JPS63160798A - Binder for paste solder - Google Patents
Binder for paste solderInfo
- Publication number
- JPS63160798A JPS63160798A JP31405986A JP31405986A JPS63160798A JP S63160798 A JPS63160798 A JP S63160798A JP 31405986 A JP31405986 A JP 31405986A JP 31405986 A JP31405986 A JP 31405986A JP S63160798 A JPS63160798 A JP S63160798A
- Authority
- JP
- Japan
- Prior art keywords
- binder
- paste
- solder
- brazing
- wax
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011230 binding agent Substances 0.000 title claims abstract description 25
- 229910000679 solder Inorganic materials 0.000 title abstract description 10
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003349 gelling agent Substances 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 238000005476 soldering Methods 0.000 claims abstract description 5
- -1 polyethylene Polymers 0.000 claims description 7
- 239000004698 Polyethylene Substances 0.000 claims description 6
- 229920000573 polyethylene Polymers 0.000 claims description 6
- 239000000843 powder Substances 0.000 abstract description 24
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 239000010953 base metal Substances 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 230000007797 corrosion Effects 0.000 abstract 2
- 238000005260 corrosion Methods 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005219 brazing Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 10
- 239000012298 atmosphere Substances 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000004034 viscosity adjusting agent Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 229910002711 AuNi Inorganic materials 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- SFMJNHNUOVADRW-UHFFFAOYSA-N n-[5-[9-[4-(methanesulfonamido)phenyl]-2-oxobenzo[h][1,6]naphthyridin-1-yl]-2-methylphenyl]prop-2-enamide Chemical compound C1=C(NC(=O)C=C)C(C)=CC=C1N1C(=O)C=CC2=C1C1=CC(C=3C=CC(NS(C)(=O)=O)=CC=3)=CC=C1N=C2 SFMJNHNUOVADRW-UHFFFAOYSA-N 0.000 description 1
- 230000009972 noncorrosive effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、非酸化性雰囲気中でろう付けする際に使用す
るペーストろうのバインダーに係るものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a paste solder binder used for brazing in a non-oxidizing atmosphere.
(従来の技術とその問題点)
従来より極めて酸化され易い母材のろう付けは、真空中
又は還元性雰囲気中などめ非酸化性雰囲気中で行われて
いる。この際使用されるろう材としては、近時ろう粉末
とバインダーを混合したペーストろうが採用されつつあ
る。(Prior Art and its Problems) Conventionally, brazing of base materials that are extremely susceptible to oxidation has been carried out in a non-oxidizing atmosphere such as a vacuum or a reducing atmosphere. As the brazing material used in this case, a paste brazing material made by mixing a brazing powder and a binder has recently been adopted.
このペーストろうの主成分であるろう材には、公知のろ
う材を粉末にしたちの例えば△uNiろう粉末、t’s
、 g Cuろう粉末、AgPdろう粉末等が使用され
るが、バインダーには次のような性質が要求される。The brazing filler metal that is the main component of this paste solder is made by powdering known brazing filler metals, such as △uNi wax powder, t's
, g Cu wax powder, AgPd wax powder, etc. are used, but the binder is required to have the following properties.
(1)非酸化性雰囲気中で使用した際、カーボン等の残
渣が残らないこと。(1) No residue such as carbon remains when used in a non-oxidizing atmosphere.
(2)保管中にろう粉末と分離して2層にならないこと
。(2) It should not separate from the wax powder and form two layers during storage.
(3)ろう粉末を腐食しないこと。(3) Do not corrode the wax powder.
(4)被ろう付母材を酸化しないこと。(4) Do not oxidize the base material to be brazed.
(5)ろう付は部分に濡れ、ろう付は部分から流れ落ち
たりすることがないこと。(5) Brazing should not get wet or run off from the part.
(6)加熱中にはねないこと。(6) Do not splash during heating.
(7)作業性が良いこと。(7) Good workability.
つまりペーストろうのバインダーとしては、非腐食性で
、常温では揮発しにくく粘性があり、ろう付けの際には
450℃程度までの内に分離蒸発してはねたり、残渣を
残さないものが望まれている。In other words, as a binder for paste solder, it is desirable that it is non-corrosive, has a viscosity that does not easily evaporate at room temperature, and that does not separate and evaporate within 450°C during brazing and does not splatter or leave any residue. It is rare.
