JPWO2021230108A1 - - Google Patents

Info

Publication number: JPWO2021230108A1
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

JP2022521844A

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-05-14

Filing date

2021-04-30

Publication date

2021-11-18

2021-04-30 Application filed filed Critical

2021-11-18 Publication of JPWO2021230108A1 publication Critical patent/JPWO2021230108A1/ja

Status Pending legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0243—Printed circuits associated with mounted high frequency components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Structure Of Printed Boards (AREA)

JP2022521844A 2020-05-14 2021-04-30 Pending JPWO2021230108A1 (ja)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2020085423		2020-05-14
PCT/JP2021/017207 WO2021230108A1 (ja)	2020-05-14	2021-04-30	高周波回路モジュール

Publications (1)

Publication Number	Publication Date
JPWO2021230108A1 true JPWO2021230108A1 (ja)	2021-11-18

Family

ID=78525764

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2022521844A Pending JPWO2021230108A1 (ja)	2020-05-14	2021-04-30

Country Status (4)

Country	Link
US (1)	US20230135728A1 (ja)
JP (1)	JPWO2021230108A1 (ja)
CN (1)	CN115398739A (ja)
WO (1)	WO2021230108A1 (ja)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2661570B2 (ja) *	1994-12-14	1997-10-08	日本電気株式会社	高周波装置
US5668509A (en) *	1996-03-25	1997-09-16	Hughes Electronics	Modified coaxial to GCPW vertical solderless interconnects for stack MIC assemblies
US6441697B1 (en) *	1999-01-27	2002-08-27	Kyocera America, Inc.	Ultra-low-loss feedthrough for microwave circuit package
JP3346752B2 (ja) *	1999-11-15	2002-11-18	日本電気株式会社	高周波パッケージ
JP2005123894A (ja) *	2003-10-16	2005-05-12	Matsushita Electric Works Ltd	高周波用マルチチップモジュール基板
JP4646699B2 (ja) *	2005-05-26	2011-03-09	京セラ株式会社	高周波伝送用回路基板および高周波回路基板
JP4395103B2 (ja) *	2005-06-06	2010-01-06	富士通株式会社	導波路基板および高周波回路モジュール
JP2009140993A (ja) *	2007-12-04	2009-06-25	Yokogawa Electric Corp	プリント基板
JP5047362B2 (ja) *	2009-02-25	2012-10-10	京セラ株式会社	高周波モジュール
JP5493801B2 (ja) *	2009-12-14	2014-05-14	富士通株式会社	信号変換器及び高周波回路モジュール
JP3173143U (ja) *	2010-12-03	2012-01-26	株式会社村田製作所	高周波信号線路
CN205584615U (zh) *	2013-12-12	2016-09-14	株式会社村田制作所	信号传输元器件及电子设备
TWI605736B (zh) *	2014-03-20	2017-11-11		Loss-resistance structure of a high-frequency signal connection pad of a plug-in assembly
US9620841B2 (en) *	2014-06-13	2017-04-11	Nxp Usa, Inc.	Radio frequency coupling structure
JP2017060021A (ja) *	2015-09-17	2017-03-23	日本電気株式会社	高周波回路基板
JP6692737B2 (ja) *	2016-12-06	2020-05-13	日本電信電話株式会社	高周波接続線路
US10784215B2 (en) *	2018-11-15	2020-09-22	Steradian Semiconductors Private Limited	Millimeter wave integrated circuit and system with a low loss package transition

2021
- 2021-04-30 CN CN202180028084.8A patent/CN115398739A/zh active Pending
- 2021-04-30 US US17/918,382 patent/US20230135728A1/en active Pending
- 2021-04-30 JP JP2022521844A patent/JPWO2021230108A1/ja active Pending
- 2021-04-30 WO PCT/JP2021/017207 patent/WO2021230108A1/ja active Application Filing

Also Published As

Publication number	Publication date
CN115398739A (zh)	2022-11-25
US20230135728A1 (en)	2023-05-04
WO2021230108A1 (ja)	2021-11-18

Publication	Publication Date	Title
BR112023005462A2 (ja)	2023-05-30
BR112023012656A2 (ja)	2023-10-03
BR112021014123A2 (ja)	2021-12-07
BR112022024743A2 (ja)	2023-06-27
BR102021018859A2 (ja)	2021-11-30
BR102021015500A2 (ja)	2021-11-09
BR102021007058A2 (ja)	2021-11-23
BR112023008622A2 (ja)	2023-10-03
BR112023011738A2 (ja)	2023-07-04
BR112023016292A2 (ja)	2023-09-05
BR112023004146A2 (ja)	2023-06-27
BR112023008976A2 (ja)	2023-06-27
BR102021020147A2 (ja)	2021-12-28
BR102021018926A2 (ja)	2021-11-30
BR102021018167A2 (ja)	2021-09-13
BR102021017576A2 (ja)	2021-11-30
BR102021016837A2 (ja)	2021-11-09
BR102021016551A2 (ja)	2021-11-09
BR102021016375A2 (ja)	2021-11-30
BR102021016176A2 (ja)	2021-11-09
BR102021016200A2 (ja)	2021-12-28
BR102021015566A2 (ja)	2021-10-26
BR102021015450A8 (ja)	2021-11-08
BR102021015220A2 (ja)	2021-10-26
BR102021015247A2 (ja)	2021-11-30

Legal Events

Date	Code	Title	Description
2023-12-21	A621	Written request for application examination	Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20231221
2024-10-01	A131	Notification of reasons for refusal	Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20241001

Date

Code

Title

Description

2023-12-21

A621

Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231221

2024-10-01

A131

Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241001