JPS62156971A - Forming of coated film - Google Patents
Forming of coated filmInfo
- Publication number
- JPS62156971A JPS62156971A JP61289184A JP28918486A JPS62156971A JP S62156971 A JPS62156971 A JP S62156971A JP 61289184 A JP61289184 A JP 61289184A JP 28918486 A JP28918486 A JP 28918486A JP S62156971 A JPS62156971 A JP S62156971A
- Authority
- JP
- Japan
- Prior art keywords
- recording
- coated film
- electrodes
- film
- recording liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002994 raw material Substances 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 20
- 239000007788 liquid Substances 0.000 abstract description 28
- 229920005989 resin Polymers 0.000 abstract description 11
- 239000011347 resin Substances 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 7
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000001681 protective effect Effects 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 5
- -1 polyxylylene Polymers 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 2
- 238000007740 vapor deposition Methods 0.000 abstract description 2
- 229910010272 inorganic material Inorganic materials 0.000 abstract 2
- 239000011147 inorganic material Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000001153 fluoro group Chemical group F* 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 26
- 239000010408 film Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000009434 installation Methods 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- JXPDNDHCMMOJPC-UHFFFAOYSA-N 2-hydroxybutanedinitrile Chemical compound N#CC(O)CC#N JXPDNDHCMMOJPC-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UBUCNCOMADRQHX-UHFFFAOYSA-N N-Nitrosodiphenylamine Chemical compound C=1C=CC=CC=1N(N=O)C1=CC=CC=C1 UBUCNCOMADRQHX-UHFFFAOYSA-N 0.000 description 1
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 1
- 239000004693 Polybenzimidazole Substances 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- WDODWFPDZYSKIA-UHFFFAOYSA-N benzeneselenol Chemical compound [SeH]C1=CC=CC=C1 WDODWFPDZYSKIA-UHFFFAOYSA-N 0.000 description 1
- KKSAZXGYGLKVSV-UHFFFAOYSA-N butan-1-ol;titanium Chemical compound [Ti].CCCCO KKSAZXGYGLKVSV-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- HWMTUNCVVYPZHZ-UHFFFAOYSA-N diphenylmercury Chemical compound C=1C=CC=CC=1[Hg]C1=CC=CC=C1 HWMTUNCVVYPZHZ-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- KTWOOEGAPBSYNW-UHFFFAOYSA-N ferrocene Chemical compound [Fe+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 KTWOOEGAPBSYNW-UHFFFAOYSA-N 0.000 description 1
- YUWFEBAXEOLKSG-UHFFFAOYSA-N hexamethylbenzene Chemical compound CC1=C(C)C(C)=C(C)C(C)=C1C YUWFEBAXEOLKSG-UHFFFAOYSA-N 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- VLZLOWPYUQHHCG-UHFFFAOYSA-N nitromethylbenzene Chemical compound [O-][N+](=O)CC1=CC=CC=C1 VLZLOWPYUQHHCG-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- BEZDDPMMPIDMGJ-UHFFFAOYSA-N pentamethylbenzene Chemical compound CC1=CC(C)=C(C)C(C)=C1C BEZDDPMMPIDMGJ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- ORQWTLCYLDRDHK-UHFFFAOYSA-N phenylselanylbenzene Chemical compound C=1C=CC=CC=1[Se]C1=CC=CC=C1 ORQWTLCYLDRDHK-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002480 polybenzimidazole Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- NLDYACGHTUPAQU-UHFFFAOYSA-N tetracyanoethylene Chemical group N#CC(C#N)=C(C#N)C#N NLDYACGHTUPAQU-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- YUKQRDCYNOVPGJ-UHFFFAOYSA-N thioacetamide Chemical compound CC(N)=S YUKQRDCYNOVPGJ-UHFFFAOYSA-N 0.000 description 1
- DLFVBJFMPXGRIB-UHFFFAOYSA-N thioacetamide Natural products CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1604—Production of bubble jet print heads of the edge shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1606—Coating the nozzle area or the ink chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は一般にインクと呼ばれる記録液を微細オリフィ
スから小滴として吐出飛翔させ、この小滴の被記録面へ
の付着を似て記録を行なう液滴噴射記録装置、特に使用
耐久性を向上させた新規構成の液滴噴射記録装置に関す
る。現在知られる各種記録方式の中でも、記録時に騒音
の発生がほとんどないノンインパクト記録方式であって
、且つ、高速記録が可能であり、しかも普通紙に特別の
定着処理を必要とせずに記録の行える所謂インクジェッ
ト記録法(液滴噴射記録法)は、極めて有用な記録方式
であると認められている。このインクジェット記録法に
就いては、これ迄にも様々の方法が提案され、改良が加
えられて商品化されたものもあれば、現在もなお、実用
化への努力が続けられているものもある。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a droplet jet recording apparatus which performs recording by ejecting a recording liquid, generally called ink, as small droplets from a fine orifice, and by simulating the adhesion of these droplets to a recording surface. The present invention relates to a droplet jet recording device with a new configuration that has improved durability in use. Among the various recording methods currently known, this is a non-impact recording method that generates almost no noise during recording, is capable of high-speed recording, and can record on plain paper without requiring any special fixing process. The so-called inkjet recording method (droplet jet recording method) is recognized as an extremely useful recording method. Various methods have been proposed for this inkjet recording method, some have been improved and commercialized, and others are still being worked on to put them into practical use. be.
