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JPS63160795A - Binder for paste solder - Google Patents

Binder for paste solder

Info

Publication number
JPS63160795A
JPS63160795A JP31405486A JP31405486A JPS63160795A JP S63160795 A JPS63160795 A JP S63160795A JP 31405486 A JP31405486 A JP 31405486A JP 31405486 A JP31405486 A JP 31405486A JP S63160795 A JPS63160795 A JP S63160795A
Authority
JP
Japan
Prior art keywords
binder
solder
paste
brazing
wax
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31405486A
Other languages
Japanese (ja)
Inventor
Kozo Kashiwagi
孝三 柏木
Hidekazu Yanagisawa
柳沢 秀和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP31405486A priority Critical patent/JPS63160795A/en
Publication of JPS63160795A publication Critical patent/JPS63160795A/en
Pending legal-status Critical Current

Links

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  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To prevent corrosion of solder powder and oxidation of base metals and to improve soldering workability by mixing 1 or 2 kinds of polybutene and polyisobutyrene and org. gelling agent respectively at prescribed % with specific weight % of n-hexane. CONSTITUTION:The binder for paste solder is obtd. by mixing 30-80% 1 or 2 kinds of polybutene and polyisobutyrene with 20-70% n-hexane, and further, adding 0.25-3% org. gelling agent thereto, then agitating and heating the mixture. The corrosion of the solder during storage is prevented by the gelation of the binder and the oxidation of the base metals when the solder is coated thereon are prevented if the paste solder is prepd. by adequately mixing and agitating this binder and the solder powder. Further, the splashing of the binder during soldering is obviated by the viscosity adjustment of the binder and the generation of residue is obviated as well. The soldering workability is, therefore, improved.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、非酸化性雰囲気中でろう付けする際に使用す
るペーストろうのバインダーに係るものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a paste solder binder used for brazing in a non-oxidizing atmosphere.

(従来の技術とその問題点) 従来より極めて酸化され易い母材のろう付けは、真空中
又は還元性雰囲気中などの非酸化性雰囲気中で行われて
いる。この際使用されるろう材としては、近時ろう粉末
とパイ・ンダーを混合したペーストろうが採用されつつ
ある。
(Prior Art and its Problems) Conventionally, brazing of base materials that are extremely susceptible to oxidation has been performed in a non-oxidizing atmosphere such as a vacuum or a reducing atmosphere. As the brazing material used in this case, a paste brazing material that is a mixture of wax powder and pie powder has recently been adopted.

このペーストろうの主成分であるろう材には、公知のろ
う材を粉末にしたちの例えばAuN iろう粉末、Ag
Cuろう粉末、ΔgPdろう粉末等が使用されるが、バ
インダーには次のような性質が要求される。
The brazing filler metal, which is the main component of this paste solder, includes powdered brazing filler metals such as AuNi brazing powder, Ag
Cu solder powder, ΔgPd solder powder, etc. are used, but the binder is required to have the following properties.

(1)非酸化性雰囲気中で使用した際、カーボン等の残
渣が残らないこと。
(1) No residue such as carbon remains when used in a non-oxidizing atmosphere.

(2)保管中にろう粉末と分離して2層にならないこと
(2) It should not separate from the wax powder and form two layers during storage.

(3)ろう粉末を腐食しないこと。(3) Do not corrode the wax powder.

(4)被ろう付母材を酸化しないこと。(4) Do not oxidize the base material to be brazed.

(5)ろう付は部分に濡れ、ろう付は部分から流れ落ち
たりすることがないこと。
(5) Brazing should not get wet or run off from the part.

(6)加熱中にはねないこと。(6) Do not splash during heating.

(7)作業性が良いこと。(7) Good workability.

つまりペーストろうのバインダーとしては、非腐食性で
、常温では揮発しにくく粘性があり、ろう付けの際には
450℃程度までの内に分離藤発してはねたり、残渣を
残さないものが望まれている。
In other words, as a binder for paste brazing, it is desirable to have a non-corrosive binder that is viscous and does not easily evaporate at room temperature, and that does not separate or splatter or leave any residue during brazing at temperatures up to about 450°C. It is rare.

然し乍ら、従来のペーストろうに使われるバインダーに
は前記条件を満足するものが無かった。
However, none of the binders used in conventional paste soldering satisfies the above conditions.