然し乍ら、従来のペーストろうに使われるバインダーに
は前記条件を満足するものが無かった。However, none of the binders used in conventional paste soldering satisfies the above conditions.
そこで本発明者らは、バインダーの組成物として要求さ
れる前記条件を満足させるには、成る程度の分子量を持
った高分子材料と、その溶剤及びペーストにした時比重
の重いろう粉末を分離しないようにバインダーに粘性を
与える為の粘度調整剤が必要であることに着目して、高
分子材料、それを溶解する溶剤及び粘度調整剤について
試験研究の結果、n−オクタンとポリエチレンと粘度調
整剤として有機性ゲル化剤を組合わせることにより前記
条件を満足するろうペースト用バインダーを見い出した
ものである。Therefore, the present inventors believe that in order to satisfy the above conditions required for a binder composition, it is not necessary to separate the polymeric material having a certain molecular weight, its solvent, and the wax powder, which has a heavy specific gravity when made into a paste. Focusing on the need for a viscosity modifier to impart viscosity to the binder, we conducted research on polymeric materials, solvents for dissolving them, and viscosity modifiers, and found that n-octane, polyethylene, and viscosity modifiers We have discovered a binder for wax paste that satisfies the above conditions by combining it with an organic gelling agent.
(問題点を解決するための手段)
本発明のろうペースト用バインダーは、n−オクタン2
0〜60帆%に、ポリエチレン40〜80wt%と有機
ゲル化剤0.25〜3wL%を混合して成るものである
。(Means for solving the problems) The binder for wax paste of the present invention has n-octane 2
It is made by mixing 0 to 60 wt% of polyethylene, 40 to 80 wt% of polyethylene, and 0.25 to 3 wL% of an organic gelling agent.
本発明のろうペースト用バインダーに於いて、n−オク
タン20〜60wt%を溶剤として用いる理由は、作業
性の改善と揮発性の改善のためで、n−オクタンが20
−1%未満だと保管中にろう粉末と分離して2層になり
易< 、60wt%を超えると揮発しやす(ろう粉末を
固着しにくくなるからである。The reason why 20 to 60 wt% of n-octane is used as a solvent in the binder for wax paste of the present invention is to improve workability and volatility.
- If it is less than 1%, it will easily separate from the wax powder during storage and form two layers, and if it exceeds 60 wt%, it will easily volatilize (this is because it becomes difficult to stick the wax powder).
ポリエチレンの割合を40〜80wt%とした理由は、
40社%未満ではろう粉末と混合してペーストにした際
、ろう付は部分への濡れ性が悪く、十分なろう付けがで
きず80wL%を超えると保管中にろう粉末を分離して
2層になり、バインダーとして不適当であるからである
。有機ゲル剤を0.25〜3wt%とした理由は、0.
25wt%未満ではゲル化しない為ろう粉末と混合して
ペーストにした際、バインダーとろう粉末が2層に分離
してしまい、3wt%を超えるとゲル化の作用が強く固
化してしまう為、バインダーとして使用できなくなるも
のである。The reason why the proportion of polyethylene was set at 40 to 80 wt% is as follows.
If it is less than 40wL%, when it is mixed with wax powder and made into a paste, brazing has poor wettability to the part, and sufficient brazing cannot be achieved, and if it exceeds 80wL%, the wax powder will separate during storage, resulting in two layers This is because it becomes unsuitable as a binder. The reason why the organic gel was set at 0.25 to 3 wt% is that 0.25 to 3 wt% was used.
If it is less than 25 wt%, it will not gel, so when mixed with wax powder and made into a paste, the binder and wax powder will separate into two layers, and if it exceeds 3 wt%, the gelling effect will be strong and solidify, so the binder It can no longer be used as such.
次に本発明によるペーストろう用バインダーの実施例に
ついて説明する。Next, examples of the binder for paste brazing according to the present invention will be described.
(実施例)
n−オクタン45wt%にポリエチレン531%をl毘
合した後、これに有機ゲル化剤をとしてレオシン(CA
STOROIL COMPΔNY!!りを2+d%混合
し十分攪拌した後、湯浴にて45℃±5℃で1時間加熱
し、その後常温まで大気中で放置冷却してゲル化させ、
寒天状バインダーとなした。(Example) After 45 wt% of n-octane was mixed with 531% of polyethylene, leosin (CA) was added as an organic gelling agent.