インクジェット記録法は、インクと称される記録液の小
液滴(droplet)を種々の作用原理で飛翔させ、
それを紙等の被記録部材に付着させて記録を行うもので
ある。そして、本件出願人も、斯かるインクジェット記
録法に係る新規方式に就いて既に提案を行なっている。The inkjet recording method uses various working principles to fly small droplets of recording liquid called ink.
Recording is performed by attaching it to a recording member such as paper. The present applicant has also already proposed a new system related to such an inkjet recording method.
この新規方式は特願昭52−118798号に於いて提
案されており、その基本原理は次に概説する通りである
。This new system was proposed in Japanese Patent Application No. 118798/1982, and its basic principle is as outlined below.
つまり、この新規インクジェット記録方式は、記録液を
収容することのできる微細な液室内の導入された記録液
に対して、情報信号として熱的パルスを与え、前記記録
液が状態変化をおこすことによって生じる圧力波等の作
用力に従って、先の液室に付設したオリフィスより、前
記記録液を小液滴として吐出・飛翔せしめ、これを被記
録゛ 部材に付置させて記録を行う方式である。In other words, this new inkjet recording method applies a thermal pulse as an information signal to the recording liquid introduced into a fine liquid chamber that can contain the recording liquid, and causes the recording liquid to change its state. In this method, the recording liquid is ejected and flown as small droplets from an orifice attached to the liquid chamber according to the acting force such as a generated pressure wave, and the recording liquid is attached to a member to be recorded to perform recording.
ところで、この新規方式には、実施装置の構成が従来の
それに比べて簡略であること、及び吐出オリフィスをマ
ルチアレー構成にして高速記録に適合させ易いと言う大
きな長所かある反面、実施装置の耐久性が然程高くない
と言う不利が認められた。即ち、この実施装置に於いて
は、記録液に熱的パルスを入力する手段として発熱抵抗
体及びそのリード電極を採用しているため、これ等が記
録液に接した状態で繰返し使用されている間に、酸化や
腐食により機能劣化を起してしまったり、場合によって
は、作動不能に陥ることもしばしばありた。又、記録液
が電気分解されたり、リート電極の電極腐蝕によって、
記録液中に不溶解成分か混在して所期の液滴吐出を妨害
する等の不都合もしばしば認められた。By the way, this new method has the great advantage that the configuration of the implementation device is simpler than the conventional one, and that the ejection orifice can be configured in a multi-array to easily adapt to high-speed recording, but on the other hand, the durability of the implementation device is It was recognized that he was at a disadvantage in that his sexual ability was not particularly high. That is, since this implementation device employs a heating resistor and its lead electrodes as a means for inputting thermal pulses to the recording liquid, these are repeatedly used in contact with the recording liquid. Over time, oxidation and corrosion often caused functional deterioration, and in some cases, the devices became inoperable. In addition, due to electrolysis of the recording liquid or corrosion of the leet electrode,
Inconveniences such as undissolved components mixed in the recording liquid and interfering with the intended ejection of droplets have also been observed.
そこで、木発明では、上記、特願昭52−118798
号に開示されたインクジェット記録方式に見られた重大
欠点を完全に解消すると共に、なお一層の改善を施して
なる新規構成の液滴噴射記録装置を提案する。Therefore, in the wood invention, the above patent application No. 52-118798
We propose a droplet jet recording device with a new configuration that completely eliminates the serious drawbacks seen in the ink jet recording method disclosed in the No. 1, and which is further improved.
つまり、本発明に於いては、その使用寿命が長期に亘る
液滴噴射記録装置を提案することを主目的とする。That is, the main object of the present invention is to propose a droplet jet recording device that has a long service life.
又、本発明に於いては、構造的に簡略であると共に、熱
作用による記録液滴の安定的吐出を長時間に、亘り保障
する液滴噴射記録装置を提供することも他の目的とする
。加えて、木発明に於いては、優れた使用耐久性と高速
記録とを保証するマルチアレイ型式の液滴噴射記録装置
を提供することも又別の目的としている。Another object of the present invention is to provide a droplet jet recording device that is structurally simple and that ensures stable ejection of recording droplets over a long period of time due to thermal action. . In addition, another object of the invention is to provide a multi-array droplet jet recording device that guarantees excellent durability in use and high-speed recording.
