Nothing Special   »   [go: up one dir, main page]

JPS6393691U - - Google Patents

Info

Publication number
JPS6393691U
JPS6393691U JP1986188644U JP18864486U JPS6393691U JP S6393691 U JPS6393691 U JP S6393691U JP 1986188644 U JP1986188644 U JP 1986188644U JP 18864486 U JP18864486 U JP 18864486U JP S6393691 U JPS6393691 U JP S6393691U
Authority
JP
Japan
Prior art keywords
conductor
insertion hole
electronic component
circuit board
insulating plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986188644U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986188644U priority Critical patent/JPS6393691U/ja
Publication of JPS6393691U publication Critical patent/JPS6393691U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例を示す電子回路板の
斜視図、第２図はその断面図、第３図はこの考案
の他の実施例を示す電子回路板の断面図、第４図
はこの考案の変形実施例を示す電子回路板の断面
図、第５図は従来の電子回路板の例を示す斜視図
である。 １０：プリント板、１１：絶縁基板、１２：配
線パターン、１３：部品取付け面、１４：集積回
路、１４Ａ：パツケージ、１４Ｂ：トツプ面、１
５，１６：電子部品、１７：電子回路板、１８：
放熱器、２１：アース導体、２２，２３：電子部
品挿入穴、２５：放熱シート、２６：放熱グリス
、２７：脚、２８：エラストマ、２９：リード線
、３１：押さえ板、３２：貫通孔、３３：ボルト
、３４：ナツト、３５：電子部品、３６：部品挿
入穴、３７：電子部品、３８：リード線。 Fig. 1 is a perspective view of an electronic circuit board showing an embodiment of this invention, Fig. 2 is a sectional view thereof, Fig. 3 is a sectional view of an electronic circuit board showing another embodiment of this invention, and Fig. 4 is a sectional view of an electronic circuit board showing another embodiment of this invention. FIG. 5 is a sectional view of an electronic circuit board showing a modified embodiment of this invention, and FIG. 5 is a perspective view showing an example of a conventional electronic circuit board. 10: Printed board, 11: Insulating board, 12: Wiring pattern, 13: Component mounting surface, 14: Integrated circuit, 14A: Package, 14B: Top surface, 1
5, 16: Electronic components, 17: Electronic circuit board, 18:
Heatsink, 21: Earth conductor, 22, 23: Electronic component insertion hole, 25: Heat radiation sheet, 26: Heat radiation grease, 27: Legs, 28: Elastomer, 29: Lead wire, 31: Holding plate, 32: Through hole, 33: bolt, 34: nut, 35: electronic component, 36: component insertion hole, 37: electronic component, 38: lead wire.

Claims (1)

【実用新案登録請求の範囲】 一面に配線パターンが形成されている絶縁板と
、 上記絶縁板の他面に被着されたアース導体と、 上記絶縁板のパターン形成面に形成され、少な
くとも上記アース導体に到達する深さにされた電
子部品挿入穴と、 上記アース導体との間に熱伝導材を介して上記
挿入穴内に挿入された電子部品と、 で構成される電子回路板。[Scope of Claim for Utility Model Registration] An insulating plate having a wiring pattern formed on one side; a grounding conductor attached to the other side of the insulating plate; An electronic circuit board comprising: an electronic component insertion hole that is deep enough to reach a conductor; and an electronic component inserted into the insertion hole with a thermally conductive material interposed between the ground conductor and the ground conductor.
JP1986188644U 1986-12-08 1986-12-08 Pending JPS6393691U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986188644U JPS6393691U (en) 1986-12-08 1986-12-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986188644U JPS6393691U (en) 1986-12-08 1986-12-08

Publications (1)

Publication Number Publication Date
JPS6393691U true JPS6393691U (en) 1988-06-17

Family

ID=31140199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986188644U Pending JPS6393691U (en) 1986-12-08 1986-12-08

Country Status (1)

Country Link
JP (1) JPS6393691U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220880A (en) * 1993-01-28 1994-08-09 Komatsu Ltd Boom structure for construction machine
JP2019054017A (en) * 2017-09-12 2019-04-04 アイシン精機株式会社 Electronic component

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940760B1 (en) * 1971-05-14 1974-11-05
JPS525703A (en) * 1976-06-25 1977-01-17 Rhone Poulenc Ind Method of producing primary alcohol
JPS52102678A (en) * 1976-02-25 1977-08-29 Nikkan Ind Heat conductive electric insulation sheet and method of manufacture thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4940760B1 (en) * 1971-05-14 1974-11-05
JPS52102678A (en) * 1976-02-25 1977-08-29 Nikkan Ind Heat conductive electric insulation sheet and method of manufacture thereof
JPS525703A (en) * 1976-06-25 1977-01-17 Rhone Poulenc Ind Method of producing primary alcohol

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220880A (en) * 1993-01-28 1994-08-09 Komatsu Ltd Boom structure for construction machine
JP2019054017A (en) * 2017-09-12 2019-04-04 アイシン精機株式会社 Electronic component

Similar Documents

Publication Publication Date Title
JPS6393691U (en)
JPH0446591U (en)
JPH0476094U (en)
JPS6134783U (en) Mounting structure for high-frequency heat-generating electronic components
JPH0230843Y2 (en)
JPS6240868U (en)
JPS59177243U (en) Electronics
JPH036893U (en)
JPH0428469U (en)
JPH01161360U (en)
JPH01179460U (en)
JPS62120397U (en)
JPS6448093U (en)
JPS6338368U (en)
JPS63197334U (en)
JPH0430759U (en)
JPH02129796U (en)
JPH01154689U (en)
JPH02131395U (en)
JPH01116474U (en)
JPH01153697U (en)
JPS59155746U (en) Heat sink with wiring board
JPS5958984U (en) high frequency electronic equipment
JPH031586U (en)
JPH0350787U (en)