filled with a conductive material including a thermoplastic resin in which metal particles are mixed to form at least one conductive via. A second multilayer film which is in firm contact with a wiring pattern so that electrical connection is made when the at least one first multilayer film and the second multilayer film are laminated together by thermocompression bonding; In the at least one first multilayer film, a wiring pattern of the at least one first multilayer film is electrically connected to the conductive via of the second multilayer film, and at least one of the wiring patterns is disposed in the first and second adhesive layers. Deposited on at least one of the first and second surfaces of the second multilayer film by another one of the first and second adhesive layers so as to be buried and contacted, At least one of the thermosetting resin layers of the at least one first multilayer film is a non-thermoplastic thermosetting polyimide resin, and each adhesive layer is a thermoplastic polyimide resin. The multilayer circuit board of claim 2, wherein the metal layer comprises copper. The multilayer circuit board of claim 2, wherein the core board is a ceramic board. The multilayer circuit board of claim 2, wherein the core board is a resin board. The thermosetting resin layer which has a 1st surface and a 2nd surface, The 1st and 2nd adhesive layer which consists of thermoplastic resin formed in the said 1st surface and the 2nd surface of the said thermosetting resin layer, respectively, The said 1st as a conductive wiring pattern A thermoplastic material in which metal particles are mixed to form a metal layer formed on either one of the first and second adhesive layers, and the conductive vias formed through the thermosetting resin layer and the first and second adhesive layers and electrically connected to the conductive wiring patterns. At least one first multilayer film each comprising at least one via hole filled with a conductive material comprising a resin; A multi-layer circuit board having a plurality of surfaces, comprising a second multilayer film comprising a first substrate and a second substrate and a core substrate having at least one via hole filled with the conductive material to form at least one conductive via. and; An external connection terminal formed on one surface of the multilayer circuit board and electrically connected to the wiring pattern; A semiconductor element mounting portion formed on the other side of the multilayer circuit board, The at least one first multilayer film is formed such that the wiring pattern of the first multilayer film is buried in contact with the first and second adhesive layers and electrically connected to the conductive via of the second multilayer film. The other one of the second adhesive layer is deposited on either one of the first surface and the second surface of the second multilayer film, At least one of the thermosetting resin layers of the multilayer film is a non-thermoplastic thermosetting polyimide resin, and each adhesive layer is a thermoplastic polyimide resin. The package according to claim 6, wherein at least one of the first multilayer films is formed in a frame defining a cavity, and a mounting portion of the semiconductor element is formed in the cavity. The package of claim 6, wherein the external connection terminal is a conductive bump. The multilayer circuit board of claim 2, wherein the metal particles are selected from the group consisting of gold, silver, copper, nickel, and mixtures thereof. The multilayer circuit board of claim 1, wherein the metal layer comprises copper. The multilayer circuit board of claim 1, wherein the metal particles are selected from the group consisting of gold, silver, copper, nickel, and mixtures thereof. A thermosetting resin layer having a first surface and a second surface, first and second adhesive layers made of thermoplastic resin formed on the first and second surfaces of the thermosetting resin layer, respectively, and the first wiring pattern as the first wiring pattern. And a conductive via formed through the metal layer formed on one of the second adhesive layers, the thermosetting resin layer and the first and second adhesive layers, and electrically connected to the first wiring pattern when laminated together by thermocompression bonding. At least one first multilayer film each including at least one via hole filled with a conductive material including a thermoplastic resin in which metal particles are mixed to form a conductive material; A core substrate having a first surface and a second surface, and a second wiring pattern formed in the core substrate or on the first or second surface of the core substrate, wherein the core substrate is electrically connected to the second wiring pattern. A second multilayer film configured to have at least one via hole filled with the conductive material so as to form at least one conductive via connected thereto; In the at least one first multilayer film, the first wiring pattern of the first multilayer film is electrically connected to the second wiring pattern of the second multilayer film via the conductive vias, and the first and second wirings are electrically connected to each other. A pattern is deposited on one of the first and second surfaces of the second multilayer film by another one of the first and second adhesive layers such that the pattern is buried in and in contact with the first and second adhesive layers, respectively. Multilayer circuit board. The multilayer circuit board of claim 12, wherein the core board is a ceramic board. The multilayer circuit board of claim 12, wherein the core board is a resin board. The multilayer circuit board of claim 12, wherein the metal particles are selected from the group consisting of gold, silver, copper, nickel, and mixtures thereof. 13. The multilayer circuit board of claim 12, wherein the thermosetting resin layer of at least one of the at least one first multilayer film is a non-thermoplastic thermosetting polyimide resin, and each adhesive layer is a thermoplastic polyimide resin.

Images