そして、これ等の目的を達成する本発明の液滴噴射記録
装置とは、細孔から成る記録液の移動経路を有し、この
経路の一端を吐出口として、そこから前記記録液の小滴
を吐出、飛翔させ、この小滴の少なくとも一部を被記録
面に付着させて記録を行う装置てあって、前記移動経路
中に、発熱作用部とこの作用に接続して電気信号を人力
するためのリード電極とを内設すると共に、少なくとも
前記経路内に在るリード電極上に被膜を形成して前記記
録液がリート電極に接触するのを防止する構成としたこ
とを特徴とするものである。The droplet jet recording device of the present invention that achieves these objects has a recording liquid movement path consisting of pores, and one end of this path is used as an ejection port, from which small droplets of the recording liquid are ejected. A device is provided that performs recording by ejecting and flying small droplets and making at least a portion of these droplets adhere to a recording surface, and in the movement path, a heat generating part is connected to this action to manually generate an electric signal. It is characterized by having a structure in which a lead electrode is provided therein, and a coating is formed on at least the lead electrode existing in the path to prevent the recording liquid from coming into contact with the lead electrode. be.
以下、図示具体例に従って、木発明の詳細な説明する。Hereinafter, the tree invention will be described in detail according to illustrated examples.
先ず、第1図及び第2図を用いて、本発明の係る液滴噴
射記録装置の一具体例及び液滴噴射原理に就いて説明す
る。First, a specific example of a droplet jet recording apparatus according to the present invention and the principle of droplet jetting will be explained using FIGS. 1 and 2.
第1図において、液滴噴射記録装置主要部の概要を示す
。FIG. 1 shows an outline of the main parts of the droplet jet recording device.
即ち、発熱体設置基板1の表面に発熱部2が設けられて
いる。又、基板3の材料としては、ガラス、セラミック
或いは耐熱製プラスチック等が用いられる。基板3には
、吐出前のインクを収容する室4′及び吐出オリフィス
5を構成する長尺溝4が予め形成してあり、この基板3
と前記発熱体設置基板1とは、発熱部2と溝4の位置合
せなした後、接着剤によって接合して一体化される。次
に、この図示装置に係る液滴噴射原理に就いて簡単に述
べる。第2図は、溝4の軸線に沿った断面図である。記
録用インクIKは、図中矢印で示される様に室4′内へ
供給されている。That is, the heat generating part 2 is provided on the surface of the heat generating element installation board 1. Further, as the material for the substrate 3, glass, ceramic, heat-resistant plastic, or the like is used. A long groove 4 constituting a chamber 4' for accommodating ink before ejection and an ejection orifice 5 is formed in advance on the substrate 3.
After aligning the heat generating part 2 and the groove 4, the heat generating element installation board 1 and the heat generating element installation board 1 are joined and integrated with an adhesive. Next, the droplet jetting principle related to this illustrated device will be briefly described. FIG. 2 is a cross-sectional view of the groove 4 along the axis. The recording ink IK is supplied into the chamber 4' as indicated by the arrow in the figure.
今、室4′内の1部に付設された発熱部2に対して外部
から電気信号が印加されると、発熱部2は発熱し、その
近傍のインクIKに熱エネルギーを与える。熱エネルギ
ーを受けたインクIKは体積膨張或いは気泡の発生等の
状態変化を起こして圧力変化を生じ、この圧力変化が吐
出オリフィス5の方向に伝わり、インクIKが小滴10
となって吐出される。そして、この小満10が不図示の
紙等、任意の被記録材の付着することによって記録が為
される。第2図に於いては、発熱体設置基板1の詳細構
造も図示されており、この発熱部2は、アルミナ等の基
板6上に、蓄積層7、発熱抵抗体11、電極8を順次、
薄膜形成技術によって積層し、発熱抵抗体11及び電極
8を所定の形状にパターニングした後、更に、金属酸化
物から成る保護層9を積層して構成される。そして、こ
の発熱部2は室4′内に露出する構成となっている。発
熱部2において、インクIKが直接接するのは保護層9
であるが、この保護層9は発熱抵抗体11か直接にイン
クTKと接触して酸化されたり、逆に、インクIKか電
気分解されるのを防いている。具体的に、この保護層9
の厚さは、インク滴吐出の熱応答性、或はエネルギー効
率の良否を左右するから、てきるだけ薄い方が望ましい
。Now, when an electric signal is applied from the outside to the heat generating part 2 attached to a part of the chamber 4', the heat generating part 2 generates heat and gives thermal energy to the ink IK in the vicinity thereof. The ink IK that has received thermal energy undergoes a state change such as volumetric expansion or the generation of bubbles, resulting in a pressure change, and this pressure change is transmitted in the direction of the ejection orifice 5, causing the ink IK to form small droplets 10.
