JPWO2006073098A1 - Work breaking method and device, scribing and breaking method, and scribing device with break function - Google Patents

Abstract

Provided is a workpiece breaking method capable of preventing chipping due to rubbing on the back surface of a workpiece when breaking a workpiece having a scribe line on the surface. The work 5 breaking method of the present invention includes a work adhesion step of attaching the back surface of the work 5 to the expandable sheet 9, a sheet pulling step of pulling the sheet 9 to which the work 5 is attached, and a state in which the sheet 9 is pulled. And a workpiece dividing step of causing the scribe line 5c to reach the back surface of the workpiece 5. Since the workpiece 5 is separated at the same time as the workpiece 5 is divided by the tensile force of the sheet 9, the divided workpiece 5 is less rubbed, and chipping can be prevented from occurring on the back surface. In addition, by applying a tensile force to the workpiece 5, the tensile force assists the workpiece division, so that the workpiece 5 can be divided with a smaller force.

Description

  The present invention relates to a work breaking method and apparatus for breaking a work made of a brittle material such as a semiconductor wafer and glass, a scribing and breaking method, and a scribing apparatus with a breaking function.

  As a method for breaking (dividing) a workpiece made of a brittle material such as a semiconductor wafer or glass into a predetermined shape, a dicing method has been adopted in which the workpiece is fed into a rotary blade and divided into a dice shape. In this dicing method, the volume of the portion fed to the rotary blade of the workpiece is removed.

  In recent years, instead of the dicing method, after scribing a scribe line on the surface of a work with a scribe device, a method of breaking a work by growing a crack along the score line with a break device has been used ( For example, see Patent Document 1, paragraphs [0001] to [0004]).

  FIG. 29 shows a principle diagram of a conventional break method. In this breaking method, a workpiece 2 is placed between two support points 1a and 1b, and a pressure is applied between the support points 1a and 1b by a break head 3 from above. The applied pressure is applied from the side opposite to the side on which the scribe line is engraved. By applying a pressure between the support points 1a and 1b, a bending moment is generated in the work 2, and a tensile stress is generated in a portion where the scribe line is carved by the bending moment. Due to this tensile stress, the crack of the scribe line propagates from the front surface to the back surface (from the bottom to the top in FIG. 29). When the crack reaches the back of the workpiece, the workpiece is divided.

  However, in the conventional breaking method shown in FIG. 29, when breaking, the separated workpieces rub against each other on the back surface of the workpiece, and chipping (strips of strips) is formed on the back surface of the workpiece indicated by part A in the figure. Phenomenon). In addition, when the applied pressure from the break head increases, it also causes a strain on the workpiece.

  As a technique for solving this problem, as shown in FIG. 30, Patent Document 2 describes that “a glass substrate assembly W formed by bonding a pair of glass substrates S 1 and S 2 to a broken line for each liquid crystal cell. A glass substrate S1 with a cut-out groove formed along the surface is placed on a spherical support head 71, and a sufficiently flexible presser sheet 73 is mounted thereon, and the presser sheet 73 and the presser sheet 73 are placed through the exhaust pipe 71b. The air in the space accommodating the glass substrate assembly W surrounded by the support head surface 71a and the like is discharged, and the glass substrate assembly W is brought into close contact with the spherical support head surface 71a to cut the glass substrate S1. A method of dividing along a notch ”is disclosed (see Patent Document 2 and Claim 1).

JP-A-9-202635 JP 2004-354836 A

  However, in the breaking method described in Patent Document 2, since the presser sheet 73 is placed on the glass substrate assembly W, the elastic force of the presser sheet 73 opens the notch groove d of the glass substrate S1. Disturb. Therefore, there is a possibility that chipping may occur due to rubbing of the sectional surface of the glass substrate S1. In addition, when the presser sheet 73 is removed, the finally divided glass substrate assembly W is separated, and the glass substrate assembly W is difficult to handle.

  Accordingly, an object of the present invention is to provide a work breaking method and apparatus capable of preventing occurrence of chipping due to rubbing on a divided surface of a work when a work having a scribe line is cut.

  In order to solve the above-mentioned problem, the invention described in claim 1 is a work breaking method for dividing a work (5) having a scribe line engraved on a surface along the scribe line (5c). A workpiece bonding step of bonding the back surface of the workpiece (5) to a possible sheet (9), a sheet pulling step of pulling the sheet (9) to which the workpiece (5) is bonded, and the sheet (9). And a workpiece dividing step for bringing the scribe line (5c) to the back surface of the workpiece in a tensioned state, wherein the divided workpiece (5) is separated by a tensile force of the sheet (9). And

  According to the present invention, since the workpieces are separated at the same time as being divided, the friction between the divided workpieces is reduced, and chipping can be prevented from occurring on the back surface. Moreover, since the tensile force can be used to assist in dividing the workpiece by applying a tensile force to the workpiece, the workpiece can be broken with a smaller force. Furthermore, since the work is pasted on the sheet, the divided work is not separated or rubbed after the work is broken. Therefore, the handling of the workpiece becomes easy.

  According to a second aspect of the present invention, in the work breaking method according to the first aspect, in the work dividing step, the surface side of the work (5) is placed outside the curve while the sheet (9) is pulled. The workpiece (5) is curved so that the scribe line (5c) reaches the back surface of the workpiece (5).

  According to the present invention, a thick workpiece can be divided without causing chipping by using a bending moment and a tensile force in combination.

  According to a third aspect of the present invention, in the work breaking method according to the first or second aspect, in the sheet pulling step, a gap is formed around the work (5) after the sheet (9) is pulled. The frame member (12) is attached to the sheet (9), and the tension of the sheet (9) is confined in the frame member (12).

  According to this invention, even if the tensile force is removed after the workpiece is pulled, the tensile force can be continuously applied to the workpiece.

  The invention according to claim 4 is a work breaking device for cutting a work (5) having a scribe line engraved on the surface along the scribe line (5c), the back surface of the work (5) being attached The sheet tension means (10, 11, 14a, 14b) for pulling the stretchable sheet (9) to be attached, and the surface of the workpiece (5) is outside the curve in a state where the sheet (9) is pulled. And a workpiece dividing means (16) for bending the workpiece (5) to thereby reach the back surface of the workpiece (5) with the scribe line (5c). They are separated by the tensile force of the sheet (9).

  According to the present invention, since the workpieces are separated at the same time as being divided, the friction between the divided workpieces is reduced, and chipping can be prevented from occurring on the back surface. In addition, by using a bending moment and a tensile force in combination, a thick workpiece can be divided without causing chipping. Furthermore, since the work is pasted on the sheet, the divided work is not separated or rubbed after the work is broken. Therefore, the handling of the workpiece becomes easy.