そこで本発明者らは、バインダーの組成物として7求さ
れる前記条件を満足させるには、成る程度の分子量を持
った高分子材料と、その溶剤及びペーストにした時比重
の重いろう粉末を分離しないようにバインダーに粘性を
与える為の粘度調整剤が必要であることに着目して、高
分子材料、それを溶解する溶剤及び粘度調整剤について
試験研究の結果、n−ヘキサンとポリブテン、ポリイソ
ブチレンの1種又は2種と粘度調整剤として有機性ゲル
化剤を組合わせることにより前記条件を満足するろうペ
ースト用バインダーを見い出したものである。
Therefore, in order to satisfy the above-mentioned conditions required for a binder composition, the present inventors separated a polymer material having a certain molecular weight, a solvent thereof, and a wax powder having a heavy specific gravity when made into a paste. Focusing on the need for a viscosity modifier to give viscosity to the binder to prevent it from becoming viscous, we conducted research on polymeric materials, solvents for dissolving them, and viscosity modifiers, and found that n-hexane, polybutene, and polyisobutylene were used. We have discovered a binder for wax paste that satisfies the above conditions by combining one or two of the above and an organic gelling agent as a viscosity modifier.

(問題点を解決するための手段) 本発明のろうペースト用バインダーは、n−ヘキサン2
0〜70−t%に、ポリブテン、ポリイソブチレンの1
種又は2種を30〜80−t%と有機ゲル化剤0.25
〜3wt%を混合して成るものである。
(Means for Solving the Problems) The binder for wax paste of the present invention comprises n-hexane 2
0 to 70-t%, 1 of polybutene, polyisobutylene
30-80-t% of one or two species and 0.25% of an organic gelling agent
~3 wt%.

本発明のろうペースト用バインダーに於いて、n−ヘキ
サン20〜7h+t%を溶剤として用いる理由は、作業
性の改善と揮発性の改善のためで、n−ヘキサンが20
w+、%未満だと保管中にろう粉末と分離して2Nにな
り易’< 、70wL%を超えると揮発しゃすくろう粉
末を固着しにくくなるからである。
In the binder for wax paste of the present invention, the reason why 20 to 7 h+t% of n-hexane is used as a solvent is to improve workability and volatility.
If it is less than w+%, it will easily separate from the wax powder during storage and become 2N, and if it exceeds 70 wL%, it will be difficult to fix the volatilized wax powder.

ポリブテン、ポリイソブチレンの1種又は2種を30〜
70−t%とした理由は、30−1%未満ではろう粉末
と混合してペーストにした際、ろう付は部分への濡れ性
が悪く、十分なろう付けができず70wt%を超えると
保管中にろう粉末を分離して2Nになり、バ・イングー
として不適当であるからである。
30~1 type or 2 types of polybutene and polyisobutylene
The reason for setting it at 70-t% is that if it is less than 30-1%, when it is mixed with solder powder and made into a paste, brazing has poor wettability to the parts, and sufficient brazing cannot be achieved, and if it exceeds 70-t%, it cannot be stored. This is because the wax powder separates out and becomes 2N, making it unsuitable for use as Ba Ingu.

有機ゲル剤を0.25〜3wt%とした理由は、0.2
5tvt%未満ではゲル化しない為ろう粉末と混合して
ペーストにした際、バインダーとろう粉末が2層cL分
離してしまい、3wt%を超えるとゲル化の作用が強く
固化してしまう為、バインダーとして使用できなくなる
ものである。
The reason for setting the organic gel agent to 0.25 to 3 wt% is that 0.2
If it is less than 5 tvt%, it will not gel, so when mixed with wax powder to make a paste, the binder and wax powder will separate into two layers cL, and if it exceeds 3 wt%, the gelling effect will be strong and solidify, so the binder It can no longer be used as such.

次に本発明によるペーストろう用バインダーの実施例に
ついて説明する。
Next, examples of the binder for paste brazing according to the present invention will be described.

(実施例) 下記の表に示す成分組成の如くn−ヘキサンにポリブテ
ン、ポリイソブチレンの1種又は2種を混合した後、こ
れに有機ゲル化剤としてレオシン(CASTOROIL
 COMPANY製)を混合し十分撹拌した後、湯浴に
て45℃±5℃で1時間加熱し、その後常温まで大気中
で放置冷却してゲル化させ、寒天状バインダーとなした
(Example) After mixing n-hexane with one or two of polybutene and polyisobutylene as shown in the table below, rheosin (CASTOROIL) was added as an organic gelling agent.
COMPANY) were mixed and sufficiently stirred, heated in a hot water bath at 45°C ± 5°C for 1 hour, and then left to cool to room temperature in the air to gel, resulting in an agar-like binder.