It is discharged as follows. Recording is performed by attaching an arbitrary recording material such as paper (not shown) to this small print 10. FIG. 2 also shows the detailed structure of the heating element installation board 1, and the heating unit 2 includes a storage layer 7, a heating resistor 11, and an electrode 8 in this order on a substrate 6 made of alumina or the like.
After the heating resistor 11 and the electrode 8 are laminated using a thin film forming technique and patterned into a predetermined shape, a protective layer 9 made of a metal oxide is further laminated. This heat generating portion 2 is configured to be exposed inside the chamber 4'. In the heat generating section 2, the protective layer 9 is in direct contact with the ink IK.
However, this protective layer 9 prevents the heating resistor 11 from coming into direct contact with the ink TK and being oxidized, or conversely, preventing the ink IK from being electrolyzed. Specifically, this protective layer 9
The thickness of the ink layer determines the thermal response of ink droplet ejection or energy efficiency, so it is desirable that the ink layer be as thin as possible.
次に、叙上の所謂、シングルオリフィスタイプの?′&
滴噴射記録装置をマルチオリフィスタイプの装置に変更
した場合の発熱部と電極の配置形態例を略画平面図で描
いたものが次の第3図(a)及び第3図(b)である。Next, what about the so-called single orifice type mentioned above? ′&
The following Figures 3(a) and 3(b) are schematic plan views of examples of the arrangement of the heat generating part and electrodes when the droplet jet recording device is changed to a multi-orifice type device. .
第3図(a)に於いては、アルミニウム等から成る(リ
ート)電極21−1.・・・、21−5及び22−1.
・・・、22−5.と発熱抵抗体パターン23−1.・
・・、23−5から成るパターンが図示されており、こ
のパターンを以下の説明ではU型と略称する。In FIG. 3(a), an electrode 21-1 made of aluminum or the like is shown. ..., 21-5 and 22-1.
..., 22-5. and heating resistor pattern 23-1.・
. . , 23-5 is shown, and this pattern will be abbreviated as U-shape in the following description.
又、第3図(b)に於いては、(リード)電極24及び
25−1.・・・、25−5と発熱抵抗体パターン26
−1.・・・、26−5から成る別のパターンが図示さ
れている。Further, in FIG. 3(b), (lead) electrodes 24 and 25-1. ..., 25-5 and heating resistor pattern 26
-1. . . , 26-5 is illustrated.
そして、このパターンを以下の説明を於いては、S型と
略称する。In the following explanation, this pattern will be abbreviated as S type.
そして、何れの図面の於いても、一点破線で囲っである
領域27.28に、インクつまり記録液の流路が設置さ
れる。In each of the drawings, a flow path for ink, that is, a recording liquid, is provided in areas 27 and 28 surrounded by dotted lines.
この様な、複数の発熱抵抗体パターン及びその(リート
)電極を備えたマルチオリフィスタイプの液滴噴射記録
装置による記録操作を続けてゆくと、従来、下記の様な
現象がしばしば観察された。即ち、
(1)発熱抵抗体パターンの設置数及び密度が増加する
に従って、記録液の流路に於いて電極腐蝕が生じ易く、
その結果、記録液滴の吐出状態が不良になること。When recording operations are continued using such a multi-orifice type droplet jet recording device equipped with a plurality of heating resistor patterns and their (leat) electrodes, the following phenomenon has conventionally been often observed. That is, (1) As the number and density of heating resistor patterns increases, electrode corrosion is more likely to occur in the recording liquid flow path;
As a result, the ejection condition of recording droplets becomes poor.
(2)このような電極腐蝕は、はとんど、第3図(a)
及び第3図(b)の図示例に於いて交差線で示した領域
、つまり記録液の中継室部に於いて生じることが観察さ
れた。そして、上記電極腐蝕は、隣接電極間にできる電
位差に基づき、記録液を介して電解が起こることにより
進行していることも判った。そこで、木発明者は、この
電極腐蝕現象を防ぐには、近接電極同志が、記録液と非
接触状態を保てば良いことに気付き本発明を提案するに
至った。即ち、本発明に於ける具体的方策は発熱抵抗パ
ターンを覆っている保護膜の他に、特に、(リート)電
極上にこの電極と記録液が接触することを防ぐ、有機又
は、無機あるいはその混合系の被膜を設けることである
。(2) Such electrode corrosion usually occurs as shown in Figure 3 (a).
In the illustrated example of FIG. 3(b), it was observed that this phenomenon occurred in the region indicated by the crossing line, that is, in the recording liquid relay chamber. It has also been found that the electrode corrosion progresses due to electrolysis occurring through the recording liquid based on the potential difference created between adjacent electrodes. Therefore, the inventor of the present invention realized that in order to prevent this electrode corrosion phenomenon, it is sufficient to maintain the adjacent electrodes in a non-contact state with the recording liquid, and came to propose the present invention. In other words, in addition to the protective film covering the heating resistor pattern, the specific measure of the present invention is to apply an organic or inorganic film on the (leat) electrode to prevent the recording liquid from contacting the electrode. The method is to provide a mixed coating.
