JPS6330794B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed circuit board mounted with chip components used in electronic equipment.

As shown in FIG. 1, a conventional printed wiring circuit board with chip components mounted thereon is one in which a single-sided copper-clad epoxy resin-paper base laminate 1 is etched to form a conductive pattern 2, and then a chip component 3 is mounted. However, one with a lead terminal 4 attached is known.

Since this printed circuit board uses an epoxy resin-paper base material, metal lead terminals 4 must be used due to mechanical strength constraints in order to incorporate it into a printed circuit board that will become another motherboard. First, if you try to attach it to the printed wiring board of the motherboard without using the metal lead terminals 4, you will have to process the terminal part into a comb shape and make it wide, and also make a corresponding large square hole in the printed wiring board of the motherboard. This was a major obstacle to high-density packaging.

Furthermore, when using the metal lead terminals 4 as described above, there is a process for attaching the lead terminals 4, so the lead terminals 4 can be attached with a large number of printed circuit boards connected until the final process. First, it is necessary to divide the printed circuit board into individual printed circuit boards before this step, which increases the number of man-hours in the manufacturing process.

The present invention eliminates the above-mentioned conventional drawbacks, and aims to provide a method for manufacturing a printed wiring circuit board that is easy to manufacture and has a high wiring density.

In order to achieve the above object, the method for manufacturing a printed wiring circuit board of the present invention involves punching a double-sided copper-clad aluminum board leaving the terminal portion and part of the outer shape, and anodizing the exposed aluminum surface of the punched portion. After that, a conductive pattern is formed on both sides by etching, a solder metal is placed on this conductive pattern, and chip components are mounted. After cutting a part of the outline and making it into individual pieces, they are assembled into a printed wiring board that will become a motherboard and soldered. It is characterized in that it is connected by attaching it.

Embodiments of the present invention will be described below with reference to FIGS. 2 to 12.

First, as shown in FIG. 2, a double-sided copper-clad aluminum substrate 5 is used. This double-sided copper-clad aluminum substrate 5 is constructed by forming an alumite layer on the surface of aluminum by anodizing to serve as an insulating layer, and pasting copper foil on the alumite layer by adhesive or the like.

As shown in FIG. 3, this double-sided copper-clad aluminum substrate 5 is subjected to a press punching process, leaving a portion that will become the terminal portion 6 and a portion 7 of the outer shape. As shown in FIG. 4, an aluminum exposed portion 8 is formed by this press punching process, and an alumite layer 9 is applied to this aluminum exposed portion 8 by an anodizing method.

Next, after mechanically polishing the copper-clad surfaces 10 on both sides of the double-sided copper-clad aluminum substrate 5, an etching resist 11 is printed in a circuit pattern as shown in FIG. Thereafter, etching is performed using a ferric chloride solution to remove the etching resist 11 and form a conductive pattern 12.

Next, as shown in FIG. 6, a solder layer 13 is formed on the surface of the conductor pattern 12 by vertically dipping it into molten solder. At this time, if a solder resist is printed in advance if necessary, the solder layer 13 can be formed only on the surface of the conductor pattern 12 where it is necessary.

As shown in FIG. 7, a chip part 14 is attached to such a thing in a predetermined position using an adhesive 15.
The chip component 14 is connected and fixed to the conductive pattern 12 by remelting the solder layer 13 using a reflow soldering method or by soldering using a flow soldering method.
In this case, it is also possible to use both the reflow soldering method and the flow soldering method to mount the chip components 14 on both sides.

Next, as shown in FIG. 8, the outer portion 7 and the terminal portion 6 are cut from the double-sided copper-clad aluminum substrate 5 to obtain a chip component mounting substrate 16. A cross-sectional view of the terminal portion 6 at this time is shown in FIG. 9, and a top view is shown in FIG. 10.

Thereafter, a resin coat 17 is applied as needed for protection as shown in FIG. By applying solder 20 according to the method and applying this solder 20, the first
As shown in FIG. 2, at the same time as the chip component mounting board 16 is connected and fixed to the printed wiring board 18 serving as the motherboard, the conductor patterns 12 on the front and back sides of the terminal section 6 are electrically connected to form a double-sided circuit.

As described above, according to the method for manufacturing a printed wiring circuit board of the present invention, a large number of chip component mounting boards are connected until the final process, so the process is simple and mass-producible. , the terminals can be directly attached to the printed wiring board that serves as the motherboard, and double-sided circuits can be configured, resulting in high packaging density.
Since it is made of aluminum as a base material, it has excellent heat resistance, heat dissipation, flame resistance, and dimensional stability, and is advantageous in terms of cost, making it of great industrial value.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a conventional printed circuit board;
Fig. 2 is a perspective view of a double-sided copper-clad aluminum board in an embodiment of the printed wiring circuit board of the present invention, Fig. 3 is a perspective view of the same board after punching, and Fig. 4 shows the main parts of the same. 5 is an enlarged perspective view, FIG. 5 is a perspective view of the main part with the etching resist printed, FIG. 6 is a cross-sectional view of the solder layer formed, FIG. 7 is a cross-sectional view showing the state in which chip components are mounted, and FIG. 9 is a cross-sectional view of the terminal portion, FIG. 10 is a top view of the same, and FIG. 11 is a perspective view of the main parts of the chip component mounting board assembled into the printed wiring board of the motherboard.
FIG. 12 is a sectional view of the main part. 5... Double-sided copper-clad aluminum board, 6... Terminal part, 7... Part of external shape, 8... Exposed aluminum part, 9... Alumite layer, 10... Copper foil surface, 1
DESCRIPTION OF SYMBOLS 1... Etching resist, 12... Conductor pattern, 13... Solder layer, 14... Chip component, 15
...Adhesive, 16...Chip component mounting board, 17
... Resin coat, 18 ... Printed wiring board, 19 ...
Mounting hole, 20...Solder.

Claims (1)

[Claims] 1. A double-sided copper-clad aluminum board is punched out leaving the terminal part and a part of the outer shape, the aluminum exposed part by this punching is anodized, the copper foil surface of this double-sided copper-clad aluminum board is polished, and After etching to form a predetermined conductor pattern, applying a solder layer to the required portions of this conductor pattern, and mounting chip components at predetermined positions on this conductor pattern, the terminals and part of the outer shape are cut. A method of manufacturing a printed circuit board, in which a circuit board is mounted with chip components, and this is assembled into a printed circuit board that becomes a motherboard and connected by soldering.