JPS62150828A - Wafer drying apparatus - Google Patents

Abstract

PURPOSE:To immediately dry a wafer after cleaning it for a short time by providing a nozzle of dry gas and a vacuum outlet on the same surface. CONSTITUTION:A vacuum outlet 4 and a gas injection nozzle port 3 are formed on the same surface. Dry gas 5 is injected to a wafer 1 which is cleaned with pure water from an injection nozzle port 3 to splash water droplets 2 and the splashed droplets 2 are sucked from the outlet 4 to dry the wafer 1. Since both the nozzle port and the outlet are formed on the same surface, the wafer can be dried in a short time. The wafer can be utilized immediately after cleaned to prevent dust from being readhered thereto.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a wafer drying apparatus used for manufacturing semiconductor devices.

[Prior Art] FIG. 2 is a sectional view showing a conventional wafer drying apparatus. In the figure, (1) is a semiconductor wafer, (2) is a water droplet attached to this wafer (1), and (3) is a sectional view showing a conventional wafer drying apparatus. ) is the nozzle opening, (5
) is dry gas.

Next, its operation will be explained. First, in a semiconductor device manufacturing process, a wafer is cleaned with pure water as a pretreatment for each process. Water droplets (
Methods for drying 2) include drying by spraying dry gas (5) from the nozzle port (3), or drying the wafers by rotating them at high speed using a rinser dryer or the like for each batch.

[Problems to be Solved by the Invention] Since the conventional drying apparatus is configured as described above, it has problems such as requiring a long time for drying and being susceptible to dust. In addition, the rinser dryer is a large device,
Moreover, since it is a batch process, it is not suitable for drying semiconductor wafers one by one, and has the disadvantage that it takes a long time.

This invention was made to solve the above-mentioned problems, and aims to provide a wafer drying device that can reduce dust during drying and dry semiconductor wafers immediately after cleaning and in a short time. shall be.

[Means for Solving the Problems] A wafer drying apparatus according to the present invention is provided with a plurality of nozzle ports for spraying high-pressure dry gas, and a plurality of vacuum exhaust ports on the same surface. .

[Function] The wafer drying apparatus according to the present invention scatters water droplets using the dry gas ejected from the nozzle, and at the same time sucks the scattered water droplets from the vacuum exhaust port to dry the wafer.

[Embodiment of the Invention] Hereinafter, a wafer drying apparatus according to an embodiment of the present invention will be described as a first embodiment.
The cross-sectional view of Figure (a) will be explained. In FIG. 1(a), (4) indicates a vacuum exhaust port, and (6) indicates an exhaust port, and both the vacuum exhaust port (4) and the gas jet nozzle port (3) are formed on the same surface. Moreover, FIG. 1(b) is a plan view of the drying apparatus, showing the arrangement of the gas ejection nozzle port (3) and the vacuum exhaust port (4). Note that the same reference numerals as in FIG. 2 indicate the same or similar functions.

Next, its operation will be explained. First, after taking out the semiconductor wafer (1) that has been cleaned with pure water, a dry gas (Cwt: M element) with a gas pressure of 2 to 10 kg/cs is injected into the nozzle opening (3
) onto the wafer (1), and at the same time 1 to 30Q.
Air was taken in from the vacuum exhaust port (4) at a speed of /sea, and thereby a 5-inch wafer could be dried in 3 to 8 seconds. The wafer drying apparatus used had a total drying surface area of about 140 cm'' and a total ejection nozzle area of 4 to 10 cm''.

In the above embodiment, the gas ejection nozzle ports (3) are arranged so as to be scattered among all the exhaust ports (4), but in this case, the ejection nozzle ports (3) and the vacuum exhaust ports (4) are arranged alternately. They may be arranged in a ring. Further, in the above embodiment, the method was used to dry the semiconductor wafer (1), but it can also be used to dry the mask. It can also be used as a dust removal device.

[Effects of the Invention] As described above, according to the present invention, since both the nozzle port that blows out water droplets using dry gas and the exhaust port that sucks the scattered water droplets are formed on the same surface, drying of the wafer is prevented. This method can be carried out in a short period of time, and the equipment can be made at low cost.It can also be used immediately after cleaning the wafer, and it can prevent dust from re-adhering.

[Brief explanation of drawings]

FIG. 1(a) is a sectional view showing a wafer drying apparatus according to an embodiment of the present invention, FIG. 1(b) is a plan view thereof, and FIG. 2 is a sectional view showing a conventional wafer drying apparatus. . In the figure, (1) is a semiconductor wafer, (2) is a water droplet, (3) is a gas ejection nozzle port, (4) is a vacuum exhaust port, (5) is a dry gas, and (6) is an exhaust gas. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) A wafer drying apparatus characterized by having both a plurality of jetting ports for spouting dry gas and a vacuum exhaust port for sucking moisture, etc. from the wafers on the same surface.