JPS60164389A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS60164389A JPS60164389A JP2025384A JP2025384A JPS60164389A JP S60164389 A JPS60164389 A JP S60164389A JP 2025384 A JP2025384 A JP 2025384A JP 2025384 A JP2025384 A JP 2025384A JP S60164389 A JPS60164389 A JP S60164389A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- constricted portion
- conductor
- circuit board
- conductor foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種電子機器に用いられるプリント基板に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to printed circuit boards used in various electronic devices.
従来例の構成とその問題点
以下従来のプリント基板について第１図、第２図を参照
して説明する。第１図において１，２゜３は、パターン
印刷された導体箔であり、そのうち、導体箔１．２は対
向して設けられている。また３ａは導体箔３の括れ部で
あす、４ＩＩ′ｉ、基板６に設けられた部品挿入用孔で
ある。Conventional Structure and Problems The conventional printed circuit board will be described below with reference to FIGS. 1 and 2. In FIG. 1, reference numerals 1 and 2.3 denote pattern-printed conductor foils, of which conductor foils 1 and 2 are provided facing each other. Further, 3a is a constricted portion of the conductor foil 3, and 4II'i is a hole for inserting a component provided in the board 6.
ここでプリント基板においては、製品安全等のため、導
体箔相互間の絶縁距離を保つ必要がある。Here, in printed circuit boards, it is necessary to maintain an insulating distance between conductor foils for product safety and the like.
また近年、電子部品自動挿入機による自動挿入が随所に
用いられて部るが、自動挿入される部品の端子間の巾ｌ
が、予め定められているため、第１図に示しだように、
導体箔の一部では、導体箔間の絶縁距離を確保しつつ、
しかも、部品の端子間中ｌをも満足させるため、括れ部
３ａを設けることを強いられるのである。しかし、この
括れ部では、抵抗値が増加してしまう。このため発熱お
よび溶断の危険性がある。これを回避するだめ、第３図
に示したように、導体箔６を設け、電子部品取付位置を
ずらしリード線アにて接続することが考えられるが、こ
れは、使用部品点数が増加し、またプリント基板の形状
が大型化するという欠点を有していた。In addition, in recent years, automatic insertion using electronic component automatic insertion machines has been used in many places, but the width between terminals of automatically inserted components is
is predetermined, so as shown in Figure 1,
In some of the conductor foils, while ensuring the insulation distance between the conductor foils,
Furthermore, in order to satisfy the distance l between the terminals of the component, it is necessary to provide the constricted portion 3a. However, the resistance value increases at this constricted portion. Therefore, there is a risk of heat generation and melting. To avoid this, it is conceivable to provide a conductor foil 6 as shown in Fig. 3, shift the mounting position of the electronic component, and connect it with a lead wire A, but this increases the number of parts used and Another drawback is that the size of the printed circuit board becomes large.
発明の目的
本発明は、上記従来の欠点を解消するものであり、抵抗
値の増加を防ぎしかもリード線等の部品を追加すること
もなり、シたがって形状が大型化することもないプリン
ト基板を提供することを目的とする。Purpose of the Invention The present invention solves the above-mentioned conventional drawbacks, and provides a printed circuit board that prevents an increase in resistance value, adds parts such as lead wires, and does not increase in size. The purpose is to provide
発明の構成
上記目的達成のだめ、本発明のプリント基板は導体箔括
れ部に半田メッキを施してなり、半田メッキを施したこ
とにより括れ部の抵抗値の増加を防止することができ、
しかも、リード線等を追加する必要がなくプリント基板
の形状が大型化することもない。Structure of the Invention In order to achieve the above object, the printed circuit board of the present invention is formed by applying solder plating to the constricted portion of the conductor foil, and by applying solder plating, it is possible to prevent an increase in the resistance value of the constricted portion,
Furthermore, there is no need to add lead wires or the like, and the size of the printed circuit board does not increase.
実施例の説明
以下本発明のプリント基板の一実施例を、図面第３図、
第４図を参照して説明する。DESCRIPTION OF EMBODIMENTS An embodiment of the printed circuit board of the present invention will be described below with reference to FIG.
This will be explained with reference to FIG.
第３図は、一実施例の平面図、第４図は第３図のＡ−Ａ
断面図である。Figure 3 is a plan view of one embodiment, and Figure 4 is A-A in Figure 3.
FIG.
図において１．２．３は、従来例と同様パターン印刷さ
れた導体箔であり、括れ部３ａには、半田メッキ８が施
されている。このように導体箔の括れ部３１Ｌに半田メ
ッキ８を施すことにより、括れ部３ａの抵抗値を低下さ
せることができ、発熱。In the figure, reference numeral 1.2.3 is a pattern-printed conductor foil similar to the conventional example, and solder plating 8 is applied to the constricted portion 3a. By applying the solder plating 8 to the constricted portion 31L of the conductor foil in this manner, the resistance value of the constricted portion 3a can be lowered and heat is generated.