なお、この被膜は発熱抵抗体パターン上には設けない方
か望ましい。何故なら、発熱抵抗体パターン上に保護膜
及びこの被膜を形成すると、全体の層厚が大きくなり、
熱伝達効率を悪くし、ひいては、記録液滴の吐出効率を
低下させることになるからである。Note that it is preferable that this film not be provided on the heating resistor pattern. This is because when a protective film and this coating are formed on the heating resistor pattern, the overall layer thickness increases.
This is because the heat transfer efficiency will be deteriorated, and the ejection efficiency of recording droplets will be reduced.
本発明に於いて、(リート)電極上に被膜を形成する為
の材料としては、■成膜性が良いこと、■緻密な構造で
かつピンホールが少ないこと、■使用インクに対し膨張
、溶解しないこと、■電極層等の下層との接着性が良い
こと、■耐熱性が高いこと等の物性を具備することが望
ましく、例えは、シリコーン樹脂、フッ素樹脂、芳香族
ポリアミド、付加重合型ポリイミド、ポリベンズイミダ
ゾール、金属キレート重合体、チタン酸エステル、エポ
キシ樹脂。In the present invention, the material for forming the film on the (LEET) electrode must: 1) have good film-forming properties, 2) have a dense structure with few pinholes, and 2) be able to expand and dissolve in the ink used. It is desirable that the material has physical properties such as: - good adhesion with the lower layer such as the electrode layer, and - high heat resistance. , polybenzimidazole, metal chelate polymer, titanate ester, epoxy resin.
フタル酸樹脂、熱硬化性フェノール樹脂、P−ビニルフ
ェノール樹脂、ザイロツタ樹脂、トリアジン樹脂、BT
樹脂(トリアジン樹脂とビスマレイミド付加重合樹脂)
等の樹脂が用いられる。Phthalic acid resin, thermosetting phenolic resin, P-vinylphenol resin, Zyrotsuta resin, triazine resin, BT
Resin (triazine resin and bismaleimide addition polymer resin)
Resins such as are used.
これ等の樹脂を成膜するには、該樹脂を溶剤で希釈した
後、(リード)電極(場合によっては発熱抵抗体の為の
保護膜)上に、回転塗布。To form a film of these resins, the resin is diluted with a solvent and then spin-coated onto the (lead) electrode (or protective film for the heating resistor in some cases).
スプレー塗布、浸漬塗布等の手法を用いて塗布した後、
乾燥硬化させれば良い。After applying using methods such as spray coating and dip coating,
Just let it dry and harden.
又、この他に、ポリキシンリレン樹脂及び、その誘導体
を蒸着によって成膜する方法も望ましい。In addition to this, it is also desirable to form a film using a polyxin rylene resin or a derivative thereof by vapor deposition.
更に、種々の有機化合物モノマー、例えばチオウレア、
チオアセトアミド、ビニルフロセ、 ン、1.3.
5−1−’Jクロロベンゼン、クロロベンゼン、スチレ
ン、フェロセン、ピコリン、ナフタレン、ペンタメチル
ベンゼン、ニトロトルエン、アクリロニトリル、ジフェ
ニルセレナイド、P−1−ルイジン、P−キシレン、N
、 N−ジメヂルーP−1−ルイジン、トルエン、アニ
リン、ジフェニルマーキュリ−、ヘキサメチルベンゼン
、マロンニトリル、テトラシアノエチレン、チオフェン
、ベンゼンセレノール、テトラフルオロエチレン、エチ
レン、N−ニトロソジフェニルアミン、アセチレン、1
,2,4.−)リクロロベンゼン、プロパンをプラズマ
重合法により、(リード)電極上に成膜させても良い。Furthermore, various organic compound monomers such as thiourea,
Thioacetamide, vinyl furose, 1.3.
5-1-'J chlorobenzene, chlorobenzene, styrene, ferrocene, picoline, naphthalene, pentamethylbenzene, nitrotoluene, acrylonitrile, diphenylselenide, P-1-luidine, P-xylene, N
, N-dimedylene-P-1-luidine, toluene, aniline, diphenylmercury, hexamethylbenzene, malonitrile, tetracyanoethylene, thiophene, benzeneselenol, tetrafluoroethylene, ethylene, N-nitrosodiphenylamine, acetylene, 1
, 2, 4. -) Lichlorobenzene or propane may be formed into a film on the (lead) electrode by plasma polymerization.