  The invention according to claim 5 is a work scribe and break method in which the work (5) is cut along the scribe line (5c) while the scribe line (5c) is cut on the surface of the work (5). The work adhesion step of attaching the work (5) to the stretchable sheet (9), the sheet pulling step of pulling the sheet (9) to which the work (5) was attached, and the sheet (9) were pulled In a state, the scribe line (5c) is engraved on the surface of the workpiece (5), and the scribe line (5c) on the surface of the workpiece (5) reaches the back surface of the workpiece (5). The separated work (5) is separated by the tensile force of the sheet (9).

  According to the present invention, since the workpieces are separated at the same time as being divided, the friction between the divided workpieces is reduced, and chipping can be prevented from occurring on the back surface. In addition, since the tensile force is applied to the workpiece by assisting the workpiece division by applying a tensile force to the workpiece, the workpiece can be broken simultaneously with the scribe. Furthermore, since the work is pasted on the sheet, the divided work is not separated or rubbed after the work is broken. Therefore, the handling of the workpiece becomes easy.

  The invention according to claim 6 is a scribing device with a break function for cutting the work (5) along the scribe line while scribing the scribe line (5c) on the surface of the work (5), the work (5 ) And a sheet pulling means (22) for pulling the stretchable sheet (9) attached, and in a state where the sheet (9) is pulled, a scribe line (5c) is engraved on the surface of the workpiece (5). And a workpiece dividing means (20) for dividing the workpiece (5) by causing the scribe line (5c) on the surface of the workpiece (5) to reach the back surface of the workpiece (5), and being divided. Further, the workpiece (5) is separated by a tensile force of the sheet (9).

  According to the present invention, since the workpieces are separated at the same time as being divided, the friction between the divided workpieces is reduced, and chipping can be prevented from occurring on the back surface. In addition, since the tensile force is applied to the workpiece by assisting the workpiece division by applying a tensile force to the workpiece, the workpiece can be broken simultaneously with the scribe. Furthermore, since the work is pasted on the sheet, the divided work is not separated or rubbed after the work is broken. Therefore, the handling of the workpiece becomes easy.

  The invention according to claim 7 is a method for breaking a work (51), in which a work (51) having a surface scribed with a scribe line (52) is divided along the scribe line (52). A work bonding step of attaching the back surface of 51) to the sheet (53), and bringing the sheet (53) into close contact with the break table (55, 65) so that the surface of the work (51) is outside the curve. A workpiece dividing step of bending the workpiece (51), thereby dividing the workpiece (51) by causing the scribe line (52) on the surface of the workpiece (51) to reach the back surface of the workpiece (51); It is characterized by providing.

  According to this invention, since the sheet is on the back side of the workpiece, the sheet does not prevent the workpiece from breaking by opening the scribe line on the front side of the workpiece. Therefore, it is possible to prevent the chipping from occurring due to rubbing of the workpiece cross section. In addition, by pasting the workpiece on the sheet, the divided workpiece does not fall apart.

  The invention according to claim 8 is the workpiece breaking method according to claim 7, wherein the workpiece dividing step is performed by using the workpiece (51) in which a plurality of scribe lines (52) are engraved vertically and horizontally as a semi-cylinder. Curved along the shape of the break table (55), the strip dividing step of dividing the work (51) into a plurality of strips, and then the sheet (53) retracted from the break table (55), A relative rotation step of rotating 90 degrees relative to the break table (55) in a plane including the sheet (53), and the work (51) divided into strips, the break table (55 And a chip cutting step for cutting the workpiece (51) into a plurality of chips.

  According to the present invention, a work in which scribe lines are cut vertically and horizontally can be divided into chips without causing chipping. And since the work is divided in two steps using a semi-cylindrical break table, compared to the case where the work is divided in one step using a spherical break table, when bending along the break table In addition, the force along the scribe line becomes difficult to work, and the work section is not rubbed.

  According to a ninth aspect of the present invention, in the work breaking method according to the seventh or eighth aspect, in the work dividing step, the work (51) is attached by suction holes (56, 66) for sucking air. The workpiece (51) is curved along the break table (55, 65) by adsorbing the sheet (53) to the break table (55, 65).

  According to this invention, a workpiece | work can be curved along a break stand by attracting | sucking air from an adsorption | suction hole.

  The invention according to claim 10 is the workpiece breaking method according to claim 7 or 8, wherein, in the workpiece dividing step, the break table (55, 55) is perpendicular to a plane including the sheet (53). 65) is moved relative to the sheet (53) and the break table (55, 65) is pressed against the sheet (53) to which the work (51) is attached, thereby the work (51 ) Is curved along the break table (55, 65).

  According to the present invention, the work can be curved along the break table by pressing the sheet to which the work is attached to the break table. Moreover, since a tensile force is applied to the workpiece before dividing the workpiece, the divided workpieces tend to be separated from each other when the workpiece is divided. Therefore, the work section is not rubbed.

  The invention according to claim 11 is a work breaking device for cutting a work (51) having a scribe line (52) engraved on a surface thereof along the scribe line (52), the work (51) being The surface of the work (51) is brought into close contact with the break table (55, 65) and the sheet (53) to which the back surface of the work (51) is attached to the break table (55, 65). Sheet adhering means (56, 66, 64) for bending the workpiece (51) so that the outer surface of the workpiece (51) is curved, and the scribe line (52) on the surface of the workpiece (51) is connected to the workpiece (51). ), And the work (51) is divided.

  According to this invention, since the sheet is on the back side of the workpiece, the sheet does not prevent the workpiece from breaking by opening the scribe line on the front side of the workpiece. Therefore, it is possible to prevent the chipping from occurring due to rubbing of the workpiece cross section. In addition, by pasting the workpiece on the sheet, the divided workpiece does not fall apart.

  According to a twelfth aspect of the present invention, in the work breaking device according to the eleventh aspect, the contact means (56, 66) gives a height difference from a high position to a low position of the break table (55, 65). A plurality of suction holes (56, 66) for sucking air, and sucking the sheet (53) by the suction holes (56, 66), thereby allowing the work (51) to move to the break table. (55, 65).

  According to the present invention, the work can be brought into close contact with the break table in order from the high position of the break table toward the low position. Since the workpiece is divided in order from the high position to the low position, it is possible to prevent the chipping from being generated by rubbing the sectional surface of the workpiece.

  According to a thirteenth aspect of the present invention, in the work breaking device according to the twelfth aspect, the contact means further includes a plurality of air suctions in order from the higher position to the lower suction holes (56, 66). An electromagnetic valve (63) is provided.