溶断の危険から回避できると共に、リード線等を追加す
ることもなく、基板の形状が大きく々ることもない。The risk of melting can be avoided, and there is no need to add lead wires or the like, and the shape of the board does not need to be enlarged.
まだプリント基板の作成は、通常、導体箔が塗布形成さ
れた基板に、回路パターンを描き、それをエツチング処
理した後、レジストを施して行う。Printed circuit boards are usually created by drawing a circuit pattern on a board coated with conductive foil, etching it, and then applying a resist.
ここでレジストとは、プリント基板に部品を挿入した後
、ディップ槽にて、半田ディツプする際に半田が付着し
てはいけない部分に施す処理である。Here, the resist is a process applied to the parts where solder should not be attached when the parts are inserted into the printed circuit board and then dipped in solder in a dip tank.
そして本発明のプリント基板では、括れ部３ａにはレジ
ストを施さないようにすれば、部品固定のだめの半田デ
ィツプの際に、同時に括れ部３ａの半田メッキ８も行え
るため、作業工数の低減にも大いに貢献するものである
。In the printed circuit board of the present invention, if the resist is not applied to the constricted portion 3a, the solder plating 8 of the constricted portion 3a can be done at the same time when the solder dip is applied to fix the component, thereby reducing the number of work steps. This will contribute greatly.
発明の効果
以上のように１本発明のプリント基板は、パターン印刷
された導体箔の括れ部に半田メッキを施すことにより、
括れ部の抵抗を減少させることができるため、発熱、溶
断の危険を回避でき、またリード線等の部品を追加する
必要もなく、さらに基板の形状が大きくなることもない
。Effects of the Invention As described above, the printed circuit board of the present invention has the following advantages:
Since the resistance of the constricted portion can be reduced, the risk of heat generation and melting can be avoided, there is no need to add parts such as lead wires, and there is no need to increase the size of the board.
第１図、第２図はそれぞれ従来のプリント基板の平面図
、第３図は本発明の一実施例のプリント基板の平面図、
第４図は第３図のＡ−Ａ断面図である。
１．２，３．６・・・・−・導体箔、３１Ｌ−・・・括
れ部、４・・・・・・部品挿入用孔、６・・・・・基板
、７・・・・・・リード線、８・・・・・・半田メッキ
。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第 ２ 図1 and 2 are respectively plan views of conventional printed circuit boards, and FIG. 3 is plan views of printed circuit boards according to an embodiment of the present invention.
FIG. 4 is a sectional view taken along the line AA in FIG. 3. 1.2, 3.6...- Conductor foil, 31L-... Constriction, 4... Hole for component insertion, 6... Board, 7...・Lead wire, 8...Solder plated. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2
Claims (1)
けるとともに、その第１の導体箔間を通過する第２の導
体箔を設け、その第２の導体箔は、前記第１の導体箔の
近傍にて括れ部を有し、かつ。 その括れ部には、半田メッキが施しであるプリント基板
。[Scope of Claims] At least one pair of first conductor foils are provided on the substrate to face each other, and a second conductor foil is provided that passes between the first conductor foils, and the second conductor foil has a constricted portion near the first conductor foil, and. The narrow part is a printed circuit board with solder plating applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025384A JPS60164389A (en) | 1984-02-06 | 1984-02-06 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025384A JPS60164389A (en) | 1984-02-06 | 1984-02-06 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60164389A true JPS60164389A (en) | 1985-08-27 |
Family
ID=12022028
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025384A Pending JPS60164389A (en) | 1984-02-06 | 1984-02-06 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60164389A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999060831A1 (en) * | 1998-05-19 | 1999-11-25 | Ibiden Co., Ltd. | Printed circuit board and method of production thereof |
-
1984
- 1984-02-06 JP JP2025384A patent/JPS60164389A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1999060831A1 (en) * | 1998-05-19 | 1999-11-25 | Ibiden Co., Ltd. | Printed circuit board and method of production thereof |
| US6407345B1 (en) | 1998-05-19 | 2002-06-18 | Ibiden Co., Ltd. | Printed circuit board and method of production thereof |
| KR100791281B1 (en) * | 1998-05-19 | 2008-01-04 | 이비덴 가부시키가이샤 | Printed circuit board and method of production thereof |
| US7332816B2 (en) | 1998-05-19 | 2008-02-19 | Ibiden Co., Ltd. | Method of fabricating crossing wiring pattern on a printed circuit board |
| US7525190B2 (en) | 1998-05-19 | 2009-04-28 | Ibiden Co., Ltd. | Printed wiring board with wiring pattern having narrow width portion |
| US8018046B2 (en) | 1998-05-19 | 2011-09-13 | Ibiden Co., Ltd. | Printed wiring board with notched conductive traces |
| US8629550B2 (en) | 1998-05-19 | 2014-01-14 | Ibiden Co., Ltd. | Printed wiring board with crossing wiring pattern |
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