これ等とは別に、オルトチタン酸ブチル、エチルシリケ
ート等の溶液を用いて無機物の被膜を形成することもで
きる。Apart from these, an inorganic film can also be formed using a solution of butyl orthotitanate, ethyl silicate, or the like.
叙上の被膜の厚さは、本発明に於いては、乾燥後の膜厚
て通常は0.01μm〜10μm、好適には0.1mμ
〜5μm、最適には0,1μm〜3μmである。In the present invention, the thickness of the above-mentioned film is usually 0.01 μm to 10 μm, preferably 0.1 μm after drying.
~5 μm, optimally 0.1 μm to 3 μm.
本発明に於いて好適な被膜の設置態様は、次に図示する
2つがある。これ等を第4図及び第5図に略画平面図で
示す。In the present invention, there are two preferred methods of installing the coating as shown below. These are shown in schematic plan views in FIGS. 4 and 5.
つまり、第4図は先述U型パターンが形成された記録ヘ
ット部分を略示したものであり、この場合は、交差線で
区分された領域にのみ叙上の被膜を形成する。この領域
外の記録液の流路に於いては一方の(リード)電極11
−1.・・・。That is, FIG. 4 schematically shows the recording head portion in which the aforementioned U-shaped pattern is formed, and in this case, the above-mentioned film is formed only in the area divided by the intersecting lines. In the recording liquid flow path outside this area, one (lead) electrode 11
-1. ....
21−5が記録液に接することはないので、他方の電極
22−1.・・・、22−5が例え記録液と接触しても
、腐蝕を起こすことはない。21-5 does not come into contact with the recording liquid, the other electrode 22-1. ..., 22-5 will not be corroded even if it comes into contact with the recording liquid.
次に、第5図は、先述のり型パターンが形成された記録
ヘット部分を略示したものであり、この場合は、記録液
の流路に露出している電極24及び25−1.・・・、
25−5が完全に覆われるよう、図中、交差線で区分さ
れた全領域に叙上の被膜を形成する。Next, FIG. 5 schematically shows the recording head portion on which the glue-type pattern described above is formed, and in this case, the electrodes 24, 25-1. ...,
25-5 is completely covered, the above-mentioned coating is formed over the entire area divided by the intersecting lines in the figure.
尚、第4図及び第5図中では、第3図(a)。In addition, in FIG. 4 and FIG. 5, FIG. 3(a).
(b)中のものと同一の記号を付しである。The same symbols as those in (b) are attached.
そして夫々の説明も、第3図(a)、(b)に係る説明
を採用する。The respective explanations also adopt the explanations related to FIGS. 3(a) and 3(b).
以下、実施例によって、本発明を更に具体的に説明する
。Hereinafter, the present invention will be explained in more detail with reference to Examples.
実施例1〜11、比較例
先ず、以下の実施例及び比較例に相当する第4図示様の
発熱体設置基板を以下の要領で作成した。Examples 1 to 11, Comparative Example First, a heating element installation board as shown in FIG. 4, which corresponds to the following Examples and Comparative Examples, was prepared in the following manner.
アルミナ基板上に5i02蒸熱層(厚さ5μm)、Zr
B2発熱抵抗体層(厚さ800人)及びアルミニウム電
極層(厚さ5000人)を順次形成した後、選択エツチ
ングにより幅40μm、長さ200μmの発熱抵抗体パ
ターン23−1.・・・、23−5を形成した。又、エ
ツチングにより同幅のリード電極21−1.・・・。5i02 vaporized layer (thickness 5μm), Zr on alumina substrate
After sequentially forming the B2 heating resistor layer (800 layers thick) and the aluminum electrode layer (5000 layers thick), a heating resistor pattern 23-1 with a width of 40 μm and a length of 200 μm is formed by selective etching. ..., 23-5 was formed. Also, lead electrodes 21-1. of the same width are formed by etching. ....
21−5及び22−1.・・・、22−5を形成した。21-5 and 22-1. ..., 22-5 was formed.
以上の操作に加えて発熱抵抗体パターン23−1.・・
・、23−5の近傍には、5i02保護膜(厚さ1μ)
をスパッタリングにより設けた。In addition to the above operations, heating resistor pattern 23-1.・・・
・A 5i02 protective film (thickness 1μ) is placed near 23-5.
was provided by sputtering.
そして、第4図に於いて(交差線で示した)インク供給
の為の中継室に相当する領域には、下表−1及び下表−
2に記載どおりの(被膜)を夫々積層した。In FIG. 4, the areas corresponding to the relay chambers for ink supply (indicated by crossed lines) are shown in Table-1 below and Table-1 below.
(Coatings) as described in No. 2 were laminated.