  According to the present invention, the work can be securely brought into close contact with the break table from the high position to the low position of the work.

  According to a fourteenth aspect of the present invention, in the work breaking apparatus according to the eleventh aspect, the contact means is disposed so as to sandwich the break table (55, 65), and an end portion of the sheet (53) is arranged. Holding sheet fixing base (64), and pressing to move the break base (55, 65) relative to the sheet fixing base (64) in a direction perpendicular to the plane including the sheet (53) And pressing the sheet (53) on which the work (51) is adhered to the break table (55, 65), thereby moving the work (51) to the break table (55, 65). It is characterized by being curved along.

  According to the present invention, the work can be curved along the break table by pressing the sheet to which the work is attached to the break table. Moreover, since a tensile force is applied to the workpiece before dividing the workpiece, the divided workpieces tend to be separated from each other when the workpiece is divided. Therefore, the work section is not rubbed.

  The invention according to claim 15 is the workpiece breaker according to any one of claims 11 to 14, wherein the breaker is configured to dispose the workpiece (51) in which a plurality of scribe lines are cut vertically and horizontally, as a semi-cylinder. The workpiece (51) is bent into a plurality of strips by curving along the shape of the break table (55), and then the sheet (53) retracted from the break table (55), the break table ( 55) is rotated relative to the plane containing the sheet (53) by 90 degrees, and then the work (51) divided into strips is bent again along the break table (55). The workpiece (51) is divided into a plurality of chips.

  According to the present invention, a work in which scribe lines are cut vertically and horizontally can be divided into chips without causing chipping. And since the work is divided in two steps using a semi-cylindrical break table, compared to the case where the work is divided in one step using a spherical break table, when bending along the break table In addition, the force along the scribe line becomes difficult to work, and the work section is not rubbed.

  According to the first to fifteenth aspects of the present invention, it is possible to prevent occurrence of chipping due to rubbing on a divided section of a workpiece when the workpiece having a scribe line is cut.

Principle diagram of a work breaking method in the first embodiment of the present invention Diagram showing bending stress generated by bending moment Principle diagram of work breaking method according to second embodiment of the present invention Schematic diagram of how to apply tensile force to a workpiece using a sheet The perspective view which shows the break apparatus in the 1st Embodiment of this invention. A perspective view showing a tension applying mechanism for applying a tensile force to a workpiece The figure which shows the crack which generate | occur | produces with a break apparatus ((A) in a figure shows the case where the break apparatus of this embodiment is used, (B) shows the case where the conventional break apparatus is used as a comparative example.) The perspective view which shows the scribing apparatus with a break function in the 2nd Embodiment of this invention. The figure which shows the scribing apparatus with a break function of the said FIG. 8 ((A) in the figure shows a top view, (B) in the figure shows a side view) The figure which shows the crack which generate | occur | produces with the scribing apparatus with a break function of the said FIG. 8 ((A) in a figure shows the case where the scribing apparatus of this embodiment is used, (B) in the figure shows the conventional scribing apparatus as a comparative example. (Indicates when used) The perspective view which shows the scribing apparatus with a break function in the 3rd Embodiment of this invention. The figure which shows the crack which generate | occur | produces with the scribing apparatus with a break function of the said FIG. 11 ((A) in a figure shows the case where the scribing apparatus with a break function of this embodiment is used, (B) is a conventional example as a comparative example) (Shown when a scribe device is used) Diagram showing the appearance of the expanding jig Photo showing the sheet tension using the prototype jig Photo showing silicon wafer cutting in the expanded state The figure which shows the division (D-650) of the cross scribe product Photograph showing the surface properties (D-675) of the workpiece after cutting The perspective view which shows the break apparatus in the 4th Embodiment of this invention. Sectional drawing which shows the state which affixed the workpiece | work on the sheet | seat ((A) in a figure shows the state before curving a workpiece | work, (B) in the figure shows the state which curved the workpiece | work) Plan view of semi-cylindrical break table Bottom view of the break table of FIG. The perspective view which shows the example which pulled the sheet | seat which can be expanded-contracted in the state which affixed the workpiece | work on the sheet | seat The top view which shows the other example of the suction hole formed in a break stand The perspective view which shows the example which enclosed the break stand with the box The perspective view which shows the example which provided the solenoid valve in the attraction | suction path | route The perspective view which shows the breaking apparatus in the 5th Embodiment of this invention ((A) in the figure shows before pushing up a sheet | seat, (B) in the figure shows the step which is pushing up a sheet | seat) Side view showing spherical break table Plan view showing a spherical break table Principle diagram of conventional break method Sectional drawing which shows the conventional break device ((A) in a figure shows before adsorb | sucking a workpiece | work, (B) in a figure shows after adsorb | sucking a workpiece | work).

Explanation of symbols

5 ... Work 5c ... Scribe wire 5d ... Crack 9 ... Sheet 10, 11 ... Expanding jig (sheet pulling means) consisting of fixed side and moving side
14a, 14b ... tension applying mechanism (sheet pulling means) consisting of a stage
12 ... Ring (frame member)
16 ... Break head (work dividing means)
20 ... Scribe head (work cutting means)
22 ... Clamp jig (sheet pulling means)
P ... Tensile force M ... Bending moment 51 ... Work piece 52 ... Scribe wire 53 ... Sheet 55, 65 ... Break table 56, 66 ... Adsorption hole (sheet contact means)
63 ... Solenoid valve 64 ... Seat fixing base (sheet contact means)

  FIG. 1 shows a principle diagram of a work breaking method according to a first embodiment of the present invention. On the surface of a plate-like workpiece such as a semiconductor wafer or glass, a scribe line is engraved in advance by a scribe device. The scribing device presses a pointed point or a freely rotating thin disk (wheel) as a cutter against the surface of the workpiece, and moves the cutter along the surface of the workpiece, thereby marking a scribe line on the surface of the workpiece.

  After scribing a scribe line on the surface of the workpiece, the workpiece 5 is set on the breaking device. The breaking device gives a bending moment to the workpiece 5 so that the side 5a on which the scribe line is engraved is outside the curve. Specifically, the workpiece 5 is placed between the two support points 6a and 6b (table), and the break head 7 applies pressure to the workpiece 5 between the support points 6a and 6b from above. The applied pressure is applied from the side opposite to the side 5a on which the scribe line is engraved. By applying pressure between the support points 6a and 6b, a bending moment is generated in the workpiece 5, and a tensile stress is generated as a bending stress in a portion where the scribe line is carved by the bending moment. Cracks propagate from the front surface to the back surface (in FIG. 1, from bottom to top) due to the tensile stress.

