JPH04343450A - Dicing blade - Google Patents

Abstract

PURPOSE:To prevent cutting chips from remaining on a semiconductor wafer and to eliminate adverse influence to a product by enhancing a discharging capacity of the chips generated at the time of dicing the wafer. CONSTITUTION:Curved cutting chip discharging grooves 2 which are punched from an end of a dicing blade 1 to a central direction are radially formed at both sides of the blade 1.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dicing blade used for dicing semiconductor wafers, and more particularly to a dicing blade having grooves for discharging cutting waste.

0002

2. Description of the Related Art As shown in the front view of FIG. 2, a conventional dicing blade rotates a disk-shaped dicing blade 1 to cut a wafer 3 attracted to a table 4. In addition, conventional dicing blades have an outer diameter of 2 inches and a thickness of 60 to 70 μm, for example.
The material is artificial diamond abrasive grains and nickel is used as a bonding material, and they are bonded together using electrodeposition technology.

0003

[Problems to be Solved by the Invention] This conventional dicing blade has flat side surfaces, and the cutting waste is discharged only at the tip of the dicing blade while applying cooling water to the cutting part. It wasn't competent enough. In addition, the cutting waste that is not discharged remains on the wafer and may have an adverse effect on the product.

0004

[Means for Solving the Problems] The dicing blade of the present invention has grooves on both side surfaces for discharging cutting waste, and the grooves are curved grooves extending from the tip of the dicing blade toward the center. They are formed radially on both sides.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a front view showing the state in which a dicing blade according to an embodiment of the present invention is used. In this embodiment, cutting waste discharge grooves 2 are provided on both side surfaces of the dicing blade so as to extend from the tip of the blade toward the center. This cutting waste discharge groove 2
are curved in a direction opposite to the rotational direction of the dicing blade 1, and are provided in four radial shapes. The manufacturing method uses a mold having a groove shape and is manufactured by electrodeposition. Also, the number of grooves,
The width, depth, etc. are set to optimal dimensions depending on conditions such as the size of the workpiece to be cut and the blade size. When the dicing blade of this embodiment is used, the cutting waste of the wafer is guided from the tip of the blade toward the center of the blade by the rotational force of the blade and the groove shape, and is discharged to the outside of the wafer.

[0006]

As explained above, the present invention has the effect that cutting waste is discharged through the grooves by the rotational force of the blade because the grooves are provided on both side surfaces of the dicing blade.

[Brief explanation of drawings]

FIG. 1 is a front view showing an example of the present invention in use.

FIG. 2 is a front view showing a conventional dicing blade in use.

[Explanation of symbols]

1 Dicing blade 2 Cutting waste discharge groove 3 Wafer 4 Table

Claims (1)

[Claims] 1. A dicing blade used for dicing semiconductor wafers, characterized in that curved cutting waste discharge grooves extending from the tip of the dicing blade toward the center are formed radially on both side surfaces of the dicing blade. blade.