又、これ等とは別に、ガラス板(厚さ1 mm)に、第
6図に示すような、発熱抵抗体パターンと同数、同ピツ
チの溝30(幅40μm、深さ40μm)とインク中継
室31となる溝とをマイクロカッターを用いて切削形成
してなる溝付きプレート32作成した。Separately, a glass plate (thickness: 1 mm) was provided with grooves 30 (width: 40 μm, depth: 40 μm) of the same number and pitch as the heating resistor pattern, as shown in FIG. 6, and an ink relay chamber. A grooved plate 32 was prepared by cutting grooves 31 using a micro cutter.
このようにして作成した、各発熱体設置基板と溝付プレ
ートとを、各発熱抵抗体パターンと溝との位置合せなし
た上で接合し、更に、不図示のインク供給部からのイン
ク中継室31にインクを導入するためのインク導入管3
3も接続して第7図に示すような記録ヘッドブロック3
4を一体的に完成した。Each heating element installation board and grooved plate created in this way are bonded after aligning each heating resistor pattern with the groove, and further, an ink relay chamber from an ink supply section (not shown) is connected. Ink introduction pipe 3 for introducing ink into 31
3 is also connected to form the recording head block 3 as shown in FIG.
Completed 4 in one.
更に、このブロック34には前述の電極、21−1.・
・・、21−5及び22−1.・・・。Furthermore, this block 34 includes the aforementioned electrodes, 21-1.・
..., 21-5 and 22-1. ....
22−5に接続されている電極リードを有するリード基
板が付設された。次いで、吐出実験条件・ とじて、
前記電極リードを介して発熱抵抗体パターンに10μS
eCのパルス巾、200μseCのパルス入力周期で4
0Vの矩形電圧パルスを印加した。因に、用いたインク
の組成は、
水 70重置部
ジエチレングリコール 29重量部
黒色染料 1重量部てあった。A lead board having electrode leads connected to 22-5 was attached. Next, the discharge experimental conditions were as follows:
10 μS to the heating resistor pattern through the electrode lead.
4 with a pulse width of eC and a pulse input period of 200μsecC.
A rectangular voltage pulse of 0V was applied. Incidentally, the composition of the ink used was 70 parts of water, 29 parts of diethylene glycol, and 1 part of black dye.
上記吐出実験条件およびインクを用いてインク摘吐出実
験を行ったところ、下表−1及び下表−2に示すとおり
、実施例では比較例に較べて記録ヘッドの耐久性におい
て優れた結果を得た。When an ink ejection experiment was conducted using the above ejection test conditions and ink, as shown in Tables 1 and 2 below, the examples obtained superior results in the durability of the recording head compared to the comparative examples. Ta.
また記録性においても優れていた。It was also excellent in recording performance.
なお、これ等の実施例及び比較例に於ける耐久性の評価
は、次のとおりインク滴吐出が応答する電気パルスの繰
返し印加可能回数により行った。The durability of these Examples and Comparative Examples was evaluated based on the number of times an electric pulse could be repeatedly applied to which the ink droplet ejection responded as follows.
A −−−−−−109回以上
耐久性評価基準 B −−−−−−108〜109回C
−−−−−−105回以下
以上の実施例からも、電極上の被膜の介在によって、記
録ヘッドの耐久性が格段に向上することが判る。A ------- 109 times or more Durability evaluation criteria B -------108 to 109 times C
------- It can also be seen from the examples of 105 times or less that the durability of the recording head is significantly improved by the presence of the coating on the electrodes.
因に、以上の説明に於いて示した発熱体としては、従来
広く感熱記録の分野に於いて用いられる感熱印字ヘッド
(つまり、サーマル・ヘッド)とほぼ同様のものを適用
することができる。それらは、作成方法、発熱抵抗体等
の差異により、厚膜ヘッド、薄膜ヘッド、半導体ヘッド
に分類されるが、本発明においてはそれらの全てが使用
可能である。但し、特に高速、高解像力の記録を行うと
きは、薄膜ヘッドを利用するのが今のところ望ましい。Incidentally, as the heating element shown in the above explanation, one almost the same as a thermal print head (that is, a thermal head) conventionally widely used in the field of thermal recording can be applied. They are classified into thick film heads, thin film heads, and semiconductor heads depending on the manufacturing method, heating resistor, etc., but all of them can be used in the present invention. However, it is currently preferable to use a thin film head, especially when performing high-speed, high-resolution recording.
又、本発明に於いて用いる記録用インクは、水、エタノ
ール等のアルコール、或はトルエン等を例とする主溶媒
に、エチレングリコール等を例とする湿潤剤、界面活性
剤及び各種染料等を溶解或は分散させて作成される。な
お、吐出オリフィスを詰らさないために作成後フィルタ
で濾過したり、インク流路中にフィルタを設けたりする
工夫は既存のインクジェット記録法の場合と同様に有効
なことである。Furthermore, the recording ink used in the present invention comprises a main solvent such as water, alcohol such as ethanol, or toluene, and a wetting agent such as ethylene glycol, a surfactant, various dyes, etc. It is created by dissolving or dispersing it. Note that in order to prevent clogging of the ejection orifice, it is effective to filter the ink after it is produced or to provide a filter in the ink flow path, as in the case of existing inkjet recording methods.