  Simultaneously with applying a bending moment to the workpiece 5, a tensile force P is applied to the workpiece 5 in a direction perpendicular to the scribe line. By applying a tensile force P to the workpiece 5, the workpiece 5 is separated at the same time as being divided, so that the divided workpieces 5 are less rubbed and chipping occurs on the back surface (opposite the scribe side). Can be suppressed. Further, since the tensile force P is applied to the work 5 by assisting the work division, the work 5 can be broken with a smaller pressing force of the break head 7.

  If the work 5 can be broken only by applying a tensile force to the work 5, a bending moment may not be given to the work 5. Even when a bending moment is applied to the work 5, a break roller can be used instead of the break head 7, and a suction device that forms a linearly extending protrusion on the table and sucks the work on the tables on both sides of the protrusion. And the workpiece may be curved with the protrusion portion as a vertex.

  FIG. 2 shows the bending stress generated by the bending moment. When a bending moment M is applied to the workpiece 5, a bending stress σ is generated on the workpiece by the bending moment M. The distribution of the bending stress σ is as shown in the figure. A tensile stress is generated below the neutral shaft 5e, and a compressive stress is generated above. The compressive stress σ generated on the upper side of the workpiece 5 causes the workpiece 5 to rub. Even if the tensile force P applied to the workpiece is smaller than the compressive stress σ, the workpiece 5 can be separated at the same time as being divided, so that the friction of the workpiece 5 can be reduced. When the tensile force P of the workpiece 5 is increased to a value equal to or higher than the compressive stress σ generated on the upper side of the workpiece 5 due to the bending moment M, the workpiece 5 does not generate a compressive stress, thereby eliminating the cause of the workpiece 5 being rubbed. be able to.

  FIG. 3 shows a principle diagram of a work breaking method according to the second embodiment of the present invention. In this embodiment, the workpiece 5 is broken by applying a tensile force P to the workpiece 5 in a direction perpendicular to the scribe line while scribing a scribe line on the surface of the workpiece 5. That is, in this embodiment, the scribe process for engraving the scribe line on the work 5 and the break process for dividing the work are performed simultaneously.

  By applying a tensile force P to the workpiece 5 while scribing a scribe line on the workpiece 5, the crack 5d develops in the thickness direction of the workpiece (from top to bottom in FIG. 3). When the crack 5d reaches the back surface 5b, the work 5 is broken. Further, by applying a tensile force to the workpiece 5, the workpiece 5 is separated at the same time as being divided, so that the divided workpiece 5 is less rubbed, and chipping can be suppressed from occurring on the back surface 5b of the workpiece 5. .

  When the thickness of the workpiece 5 is large, the crack may not propagate to the back surface 5b only by applying a tensile force to the workpiece 5. In this case, a tensile force is applied, and a bending moment is applied to the workpiece 5 so that the side 5a on which the scribe line is engraved is outside the curve.

  FIG. 4 shows a principle diagram of a method for applying a tensile force to the workpiece 5 using the sheet 9. First, as shown in FIG. 4A, the workpiece 5 is attached to the extendable sheet 9. The sheet 9 is previously given adhesiveness. Both ends of the sheet 9 are clamped by an expanding jig including, for example, a fixed side 10 and a movable side 11 movable with respect to the fixed side 10 as sheet pulling means. With the workpiece 5 attached to the sheet 9, the movable side 11 of the expanding jig is moved to pull the sheet 9 in a predetermined direction and apply a tensile force (tension) to the sheet 9. In this example, the work 5 is pulled only in the X direction. However, the work 5 is not limited to the X direction, but may be pulled in two directions, ie, the X direction and the Y direction orthogonal to the X direction.

  Next, as shown in FIG. 4B, a ring 12 as a frame member is attached around the work 5 while maintaining the tension, and the sheet outside the ring 12 is cut. A state in which the sheet outside the ring 12 is cut is shown in FIG. There is a gap between the periphery of the workpiece 5 and the ring 12, and the tension is confined in the sheet 9 between the workpiece 5 and the ring 12. On the other hand, since the workpiece 5 is stretched on the sheet 9 before applying the tension, the portion of the sheet 9 to which the workpiece 5 is attached is not tensioned.

  Next, the tensioned work 5 is conveyed to a break device or a scribe device with a break function, and as shown in FIG. 4D, the work 5 is broken by the break device or the scribe device with a break function. Since tension is applied to the workpieces 5, the workpieces 5 are separated from each other at the same time as the division, and a gap is left between the workpieces 5. Finally, the adhesiveness of the sheet 9 is removed by UV irradiation or the like, and the workpiece 5 is peeled from the sheet 9.

  The method of applying tension to the work 5 by the sheet 9 as described above can be suitably used for a semiconductor wafer having a small work 5 size.

  A break method and break device for the work 5 that realizes the break principle will be described. FIG. 5 shows a break device in the first embodiment of the present invention. The work 5 is set on the table 23 of the breaking device with the surface of the work 5 on which the scribe line 5c is engraved facing down. A bar-shaped break head 16 extending in the direction of the scribe line 5c is disposed as a workpiece dividing means immediately above the scribe line 5c. The break device presses the break head 16 from the upper surface of the work 5 and curves the work 5 so that the side on which the scribe line is engraved is on the outside.

(Work bonding process / sheet pulling process)
The workpiece 5 having the scribe line 5c engraved on the front surface is attached to a sheet 9 whose back surface can be expanded and contracted. And the sheet | seat 9 on which the workpiece | work 5 was affixed is pulled so that the tensile force P can be provided to the workpiece | work 5. FIG. FIG. 6 shows a tension applying mechanism as a sheet pulling means for applying a tensile force to the workpiece 5. The workpiece 5 is attached to the sheet 9, and the sheet 9 is fixed to the pair of stages 14a and 14b by vacuum or the like. Thereafter, the stages 14 a and 14 b are moved in opposite directions to pull the sheet 9. Both stages 14a and 14b may be moved in opposite directions, or one stage 14a may be fixed and only the remaining one stage 14b may be moved. In addition, as shown in FIG. 9, the workpiece 5 may be attached to the sheet 9, and then the sheet 9 may be pulled with a clamping jig 22 that clamps both ends of the sheet 9. Further, although the tensile force is applied only in the X direction of the workpiece, two sets of tension applying mechanisms may be provided to apply the tensile force in the X direction and the Y direction orthogonal to each other. Of course, the ring 12 shown in FIG. 4 may be used.