こうして作製した実施例1〜3の寒天状バインダー10
wt%に対しAuNi18%のろう粉末901%を混合
攪拌してペーストろうとなした。
Agar-like binder 10 of Examples 1 to 3 thus produced
A wax paste was prepared by mixing and stirring 901% of wax powder of 18% AuNi based on wt%.

このペーストろうは保管中にろう粉末とバインダーが分
離することがなく、ろう粉末が腐食することもなかった
In this paste wax, the wax powder and binder did not separate during storage, and the wax powder did not corrode.

然してこのペーストろうを鉄片母材に塗布して水素雰囲
気中、970℃で重ねろう付けしたところ、カーボン等
の残渣も無く、良好なろう付けができた。
However, when this paste solder was applied to the base material of the iron piece and was repeatedly brazed at 970° C. in a hydrogen atmosphere, good brazing was achieved without any residue such as carbon.

これに対し従来例1のダーボブレイズ社製IAI’45
14ペーストろう及び従来例2のウォールコノモノイ製
ニクロブレイズセメントSを使ったペーストろう にク
ロプレイズセメントSのバインダーIO帆%に対しAu
Ni18%のろう粉末90wt%を混合撹拌したもの)
は、保管中にろう粉末とバインダーが分離し、従来例1
のペーストろうはろう粉末が腐食した。そしてこれら従
来例のペーストろうを鉄片母材に塗布して水素雰囲気中
、970℃で重ねろう付けしたところ、カーボン等の残
渣が生じ、ろう付けの品質が悪かった。また従来例2の
ペーストろうは加熱中はねた。
On the other hand, in conventional example 1, IAI'45 manufactured by Darbo Blaze Co., Ltd.
14 paste wax and conventional example 2 using Nikro Blaze Cement S made by Wall Kono Monoi.
Mixed and stirred 90wt% of 18% Ni wax powder)
In conventional example 1, wax powder and binder separated during storage.
The paste of the wax was corroded by the wax powder. When these conventional brazing pastes were applied to the base material of an iron piece and brazed in layers at 970° C. in a hydrogen atmosphere, residues such as carbon were produced and the quality of the brazing was poor. Further, the paste solder of Conventional Example 2 sputtered during heating.

(発明の効果) 以上の説明で判るように本発明のペーストろう用バイン
ダーは、ろう粉末と適宜に混合攪拌してペーストろうを
作れば、保管中ろう粉末を分離せず、またろう粉末を腐
食することがなく、さらに被ろう付は母材に塗布した際
該母材を酸化することがなく、しかもろう付けの加熱中
はねることがなく、その上非酸化性雰囲気中でのろう付
けに使用してもカーボン等の残渣が生じないペーストろ
うが得られるという優れた効果がある。
(Effects of the Invention) As can be seen from the above explanation, if the binder for paste brazing of the present invention is appropriately mixed and stirred with wax powder to make a paste wax, the wax powder will not separate during storage and will not corrode the wax powder. In addition, over-brazing does not oxidize the base material when applied to the base material, and does not splatter during heating for brazing, and can be used for brazing in non-oxidizing atmospheres. This has the excellent effect of producing a paste wax that does not produce residues such as carbon.

Claims (1)

【特許請求の範囲】[Claims] n−ヘキサン20〜70wt%に、ポリブテン、ポリイ
ソブチレンの1種又は2種を30〜80wt%と有機ゲ
ル化剤0.25〜3wt%を混合して成るペーストろう
用バインダー。
A binder for paste brazing comprising 20 to 70 wt % of n-hexane, 30 to 80 wt % of one or both of polybutene and polyisobutylene, and 0.25 to 3 wt % of an organic gelling agent.
JP31405486A 1986-12-24 1986-12-24 Binder for paste solder Pending JPS63160795A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31405486A JPS63160795A (en) 1986-12-24 1986-12-24 Binder for paste solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31405486A JPS63160795A (en) 1986-12-24 1986-12-24 Binder for paste solder

Publications (1)

Publication Number Publication Date
JPS63160795A true JPS63160795A (en) 1988-07-04

Family

ID=18048666

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31405486A Pending JPS63160795A (en) 1986-12-24 1986-12-24 Binder for paste solder

Country Status (1)

Country Link
JP (1) JPS63160795A (en)

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