JPWO2022196294A1 - - Google Patents
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- Publication number
- JPWO2022196294A1 JPWO2022196294A1 JP2023506914A JP2023506914A JPWO2022196294A1 JP WO2022196294 A1 JPWO2022196294 A1 JP WO2022196294A1 JP 2023506914 A JP2023506914 A JP 2023506914A JP 2023506914 A JP2023506914 A JP 2023506914A JP WO2022196294 A1 JPWO2022196294 A1 JP WO2022196294A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/62—Protection against overvoltage, e.g. fuses, shunts
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L23/49551—Cross section geometry characterised by bent parts
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021045491 | 2021-03-19 | ||
PCT/JP2022/007924 WO2022196294A1 (ja) | 2021-03-19 | 2022-02-25 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022196294A1 true JPWO2022196294A1 (ja) | 2022-09-22 |
Family
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Family Applications (1)
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JP2023506914A Pending JPWO2022196294A1 (ja) | 2021-03-19 | 2022-02-25 |
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US (1) | US20240006274A1 (ja) |
JP (1) | JPWO2022196294A1 (ja) |
CN (1) | CN116998006A (ja) |
DE (1) | DE112022000972T5 (ja) |
WO (1) | WO2022196294A1 (ja) |
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US9379048B2 (en) * | 2013-02-28 | 2016-06-28 | Semiconductor Components Industries, Llc | Dual-flag stacked die package |
JP5767294B2 (ja) | 2013-10-07 | 2015-08-19 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6522402B2 (ja) * | 2015-04-16 | 2019-05-29 | ローム株式会社 | 半導体装置 |
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2022
- 2022-02-25 JP JP2023506914A patent/JPWO2022196294A1/ja active Pending
- 2022-02-25 DE DE112022000972.1T patent/DE112022000972T5/de active Pending
- 2022-02-25 WO PCT/JP2022/007924 patent/WO2022196294A1/ja active Application Filing
- 2022-02-25 CN CN202280022315.9A patent/CN116998006A/zh active Pending
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2023
- 2023-09-12 US US18/465,558 patent/US20240006274A1/en active Pending
Also Published As
Publication number | Publication date |
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DE112022000972T5 (de) | 2023-11-23 |
US20240006274A1 (en) | 2024-01-04 |
WO2022196294A1 (ja) | 2022-09-22 |
CN116998006A (zh) | 2023-11-03 |