(Work cutting process)
As shown in FIG. 5, in a state where the sheet 9 is pulled, the work 5 is bent so that the surface side of the work 5 is outside the curve by the break head 16 as the work dividing means. Then, by bending the work 5, the scribe line 5 c on the surface of the work 5 reaches the back surface of the work 5. FIG. 7A shows a crack 5d generated in the workpiece 5. Since the crack 5d can be developed by applying the tensile force P to the workpiece 5, the workpiece 5 can be broken with a small applied pressure from the break head 16. Moreover, since the workpiece | work 5 leaves | separates after dividing | segmenting, it can suppress that chipping generate | occur | produces on a workpiece | work edge and can break without applying an extra load (damage) to a division | segmentation cross section. FIG. 7B shows a comparative example when no tensile force is applied to the workpiece 5. When no tensile force is applied to the workpiece 5, there is no escape in the horizontal direction. Therefore, when the break head 16 is pressed against the workpiece 5, chipping occurs in the A part on the back surface, and the sectional surface of the workpiece 5 is also rubbed and damaged. End up. If the workpiece is thin, it can be divided only by the tensile force P without applying the bending moment M. In this case, the break head 16 that gives the bending moment M becomes unnecessary.

  8 and 9 show a scribing device with a break function according to the second embodiment of the present invention. 8 shows a perspective view of the scribing device with a break function, FIG. 9 (A) shows a plan view of the scribing device with a break function, and FIG. 9 (B) shows a side view of the scribing device with a break function. This scribing device with a breaking function performs a scribing process and a breaking process at the same time. A scribing head 20 (work cutting means) having a table 18 that supports the work 5, a cutter 19 that comes into contact with the work 5, and the scribing head 20. And a moving mechanism 21 for linearly moving. The scribe head 20 is provided with a vibrator such as a magnetostrictive vibrator or a piezoelectric element. The magnetostrictive vibrator is vibrated by the current from the transmitter, and the cutter 19 is vibrated by the vibrator. When the cutter 19 is vibrated, an impact force is applied from the cutter 19 to the workpiece 5, so that a crack develops in the thickness direction of the workpiece 5. The moving mechanism 21 that moves the scribe head 20 is a known moving mechanism such as a ball screw mechanism. When the cutter 19 in contact with the workpiece is moved, the scribe line 5 c is cut on the surface of the workpiece 5.

(Work bonding process / sheet pulling process)
The workpiece 5 having the scribe line 5c engraved on the front surface is attached to a sheet 9 whose back surface can be expanded and contracted. And the sheet | seat 9 on which the workpiece | work 5 was affixed is pulled so that the tensile force P can be provided to the workpiece | work 5. FIG. That is, as shown in FIG. 9, the workpiece 5 is attached to the sheet 9, and then the sheet 9 is pulled with a clamping jig 22 that clamps both ends of the sheet 9. Of course, the sheet 9 may be pulled using a tension applying mechanism shown in FIG.

(Work cutting process)
As shown in FIG. 8, in a state where the sheet 9 is pulled, the scribe line 5 c is cut on the surface of the work 5 by the scribe head 20 as the work dividing means, and the scribe line 5 c on the surface of the work 5 is Let it reach the back side. FIG. 10A shows a crack 5d that occurs. By applying a tensile force P to the workpiece 5, the vertical crack 5d generated by the cutter 19 of the scribe head 20 can be further grown, and finally a full cut is also possible. By applying a tensile force P to the workpiece 5, a large vertical crack 5d can be formed even when the load from the cutter 19 is low. In addition, since the escape space for the vertical crack 5d is created, no extra load (damage) is applied to the sectional surface. FIG. 10B shows a comparative example when the tensile force P is not applied to the workpiece 5. When the tensile force P is not applied to the workpiece 5, the vertical crack 5d is difficult to grow and there is no escape space for the vertical crack 5d, so that an extra load (damage) is applied to the sectional surface of the workpiece 5. When the load of the cutter 19 is increased in order to form the long vertical crack 5d, a large load is also applied to the divided section, and the quality and breaking strength of the divided product are lowered.

  FIG. 11 shows a scribing device with a break function according to the third embodiment of the present invention. A feature of this embodiment is that a bending moment M is applied to the workpiece in the scribing device with a break function of the second embodiment. The bending moment M is applied so that the side on which the scribe line 5c is carved is outside the curve. When the thickness of the workpiece 5 is increased, the workpiece cannot be divided only by applying the tensile force P. Therefore, a bending moment M is also applied to the workpiece 5 to facilitate the division of the workpiece. The method of giving a bending moment to a workpiece is a method of giving a bending moment by three-point bending, a method of tilting one of a pair of tables holding the workpiece with respect to the scribe line with respect to the other, or a scribe. A system is used in which one of a pair of clamping devices that hold a workpiece with a line as a boundary is inclined with respect to the other by a predetermined angle. Since the scribing head 20 and the moving mechanism 21 are the same as those of the scribing apparatus of the second embodiment, the same reference numerals are given and description thereof is omitted.

  FIG. 12A shows a crack generated when the scribing device with a break function of the third embodiment is used. By applying the tensile force P and the bending moment M to the workpiece 5, the vertical crack 5d generated by the scribing device can be further grown, and finally a full cut is also possible. FIG. 12B shows a comparative example when the tensile force P / bending moment M is not applied to the workpiece 5. When no tensile force / bending moment is applied to the workpiece 5, the vertical crack 5d is difficult to grow and there is no escape for the vertical crack 5d, so that an extra load (damage) is applied to the sectional surface of the workpiece 5. When the load of the cutter 19 is increased in order to form a long vertical crack, a large load is applied to the divided section, and the quality and fracture strength of the divided product are lowered.

(1) Outline of the apparatus In order to investigate the effect of the expand, a test jig having only an expand mechanism was prototyped (FIG. 13). The external dimensions are 410 mm × 450 mm. With this test jig, it is possible to apply tension to the sheet only in the X direction and in a combined direction of the X and Y directions. The sheet clamp is combined with a grooved plate and fixed with screws. This grooved plate can clamp the full width of the sheet. The tension is adjusted with the screw of “Tension” in the figure while observing the scale.

(2) Overview of Expanding Application Sheet The dicing tape used is D-650 and expansion tape D-675 (manufactured by Adwill, generally used for dicing silicon wafers, width of 300 mm, thickness of 80 μm). ). Cut to an appropriate length and used.

