KR0127356Y1 - Saw blade for wafer cutting - Google Patents
Saw blade for wafer cutting Download PDFInfo
- Publication number
- KR0127356Y1 KR0127356Y1 KR2019950037701U KR19950037701U KR0127356Y1 KR 0127356 Y1 KR0127356 Y1 KR 0127356Y1 KR 2019950037701 U KR2019950037701 U KR 2019950037701U KR 19950037701 U KR19950037701 U KR 19950037701U KR 0127356 Y1 KR0127356 Y1 KR 0127356Y1
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- South Korea
- Prior art keywords
- saw blade
- wafer
- cutting
- present
- wafer cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
본 고안은 팹(Fab)공정에서 패턴형상이 완료된 웨이퍼(Wafer)를 단위칩(Chip)으로 절단하는 웨이퍼 절단용 톱날에 관한 것으로써, 좀더 구체적으로는 그 구조를 개선하여 톱날의 수명을 연장시킴과 동시에 웨이퍼의 절단시 발생되는 열을 최소화할 수 있도록 한 것이다.The present invention relates to a saw blade for cutting a wafer that cuts a patterned wafer into a unit chip in a fab process, and more specifically, to improve its structure to extend the life of the saw blade. At the same time, the heat generated during cutting of the wafer is minimized.
이를 위해, 톱날(2)상에 관통된 복수개의 구멍(2b)을 형성하여서 된 것이다.To this end, a plurality of holes 2b penetrated on the saw blade 2 are formed.
Description
제1도는 종래의 톱날을 나타낸 정면도 및 종단면도.1 is a front view and a longitudinal cross-sectional view showing a conventional saw blade.
제2도는 종래의 다른 톱날을 나타낸 일부 정면도.2 is a partial front view showing another conventional saw blade.
제3도는 본 고안의 톱날을 나타낸 일부 정면도.Figure 3 is a partial front view showing the saw blade of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
2 : 톱날 2a : 구멍2: saw blade 2a: hole
본 고안은 팹(Fab)공정에서 패턴형성이 완료된 웨이퍼(Wafer)를 단위칩(Chip)으로 절단하는 웨이퍼 절단용 톱날에 관한 것으로써, 좀더 구체적으로는 그 구조를 개선하여 톱날의 수명을 연장시킴과 동시에 웨이퍼의 절단시 발생되는 열을 최소화할 수 있도록 한 것이다.The present invention relates to a saw blade for cutting a wafer that cuts a patterned wafer into a unit chip in a fab process, more specifically, to improve its structure to extend the life of the saw blade. At the same time, the heat generated during cutting of the wafer is minimized.
일반적으로 팹공정에서 제조완료된 소잉(Sawing)공정에서 단위칩으로 절단되어야 칩본딩공정에서 리드프레임의 패들에 접착시킬 수 있게 된다.In general, the chip must be cut into unit chips in the sawing process manufactured in the fab process so that the chip bonding process can be bonded to the paddle of the lead frame.
첨부도면 제1도는 웨이퍼의 소잉공정시 사용되는 종래의 톱날을 나타낸 정면도 및 종단면도로써, 알루미늄재질로 된 원판형의 바디(1)에 링형상의 톱날(2)이 고정되어 있다.1 is a front view and a longitudinal cross-sectional view showing a conventional saw blade used in the sawing process of a wafer, in which a ring-shaped saw blade 2 is fixed to a disc-shaped body 1 made of aluminum.
상기 톱날(2)은 니켈 파우더와 다이아몬드 파티클을 전기 전착하거나, 레진을 다이아몬드 파티클의 결합제로 사용하여 제조한다.The saw blade (2) is prepared by electro-depositing nickel powder and diamond particles, or by using resin as a binder of diamond particles.
상기한 구조의 톱날(2)을 이용하여 분당 30,000회이상으로 고속 회전시키면서 웨이퍼를 절단작업할 때에는 발생되는 Si분진을 제거함과 동시에 웨이퍼와 톱날의 마찰에 의해 발생되는 열을 냉각시키기 위해 웨이퍼의 절단부위로 냉각수(순수)를 뿌려주게 된다.Using the saw blade 2 of the above-described structure, the wafer is cut at a high speed of 30,000 times per minute to remove the Si dust generated and to cool the heat generated by the friction between the wafer and the saw blade. Spray coolant (pure water).
이에 따라 냉각수와 Si분진은 회전되는 톱날의 원심력에 의해 배출된다.Accordingly, the cooling water and the Si dust are discharged by the centrifugal force of the rotating saw blade.
그러한 이러한 제1도와 같은 톱날(2)은 웨이퍼와 톱날의 마찰저항이 커 톱날의 수명이 저하되었음은 물론 절단작업시 발생되는 Si분진의 배출이 원활하게 이루어지지 않는 문제점이 있었다.Such a saw blade (2) as shown in FIG. 1 has a problem that the frictional resistance between the wafer and the saw blade is large, so that the life of the saw blade is reduced and that the Si dust generated during cutting is not smoothly discharged.
따라서 이를 개선하기 위해 제2도와 같이 일정간격으로 슬리트(2a)를 형성한 톱날(2)이 제안된 바 있다.Therefore, in order to improve this, the saw blade 2 which forms the slits 2a at a predetermined interval as shown in FIG. 2 has been proposed.