STOROIL COMPΔNY! ! After mixing 2+d% of the mixture and stirring thoroughly, the mixture was heated in a hot water bath at 45°C ± 5°C for 1 hour, and then left to cool in the air to room temperature to gel.
Made with an agar-like binder.
こうして作製した実施例の寒天状バインダー10帆%に
対しA u N i 18%のろう粉末901%を混合
攪拌してペーストろうとなした。A paste wax was prepared by mixing and stirring 901% of a wax powder with A u N i of 18% to 10% of the agar-like binder of the example thus prepared.
このペーストろうは保管中にろう粉末とバインダーが分
離することがなく、ろう粉末が腐食することもなかった
。In this paste wax, the wax powder and binder did not separate during storage, and the wax powder did not corrode.
然してこのペーストろうを鉄片母材に塗布して水素雰囲
気中、970℃で重ねろう付けしたところ、カーボン等
の残渣も無く、良好なろう付けができた。However, when this paste solder was applied to the base material of the iron piece and was repeatedly brazed at 970° C. in a hydrogen atmosphere, good brazing was achieved without any residue such as carbon.
これに対し従来例1のダーポブレイズ社q rAp45
14ペーストろう及び従来例2のウォールコノモノイ製
ニクロブレイズセメントSを使ったペーストろう にク
ロブレイズセメン+−Sのバインダー10−1%に対し
AuNi18%のろう粉末901%を混合攪拌したもの
)は、保管中にろう粉末とバインダーが分離し、従来例
1のペーストろうはろう粉末が腐食した。そしてこれら
従来例のペーストろうを鉄片母材に塗布して水素雰囲気
中、970℃で重ねろう付けしたところ、カーボン等の
残渣が生じ、ろう付けの品質が悪かった。また従来例2
のペーストろうは加熱中はねた。On the other hand, Darpo Blaze qrAp45 of conventional example 1
14 paste wax and conventional example 2 using Niclo Blaze Cement S manufactured by Wall Kono Monoi (mixed and stirred with 10-1% of Klo Blaze Cement+-S binder and 901% of AuNi 18% wax powder). During storage, the wax powder and binder separated, and the wax powder in the paste wax of Conventional Example 1 corroded. When these conventional brazing pastes were applied to the base material of an iron piece and laminated and brazed at 970° C. in a hydrogen atmosphere, residues such as carbon were produced and the quality of the brazing was poor. Also, conventional example 2
The paste wax sputtered during heating.
(発明の効果)
以上の説明で判るように本発明のペーストろう用バイン
ダーは、ろう粉末と適宜に混合攪拌してペーストろうを
作れば、保管中ろう粉末を分離せず、またろう粉末を腐
食することがなく、さらに被ろう付は母材に塗布した際
該母材を酸化することがなく、しかもろう付けの加熱中
はねることがなく、その上非酸化性雰囲気中でのろう付
けに使用してもカーボン等の残渣が生じないペーストろ
うが得られるという優れた効果がある。(Effects of the Invention) As can be seen from the above explanation, if the binder for paste brazing of the present invention is appropriately mixed and stirred with wax powder to make a paste wax, the wax powder will not separate during storage and will not corrode the wax powder. In addition, over-brazing does not oxidize the base material when applied to the base material, and does not splatter during heating for brazing, and can be used for brazing in non-oxidizing atmospheres. This has the excellent effect of producing a paste wax that does not produce residues such as carbon.
Claims (1)
80wt%と有機ゲル化剤0.25〜3wt%を混合し
て成るペーストろう用バインダー。20-60wt% n-octane, 40-40wt% polyethylene
A binder for paste soldering comprising a mixture of 80 wt% and an organic gelling agent of 0.25 to 3 wt%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31405986A JPS63160798A (en) | 1986-12-24 | 1986-12-24 | Binder for paste solder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31405986A JPS63160798A (en) | 1986-12-24 | 1986-12-24 | Binder for paste solder |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63160798A true JPS63160798A (en) | 1988-07-04 |
Family
ID=18048727
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31405986A Pending JPS63160798A (en) | 1986-12-24 | 1986-12-24 | Binder for paste solder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63160798A (en) |
-
1986
- 1986-12-24 JP JP31405986A patent/JPS63160798A/en active Pending
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