(3) Effect of Expand on Wafer Break A silicon wafer was attached on a dicing tape (D-675) and pulled in the X and Y directions by 15 mm. When the workpiece was pulled only in the sheet pulling direction (X direction), wrinkles were formed in the sheet pulling direction (X direction) and in the orthogonal direction (Y direction) (FIG. 14A), but the same distance expanded in the orthogonal direction. Then, wrinkles were not seen (FIG. 14 (b)).
When the work was divided (split), a gap was created at the location where the work was divided (FIG. 15). The gap was about 340 μm. The gap that had been divided and opened once showed a tendency to gradually spread over time. After several hours, another place was newly divided, and it was confirmed that the gap was narrower than the previous opening width.

(4) In case of cross-scribing work The effect of the expansion was examined on the cross-scribing work. Both expansion distances are 15 mm. As a result of the division (hand split) in the X direction (FIG. 16), the scribe line has been removed, but there is a gap at the division location. Moreover, the clearance gap was seen similarly in the cross direction, and the width | variety was wider than the 1st parting part. It is thought that the order of the expansion affects. When the ring was removed from the sheet and left for several hours, the gap contracted, but never became zero.

(5) In the case of dicing tape D-675 An expanding break test was conducted by changing the material of the dicing tape to D-675 for expanding. The expansion distance was 20 mm in both the X and Y directions. As a result of the division, the tension was released at the division point in both directions, and a gap appeared. The width of the gap in the pulling direction is wide in the X direction as in the previous D-650 tape, and slightly narrower in the Y direction. Since vertical cracks due to scribing are shallow and the effect of splitting by hand is large, there are many cases where the score line is out of position. When the score line position could be divided, it was divided into a straight line, no large chipping was observed at the edge portion, and no adhesion of particles was observed on the surface of the workpiece after the division (FIG. 17). The split surface properties are not good because of splitting, but the perpendicularity is almost good.

(6) Summary The results obtained in this test are summarized below.
It was confirmed that the conventional dicing tape could be expanded sufficiently.
At the same time as the work was divided, a gap was created at the part where it was divided.
When expanding with cloth, the tension seems to change in the order of pulling (X, Y), but the effect of expanding was seen in either direction.
Since the workpieces were not rubbed immediately after the break and during the conveyance, chipping did not occur, and no particles adhered to the silicon surface.
Since it is considered that the effect of the expand can be sufficiently obtained even in the scribe test, it is considered that a high quality break is possible.

  Hereinafter, a breaking device according to a fourth embodiment of the present invention will be described. 18 to 21 show a breaking device according to a fourth embodiment of the present invention. As shown in FIG. 18, lattice-like scribe lines 52 are engraved in advance in a vertical and horizontal direction on a thin semiconductor wafer as the work 51 by a scriber. The scribe line 52 is formed by, for example, pressing a pyramid tool (point) with a sharp tip or a freely rotating thin disk (wheel) against the surface of the work, and moving these tools along the surface of the work 51, thereby moving the work A scribe line 52 is engraved on the surface of 51. When the tool is moved along the workpiece 51, the tool may be vibrated.

(Work bonding process)
After the scribe line 52 is engraved on the surface of the work 51, as shown in FIG. 19A, the side of the work 51 where the scribe line 52 is engraved is the front side, and the back surface of the work 51 is the sheet 53. paste. The sheet 53 is made of an adhesive resin. For example, the same thing as the sheet | seat for conveyance to which a chip-shaped semiconductor wafer is affixed at the time of conveyance is used. In the breaking device of the fourth embodiment, unlike the breaking device of the first embodiment, a tensile force may be applied to the sheet 53 or may not be applied.

  As shown in FIG. 18, the workpiece 51 attached to the sheet 53 is placed on a middle / high break table 55 with the sheet 53 on the back side. The break table 55 has a semi-cylindrical shape, and a plurality of suction holes 56 are formed on its surface as sheet contact means. The suction hole 56 is connected to a suction path 57, and the suction path 57 finally communicates with one suction port 58. In FIG. 18, the suction hole 56 at the center portion of the break table 55 is omitted, but actually, a plurality of suction holes 56 are provided in the circumferential direction of the break table 55. A vacuum pump (not shown) is connected to the suction port 58, and air is sucked from the suction port 58.

  20 shows a plan view of the semi-cylindrical break table 55, and FIG. 21 shows a back view. The plurality of suction holes 56 are arranged at the highest part (on the line h1) of the break table 55, and in addition to the highest part of the break table 55, there is a difference in height from the highest part to a lower position (line h2). Multiple columns are arranged. In FIG. 20, one horizontal row is the suction holes 56 having the same height. In the figure, W1 and W2 indicate planar shapes of circular workpieces having different sizes. The suction holes 56 are arranged so as to suck only the sheet 53 while avoiding the periphery of the work 51 or the lower surface of the work 51. The suction holes 56 in the lower row are arranged in a larger number than in the higher row. These suction holes 56 are connected to a suction groove 59 formed on the back surface of the break table 55. As shown in FIG. 21, the suction groove 59 extends in the vertical direction and the horizontal direction, and is finally connected to the suction port 58. The break table 55 is placed on a base having a flat surface (not shown), and a space for sucking air is formed between the surface of the base and the suction groove 59 of the break table.

(Work cutting process)
After air 53 is sucked from the suction port 58 after the sheet 53 with the work 51 attached is placed on the break table 55, the suction hole 56 connected to the suction port 58 sucks air, and the sheet 53 comes into close contact with the break table 55. To do. As the distance between the seat 53 and the break table 55 is narrower, the pressure is more likely to decrease. Therefore, the break plate 55 is naturally moved from the high position to the low position, that is, from the center of the work 51 toward both ends. The sheets 53 in close contact with the break table 55 in turn. When the sheet 53 comes into close contact with the break table 55, the workpiece 51 attached to the sheet 53 is also curved along the break table 55 so that the scribe line 52 is outside the curve, as shown in FIG. 19B. . Then, a bending moment is generated in the workpiece 51, and a tensile stress is generated on the side of the workpiece 51 where the scribe line 52 is engraved. Due to the tensile stress, the crack 54 progresses from the front surface to the back surface of the work 51 and the work 51 is divided. Here, the workpiece 51 is divided at a stage where the workpiece 51 is curved along the break table 55. Accordingly, the workpiece 51 is gradually divided from the central portion toward both ends (in FIG. 18, the division occurs and proceeds along the scribe line 52 from the highest portion of the semi-cylindrical break table 55 to the left and right. ).

  The reason why the sheet 53 is placed on the back side of the work 51 is to facilitate the development of the crack 54 in the work 51, as shown in FIG. If the sheet 53 is pasted on the front side of the work 51, the sheet 53 prevents the groove of the scribe line 52 from being opened by its elastic force, so that it becomes difficult to break. Further, the break table 55 is formed into a semi-cylindrical shape, and the scribe line 52 of the work 51 is arranged in parallel to the center line 55a of the break table, whereby stress acts in the normal direction of the curved work 51. For this reason, it can prevent that the cross section of the workpiece | work 51 rubs and chipping generate | occur | produces.

