JPS62293694A - Method of forming pattern for fitting parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] A method for forming a pattern for mounting components on a circuit board made of ceramic or the like, the method comprising forming a connecting conductor pattern between conductor patterns for mounting the components. A good space factor can be obtained by forming a component mounting pad on the conductor pattern, leaving a part of the central part of the conductor pattern and covering it with an insulator, and mounting a component by forming a component mounting pad on the conductor pattern that does not cover the insulator. , high-density mounting is possible.

[Industrial application field]

The present invention relates to a method for forming a pattern for attaching components, and more particularly to a method for forming a pattern for attaching components such as integrated circuits having a small pitch between terminals.

In recent years, electronic components have become smaller due to the amazing progress of high-density integrated circuit technology, and as a result, the pitch between terminals of integrated circuits, etc., has also tended to become smaller. etc. cannot be formed, so if the connection pattern is formed outside the conductor pattern group,
Since the space factor deteriorates, there is a strong demand for the development of a pattern forming method for component attachment that forms a connection pattern between conductor patterns.

[Conventional technology]

FIG. 2 is a diagram explaining a conventional pattern forming method for attaching parts.
FIG.

In the figure, a large number of conductor patterns 1 are formed on a circuit board 2 made of ceramic or the like at positions corresponding to component electrodes of an electronic component such as a mini-mold (not shown), but the gaps between the conductor patterns 1 are small.

Therefore, the connection conductor pattern 11 that supplies power, signals, etc. to this conductor pattern group B is
An insulator 3 such as a glass-based paste is formed on the outside of the conductor pattern 1 to prevent deterioration on the entire surface except for the conductor pattern 1.
It is covered with.

[Problem that the invention seeks to solve]

In the above-mentioned conventional method for forming patterns for mounting parts, since the gap between adjacent conductor patterns is small, the connection conductor pattern for supplying power, signals, etc. to the conductor patterns is formed outside the group of conductor patterns. There was a problem in that the space factor was poor, which hindered high-density packaging.

[Means for solving problems]

The present invention provides a pattern forming method for component mounting that solves the above problems and enables high-density mounting.

That is, a connection pattern 11 is formed between the conductor patterns 1 for mounting components formed on the circuit board 2, and a part of the conductor pattern 1 for mounting the components is covered with the insulator 3,
This problem is solved by forming the component mounting pad 4 on the conductor pattern 1 that does not cover the insulator 3.

[Effect]

The pattern forming method for attaching the above-mentioned components is to form a connection pattern between the conductor patterns for supplying power, signals, etc. to the conductor patterns, and then cover the conductor patterns with a glass-based insulator, leaving a part of the center of the conductor patterns. Since a component mounting pad is formed on a conductor pattern that is not coated with an insulator, and electronic components are mounted on the component mounting pad, the space factor of the circuit board becomes good and high-density mounting becomes possible.

〔Example〕

FIG. 1 is a diagram illustrating an embodiment of the present invention.
t is the main part plan view 3 (b) is A-A' sectional view 1 (C) is B
In the -B' sectional view, the same parts as in FIG. 2 are designated by the same reference numerals.

In the figure, a large number of conductor patterns 1 (1a to 1d) are formed on a circuit board TIZ made of ceramic or the like at positions corresponding to component electrodes 6 of an electronic component 7 such as a mini-mold,
After forming the connection pattern 11 between the conductor patterns 1a and 1b and between 1b and 1c, a glass-based pattern is formed using a mask or the like so as to leave a part of the center of the conductor pattern 1 for the purpose of preventing deterioration. An insulator 3 made of paste or the like is coated.

Then, a copper paste or the like is printed on the part of the conductor pattern 1 that is not covered with the insulator 3, and a component mounting pad 4 (this component mounting pad 4 is used for the component electrode 6 of the electronic component 7) is printed.
It is preferable to make it slightly larger than . ), and component electrodes 6 of electronic components 7 are bonded to this component mounting pad 4 with solder 5.

〔Effect of the invention〕

As is clear from the above description, since the connection pattern is formed between the conductor patterns according to the present invention, the space factor of the circuit board is improved, high-density mounting is possible, and reliability is greatly improved. It is valid.

[Brief explanation of drawings]

FIG. 1 is a diagram illustrating an embodiment of the present invention.
1 is a plan view of the main part, (b) is a sectional view along line A-A', and (C) is B
-B' sectional view. Figure 2 is a diagram explaining the conventional method of forming a pattern for attaching parts. , 1.1a to 1d are conductor patterns, 2 is a circuit board, 3 is an insulator, 4 is a component mounting pad, 5 is solder,
6 is a component electrode, 7 is an electronic component, 11 is a connection pattern,
B indicates a conductor pattern group. Out of 14? 7-〉 (C) Teitsu EIF4a-Tsuhimo Phantom Figure 1

Claims (1)

[Claims] A method for forming a pattern for attaching components on a circuit board (2), comprising: a pattern for connecting (11) between conductor patterns (1) for attaching components formed on the circuit board (2); is formed, and an insulator (
A method for forming a pattern for attaching a component, characterized in that a pad for attaching a component (4) is formed on the conductor pattern (1) which is coated with the conductor pattern (1) and not covered with the insulator (3).