以上詳説したとおり、本発明によれば長期に亘ってイン
ク吐出が安定的に行われ、高速度で良品位の記録面を与
える高性能の液滴噴射記録装置に適用する記録ヘットを
提供することができる。As described in detail above, the present invention provides a recording head that can be applied to a high-performance droplet jet recording device that ejects ink stably over a long period of time and provides a high-quality recording surface at high speed. I can do it.
第1図及び第2図は本発明に係る液滴噴射記録装置の一
具体例とその液滴噴射原理を説明する為の略図、第3図
(a)及び第3図(b)は夫々本発明に係る発熱部と電
極との配置形態例を示す略画平面図、第4図及び第5図
は共に本発明の一実施例を説明する略画平面図、第6図
及び第7図は夫々本発明の他の実施例を説明する為の略
図である。
図に於いて2は発熱部、4′は室、5は吐出オリフィス
、8.21−1.・・・、21−5゜22−1.・・・
、22−5.24.25−1゜・・・、25−5は電極
、9は保護層、11は発熱抵抗体層、23−1・・・、
23−5.26−1゜・・・、26−5は発熱抵抗体パ
ターン、27.28はインク流路、30.31は溝、I
Kはインクである。1 and 2 are schematic diagrams for explaining a specific example of a droplet jet recording device according to the present invention and its droplet jetting principle, and FIGS. 3(a) and 3(b) are diagrams, respectively. FIGS. 4 and 5 are schematic plan views illustrating an example of the arrangement of the heat generating part and electrodes according to the invention, and FIGS. 6 and 7 are schematic plan views illustrating an embodiment of the present invention. 2A and 2B are schematic diagrams for explaining other embodiments of the present invention, respectively. In the figure, 2 is a heat generating part, 4' is a chamber, 5 is a discharge orifice, and 8.21-1. ..., 21-5°22-1. ...
, 22-5.24.25-1°..., 25-5 is an electrode, 9 is a protective layer, 11 is a heating resistor layer, 23-1...,
23-5.26-1°..., 26-5 is a heating resistor pattern, 27.28 is an ink flow path, 30.31 is a groove, I
K is ink.
Claims (1)
と、前記工程の後に焼付処理を行なって無機物の被膜を
形成する工程とを有する被膜の形成方法。(1) A method for forming a film, which includes a step of applying a raw material solution for forming an inorganic film, and a step of performing a baking treatment after the step to form an inorganic film.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61289184A JPS62156971A (en) | 1979-12-04 | 1986-12-04 | Forming of coated film |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15779579A JPS5680477A (en) | 1979-12-04 | 1979-12-04 | Liquid drop jet recording device |
JP61289184A JPS62156971A (en) | 1979-12-04 | 1986-12-04 | Forming of coated film |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15779579A Division JPS5680477A (en) | 1979-12-04 | 1979-12-04 | Liquid drop jet recording device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62156971A true JPS62156971A (en) | 1987-07-11 |
JPH0521074B2 JPH0521074B2 (en) | 1993-03-23 |
Family
ID=26485119
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61289184A Granted JPS62156971A (en) | 1979-12-04 | 1986-12-04 | Forming of coated film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62156971A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6323039U (en) * | 1986-07-29 | 1988-02-16 | ||
JPH01258979A (en) * | 1988-04-08 | 1989-10-16 | Canon Inc | Liquid jet recording method |
US5208611A (en) * | 1988-12-14 | 1993-05-04 | Mannesmann Aktiengesellschaft | Arrangement for heating the ink in the write head of an ink-jet printer |
EP0638602A1 (en) * | 1993-08-09 | 1995-02-15 | Hewlett-Packard Company | Poly-P-xylylene films as an orifice plate coating |
-
1986
- 1986-12-04 JP JP61289184A patent/JPS62156971A/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6323039U (en) * | 1986-07-29 | 1988-02-16 | ||
JPH01258979A (en) * | 1988-04-08 | 1989-10-16 | Canon Inc | Liquid jet recording method |
US5208611A (en) * | 1988-12-14 | 1993-05-04 | Mannesmann Aktiengesellschaft | Arrangement for heating the ink in the write head of an ink-jet printer |
EP0638602A1 (en) * | 1993-08-09 | 1995-02-15 | Hewlett-Packard Company | Poly-P-xylylene films as an orifice plate coating |
US5426458A (en) * | 1993-08-09 | 1995-06-20 | Hewlett-Packard Corporation | Poly-p-xylylene films as an orifice plate coating |
Also Published As
Publication number | Publication date |
---|---|
JPH0521074B2 (en) | 1993-03-23 |
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