  In the above dividing step, the workpiece 51 is divided only in the vertical direction of the vertical and horizontal scribe lines 52, that is, only on the scribe line 52 parallel to the center line 55 a of the break table 55. The work 51 is divided into strips on the sheet 53 at the stage where the cutting in one direction out of the length and breadth is finished (strip cutting step). Next, the suction by the suction holes 56 is released, and the sheet 53 is retracted from the break table 55. Then, either one of the sheet 53 and the break table 55 is rotated 90 degrees in a plane including the sheet 53, for example, a horizontal plane (relative rotation process). Then, the remaining vertical and horizontal scribe lines 52 become parallel to the center line 55 a of the break table 55. Then, air is again sucked from the suction holes 56, the workpiece 51 divided into strips is bent again along the break table 55, and the workpiece 51 is divided into a plurality of chips (chip cutting step). By dividing the work cutting process into a strip cutting process and a chip cutting process, the work 51 in which scribe lines are cut vertically and horizontally can be divided into chips without causing chipping.

  FIG. 22 shows an example in which the stretchable sheet 53 is pulled in a state where the work 51 is attached to the sheet 53. If a tensile force is applied to the workpiece 51 when the workpiece 51 is divided, the workpieces 51 are separated from each other at the same time as the workpiece 51 is divided, and a gap is formed between the workpieces 51. Can be prevented. Therefore, as shown in FIG. 22, before the work 51 is divided, a tensile force may be applied to the stretchable sheet 53 in a state where the work 51 is attached to the sheet 53. Specifically, the periphery of the sheet 53 is pulled in the X direction and the Y direction, and a tensile force (tension t) is applied to the sheet 53 in the X direction and the Y direction. The frame member 60 is pasted around the work 51 while maintaining the tension t. A space is provided between the periphery of the work 51 and the frame member 60, and the tension is confined in the sheet 53 exposed around the work 51. When applying a tensile force to the work 51, it is desirable that the suction hole 56 be disposed at a position where only the sheet 53 is sucked away from the lower surface of the work 51. This is because if the suction holes 56 are arranged on the lower surface of the work 51, the works 51 separated by the tensile force of the sheet 53 are trying to be separated from each other, but the work 51 is hardly separated by the suction of the suction holes 56. is there.

  By the way, conventionally, there has been no break device capable of dividing a semiconductor wafer in which vertical and horizontal scribe lines 52 are engraved into chips. This is because the remaining scribe lines 52 do not line up in a straight line when the work 51 is processed into a strip. In the cutting with the blade, alignment is indispensable, and accuracy is required for the positional relationship between the scribe line 52 and the blade and the receiving blade. However, when the work 51 is rotated 90 degrees, the blade cannot be dropped along the scribe line. It becomes impossible to chip. However, in the present embodiment, the scribe line 52 is not required to be in a straight line, either in a strip cutting process in which the workpiece 51 is easily cut into strips or in a chip cutting process in which the work 51 is rotated 90 degrees to form a chip. Therefore, the chip can be formed.

  FIG. 23 shows another example of the suction hole 56 formed in the break table 55. In this example, a groove 61 extending in a direction parallel to the center line 55 a of the break table 55 is formed on the surface of the break table 55. The suction holes 56 are connected to the grooves 61, and one row of suction holes 56 are grouped by the grooves 61. If the suction holes 56 are grouped by the grooves 61, the work 51 can be sucked evenly in the direction of the center line of the break table 55. In addition, as shown in FIG. 24, it is also effective to enclose the periphery of the break table 55 with a box 62 in order to make the adsorption of the sheet 53 to the break table 55 stronger.

  FIG. 25 shows an example in which a plurality of electromagnetic valves 63 are provided in the suction path 57 in order to suck air in order from the higher position to the lower suction holes 56. The plurality of suction holes 56 are arranged from the center highest position to the left and right lower positions. A plurality of suction paths 57 are provided according to the height of the suction holes 56, and a plurality of suction holes 56 having the same height are connected to one suction path 57. Each suction path 57 is provided with an electromagnetic valve 63. The electromagnetic valve 63 is opened in order from the suction path 57 connected to the suction hole 56 at the higher position to the suction path connected to the suction hole 56 at the lower position. For example, as shown in FIG. 25, the electromagnetic valve 63 opens in the order of 1, 2, 3,. When the electromagnetic valve 63 is provided, the work 51 can be brought into close contact with the break table 55 in an order that can be surely visually recognized from the center of the work 51 toward the outside.

  FIG. 26 shows a breaking device according to the fifth embodiment of the present invention. In this embodiment, the sheet contact means for bringing the sheet 53 into close contact with the break table 55 is composed of the sheet fixing table 14 and the sheet pressing mechanism. That is, as shown in FIG. 26A, a pair of sheet fixing bases 14 are arranged with the break base 55 interposed therebetween, and both ends of the sheet 53 are clamped by the sheet fixing bases 14. Then, as shown in FIG. 26B, the break table 55 is lifted from below to the sheet 53 by the pressing mechanism, and the sheet 53 is brought into close contact with the break table 55. As the pressing mechanism, a known uniaxial moving mechanism such as a ball screw is used. Since the movement of the break table 55 relative to the seat 53 is relative, the seat fixing table 14 may be pushed down instead of lifting the break table 55.

  The sheet 53 is pressed against the break table 55 as the break table 55 is pushed up, and bends along the surface of the break table 55. When the sheet 53 comes into close contact with the break table 55, the workpiece 51 attached to the sheet 53 is also curved along the break table 55. Since the work 51 is divided at a stage where the work 51 is curved along the break table 55, the divided work 51 is sequentially divided into the break table 55 while the work 51 is gradually divided from the central portion toward both ends. In close contact. Thus, the work 51 is divided into strips. After the work 51 is divided into strips, the break table 55 is retracted downward from the sheet 53 and both ends of the sheet 53 are removed from the sheet fixing table 14. Next, after the sheet 53 is rotated 90 degrees in a horizontal plane, the sheet 53 is held on the sheet fixing base 14 again. Of course, instead of replacing the seat 53 with the seat fixing base 14, a rotation mechanism for rotating the break base 55 by 90 degrees in the horizontal plane may be provided. Finally, the work 51 divided into strips by raising the break table 55 again is divided into chips.