상기한 구조의 톱날(2)은 일정간격으로 슬리트(2a)가 형성되어 있어 웨이퍼의 절단 작업시 상기 슬리트(2a)가 Si분진을 배출하는 포켓(Pocket)역할을 함과 동시에 슬리트의 형성부분이 웨이퍼의 절단면과 접속되지 않으므로 마찰열이 줄어들게 된다. 그러나 이러한 구조의 톱날은 슬리트부분이 웨이퍼의 절단면과 접속될 때 충격을 받게 되므로 강도가 떨어지게 되고, 이에 따라 슬리트의 모서리부분이 파손이 급격히 진행되었으므로 수명이 짧아지게 된다.The saw blade 2 having the above-described structure is formed with slits 2a at regular intervals so that the slits 2a act as a pocket for discharging Si dust during wafer cutting. Since the forming portion is not connected to the cut surface of the wafer, frictional heat is reduced. However, the saw blade of such a structure is impacted when the slits are connected to the cutting surface of the wafer, so the strength is lowered. Accordingly, the edges of the slits are rapidly damaged, so the service life is shortened.
본 고안은 종래의 이와 같은 문제점을 해결하기 위해 안출한 것으로서, 웨이퍼의 절단시 발생되는 Si분진의 제거는 물론 열의 발생을 최소화하는 톱날을 제공하는데 그 목적이 있다.The present invention has been made to solve such a problem in the prior art, the object of the present invention is to provide a saw blade that minimizes the generation of heat as well as the removal of Si dust generated during cutting of the wafer.
상기 목적을 달성하기 위한 본 고안의 형태에 따르면, 톱날상에 관통된 복수개의 구멍을 형성하여서 됨을 특징으로 하는 웨이퍼 절단용 톱날이 제공된다.According to an aspect of the present invention for achieving the above object, there is provided a saw blade for wafer cutting, characterized in that to form a plurality of holes penetrated on the saw blade.
이하, 본 고안을 일 실시예로 도시한 첨부된 도면 제3도를 참고로 하여 더욱 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in more detail with reference to FIG. 3 of the accompanying drawings.
첨부도면 제3도는 본 고안의 톱날을 나타낸 일부 정면도로써, 본 고안은 톱날(2)상에 복수개의 구멍(2b)이 관통되게 형성되어 있는데, 상기 구멍의 간격 및 형상은 한정할 필요가 없다.FIG. 3 is a partial front view showing the saw blade of the present invention. In the present invention, a plurality of holes 2b are formed on the saw blade 2, but the spacing and shape of the hole need not be limited.
그 이유는 웨이퍼의 절단 작업시 상기 구멍이 포켓역할을 수행하기만 하면 족하기 때문이다.The reason for this is that the hole is sufficient to perform the role of pocket during the cutting operation of the wafer.
이와 같이 구성된 본 고안의 작용, 효과를 설명하면 다음과 같다.Referring to the operation, effects of the present invention configured as described above are as follows.
웨이퍼의 절단작업시 웨이퍼와 접속되어 절단이 이루어지는 톱날(2)의 모서리 끝부분인 절단면이 연속적으로 연결되어 있으므로 종래의 슬리트가 형성된 톱날보다 강도가 크게 향상된다.In the cutting operation of the wafer, since the cutting surface, which is the corner end of the saw blade 2 which is connected to the wafer and is cut, is continuously connected, the strength is significantly improved compared to the saw blade on which the slits are formed.
또한, 절단된 웨이퍼와 접속되는 며너에는 관통된 구멍(2b)이 형성되어 있어 톱날(2)의 강도를 저하시키지 않고도 상기 구멍이 포켓역할을 하게 되므로 절삭작업시 발생되는 Si분진 및 냉각수를 신속하게 제거시킬 수 있게 된다.In addition, through holes (2b) are formed in a few of the wafers to be connected to the cut wafer, and the holes act as pockets without degrading the strength of the saw blade (2). Can be removed.
이상에서와 같이 본 고안은 톱날에 형성되는 구멍만큼 웨이퍼의 절단면과 접속되는 마찰면적이 줄어들게 되므로 웨이퍼의 절단작업시 발생되는 열을 최소화하게 됨은 물론 구멍이 포켓역할을 하게 되므로 웨이퍼의 절단작업시 발생되는 Si분진 및 냉각수를 신속하게 배출시키게 되는 효과를 얻게 된다.As described above, the present invention reduces the friction area connected to the cutting surface of the wafer as much as the hole formed in the saw blade, thereby minimizing the heat generated during the cutting operation of the wafer, as well as the hole acting as a pocket, and thus occurs during the cutting operation of the wafer. The effect is to quickly discharge the Si dust and cooling water.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950037701U KR0127356Y1 (en) | 1995-11-30 | 1995-11-30 | Saw blade for wafer cutting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950037701U KR0127356Y1 (en) | 1995-11-30 | 1995-11-30 | Saw blade for wafer cutting |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970025851U KR970025851U (en) | 1997-06-20 |
| KR0127356Y1 true KR0127356Y1 (en) | 1998-12-01 |
Family
ID=19431656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950037701U KR0127356Y1 (en) | 1995-11-30 | 1995-11-30 | Saw blade for wafer cutting |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0127356Y1 (en) |
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1995
- 1995-11-30 KR KR2019950037701U patent/KR0127356Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970025851U (en) | 1997-06-20 |
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