  According to the break device of the fifth embodiment, the sheet 53 can be brought into close contact with the break table 55 without providing the suction holes 56 in the break table 55. In addition, when the sheet 53 is pushed up by the break table 55, the tensile force naturally acts on the sheet 53, so that it is possible to prevent the divided sections of the divided workpieces 51 from rubbing.

  27 and 28 show another example of the break table 65. 27 shows a side view of the break table 65, and FIG. 28 shows a side view of the break table 65, respectively. When the work 51 is uniformly divided into chips, the break table 65 may be formed on a part of a spherical surface as in this example. In this case, in the plan view of the break table shown in FIG. 28, the suction holes 66 are arranged on a concentric circle with the highest part C of the break table 65 as the center. The suction hole 66 is connected to a suction path 67, and the suction path 67 communicates with one suction port 68. When air is sucked from the suction holes 66, the work 51 can be brought into close contact with the break table 65 in order from the center of the work 51 toward the outer peripheral side.

  In addition, this invention is not restricted to the said embodiment, In the range which does not change the summary of this invention, it can change variously. For example, a thin glass substrate may be used for the workpiece instead of the semiconductor wafer. Further, in the work bonding step, the work may be pasted on the sheet after the scribe line is cut on the work, or the scribe line may be cut on the work after the work is attached on the sheet. Further, the semi-cylindrical break table may be semi-cylindrical.

This specification is based on Japanese Patent Application No. 2005-000554 filed on January 5, 2005, Japanese Patent Application No. 2005-146551 filed on May 19, 2005, and Japanese Patent Application No. 2005-373460 filed on December 26, 2005. All this content is included here.

Claims (15)

A work breaking method in which a work having a scribe line engraved on the surface is divided along the scribe line,
A workpiece bonding step of pasting the back surface of the workpiece on a stretchable sheet;
A sheet pulling step of pulling the sheet to which the workpiece is attached;
In a state where the sheet is pulled, a work dividing step for allowing the scribe line to reach the back surface of the work, and
A work breaking method, wherein the divided work is separated by a tensile force of the sheet. In the workpiece dividing step,
2. The workpiece according to claim 1, wherein the workpiece is bent so that the surface side of the workpiece is outside the curve in a state in which the sheet is pulled, thereby causing the scribe line to reach the back surface of the workpiece. How to break your work. In the sheet pulling step,
3. The workpiece according to claim 1, wherein after pulling the sheet, a frame member is attached to the sheet with a gap around the workpiece, and the tension of the sheet is confined in the frame member. Break method. A work breaking device for cutting a work in which a scribe line is engraved on the surface, along the scribe line,
Sheet pulling means for pulling the stretchable sheet to which the back surface of the workpiece is attached;
In a state where the sheet is pulled, the workpiece is bent so that the surface of the workpiece is outside the curve, and thereby the workpiece dividing means for reaching the scribe line to the back surface of the workpiece, and
The work breaking apparatus, wherein the divided work is separated by a tensile force of the sheet. A method of scribing and breaking a workpiece, in which the workpiece is cut along the scribe line while scribing the scribe line on the surface of the workpiece,
A work bonding process for attaching a work to an extendable sheet;
A sheet pulling step of pulling the sheet to which the workpiece is attached;
In a state where the sheet is pulled, a scribe line is engraved on the surface of the work, and a work dividing step for reaching the scribe line on the surface of the work to the back surface of the work, and
A method for scribing and breaking a workpiece, wherein the divided workpiece is separated by a tensile force of the sheet. A break device with a scribing function for cutting a work along a scribe line while carving a scribe line on the surface of the work,
Sheet tension means for pulling the stretchable sheet to which the workpiece is attached;
In a state where the sheet is pulled, a scribe line is engraved on the surface of the work, and the work slicing means for dividing the work by causing the scribe line on the surface of the work to reach the back surface of the work. ,
A scribing device with a break function, wherein the divided work is separated by a tensile force of the sheet. A work breaking method in which a work having a scribe line engraved on the surface is divided along the scribe line,
A workpiece bonding step of attaching the back surface of the workpiece to a sheet;
The sheet is brought into close contact with a break table, and the workpiece is curved so that the surface of the workpiece is outside the curve, thereby causing the scribe line on the surface of the workpiece to reach the back surface of the workpiece and the workpiece. A workpiece breaking method comprising: a workpiece cutting step for cutting. The workpiece dividing step includes
A strip cutting step of curving the workpiece in which a plurality of scribe lines are engraved vertically and horizontally along a semi-cylindrical break table, and dividing the workpiece into a plurality of strips,
Thereafter, a relative rotation step of rotating the sheet retracted from the break table relative to the break table by 90 degrees in a plane including the sheet;
The work breaking according to claim 7, further comprising: a chip dividing step of bending the work divided into strips along the break table again to divide the work into a plurality of chips. Method.   The workpiece dividing step, wherein the workpiece is curved along the break table by adsorbing the sheet to which the workpiece is attached to the break table by a suction hole for sucking air. The work breaking method according to 7 or 8.   In the workpiece dividing step, the break table is moved relative to the sheet in a direction perpendicular to a plane including the sheet, and the break table is pressed against the sheet to which the workpiece is attached. The work breaking method according to claim 7, wherein the work is curved along the break table. A work breaking device for cutting a work in which a scribe line is engraved on the surface, along the scribe line,
A break table for bending the workpiece;
A sheet contact means for causing the sheet to which the back surface of the workpiece is attached to be in close contact with the break table, and bending the workpiece so that the surface of the workpiece is outside the curve,
A workpiece breaking device, wherein the workpiece is divided by causing the scribe line on the surface of the workpiece to reach the back surface of the workpiece. The contact means is arranged with a height difference from a high position to a low position of the break table, and has a plurality of suction holes for sucking air,
The work breaking device according to claim 11, wherein the work is brought into close contact with the break table by sucking the sheet through the suction holes. The contact means further includes
The work breaking device according to claim 12, further comprising a plurality of electromagnetic valves for sequentially sucking air into the suction holes from a high position to a low position. The contact means is
A sheet fixing base arranged so as to sandwich the break base, and holding an end of the sheet;
A pressing mechanism for moving the break table relative to the sheet fixing table in a direction perpendicular to a plane including the sheet,
The work breaking device according to claim 11, wherein the work is bent along the break table by pressing the sheet to which the work is attached to the break table.   The break device is configured to bend the work, in which a plurality of scribe lines are engraved vertically and horizontally, along a semi-columnar break table, divide the work into a plurality of strips, and then retract from the break table. The sheet is rotated relative to the break table by 90 degrees in a plane including the sheet, and then the work divided into strips is bent again along the break table. 15. The work breaking device according to claim 11, wherein the work is divided into a plurality of chips.