JPS6120696A - Palladium brazing filler metal - Google Patents
Palladium brazing filler metalInfo
- Publication number
- JPS6120696A JPS6120696A JP13980484A JP13980484A JPS6120696A JP S6120696 A JPS6120696 A JP S6120696A JP 13980484 A JP13980484 A JP 13980484A JP 13980484 A JP13980484 A JP 13980484A JP S6120696 A JPS6120696 A JP S6120696A
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- palladium
- limit
- brazing
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、’７００〜８００“Ｃの低融点゛Ｃうり付け
ができるパラジウムろうに関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a palladium solder which can be applied with a low melting point of 700-800"C.
（従来技術とその問題点）
パラジウムろうは、銀ろうと比較して融点が高く、例え
ばＪＩＳ Ｂ Ｐｄ−１は低融点であるが、約８１
０°Ｃもある。このようにパラジウムろうは、融点が約
８１０〜１２３５°Ｃと他のろうに比較してろう付は温
度が高く、エネルギーの損失か大きい。(Prior art and its problems) Palladium solder has a higher melting point than silver solder. For example, JIS B Pd-1 has a low melting point, but it has a melting point of about 81
There is also a temperature of 0°C. As described above, palladium solder has a melting point of about 810 to 1235°C, which is higher than that of other solders, resulting in a large loss of energy.
また高温ろう付けとなるので、フラックスを用いてのろ
う付けが困難で、通常真空又は不活性ガス雰囲気中でろ
う付けしなければならない。さらに前記パラジウムろう
材は、チタン２チタン合金と同種材料若しくは異種材料
（軽合金を除く）とのろう付けに於いてろう付は継手の
強度が低いものであった。Furthermore, since high-temperature brazing is required, it is difficult to braze using flux, and brazing must normally be performed in a vacuum or inert gas atmosphere. Furthermore, when the palladium brazing material is used to braze a titanium-2 titanium alloy with the same type of material or a different type of material (excluding light alloys), the strength of the joint is low.
（発明の目的）
本発明は、斯かる問題を解消すべくなされたもので、ろ
う付は温度が低い、チタン、チタン合金のろう付けに於
いてろう付は強度を高くすることのできるパラジウムろ
うを提供することを目的とするものである。(Objective of the Invention) The present invention has been made to solve such problems.Brazing is performed at a low temperature, and when brazing titanium and titanium alloys, palladium brazing is used to increase the strength. The purpose is to provide the following.
（発明の構成）
本発明のパラジウムろうは、銀５〜３０重量％と、シリ
コン０．２５〜７重量％と、インジウム、すずの少なく
とも１種を合計で０．５〜１５重量％と、残部パラジウ
ムより成るものである。(Structure of the Invention) The palladium solder of the present invention contains 5 to 30% by weight of silver, 0.25 to 7% by weight of silicon, 0.5 to 15% by weight of at least one of indium and tin, and the balance being palladium. It consists of:
本発明のパラジウムろうに於いて、銀５〜３０重量％と
したのは、パラジウムの融点を下げる為で、５重量％未
満ではあまり融点か下がらず、３０重量％を超えると融
点は一層下がるが、反面特にチタン、チタン合金をろう
付けした際ろう中の銀が分離、析出してろう付は強度が
純銀の強度と同じになり、ろう付は継手の強度が低くな
るものである。In the palladium wax of the present invention, the reason why the silver content is 5 to 30% by weight is to lower the melting point of palladium.If it is less than 5% by weight, the melting point will not be lowered much, and if it exceeds 30% by weight, the melting point will further decrease. On the other hand, especially when titanium and titanium alloys are brazed, the silver in the solder separates and precipitates, and the strength of brazing becomes the same as that of pure silver, and the strength of the joint decreases.
シリコン０．２５〜７重量％とじたのは、ろうの融点を
大幅に下げ且つろうの流動性を良くする為で、０．２５
重量％未満ではろうの流動性と融点の低下を望めず、７
重量％を超えるとろう材を板、線などに加工することが
できなく、ろう付は後のろう付は継手も脆くなるもので
ある。The reason for adding 0.25 to 7% by weight of silicon is to significantly lower the melting point of the wax and improve the fluidity of the wax.
If it is less than 7% by weight, a decrease in the fluidity and melting point of the wax cannot be expected;
If the amount exceeds % by weight, the brazing material cannot be processed into plates, wires, etc., and the joint becomes brittle after brazing.
インジウム、すずの少なくとも１種を合計で０．５〜１
５重量％としたのは、ろうの融点を下げ、ぬれ性を増し
、銀の熔は分れを防ぐ為で、０．５重量％未満ではその
効果が無く、１５重量％を超えるとろう材が脆くなって
加工が困難となるからである。At least one of indium and tin in total of 0.5 to 1
The reason why the content is 5% by weight is to lower the melting point of the wax, increase its wettability, and prevent the silver melt from splitting.If it is less than 0.5% by weight, it will not have this effect, and if it exceeds 15% by weight, it will cause the brazing material to deteriorate. This is because it becomes brittle and difficult to process.
残部のパラジウムは、チタン、チタン合金及び鉄、銅、
ニッケルなどの異種材料に対して濡れ性が良く、耐食性
を有するので、必須の元素である。The remaining palladium is titanium, titanium alloys, iron, copper,
It is an essential element because it has good wettability with dissimilar materials such as nickel and has corrosion resistance.
（実施例）
本発明のパラジウムろうの実施例を従来品と対比して説
明する。(Example) An example of the palladium solder of the present invention will be described in comparison with a conventional product.
下記の表の左欄に示す成分組成の実施例１〜５のパラジ
ウムろうと従来品１〜３の固相線温度と液相線温度を測
定した処、下記の表の中央間に示すような結果を得た。The solidus temperature and liquidus temperature of the palladium waxes of Examples 1 to 5 and conventional products 1 to 3 having the component compositions shown in the left column of the table below were measured, and the results were as shown in the middle of the table below. I got it.
そしてこれらのろうにてチタン同志及びチタンとＳＯ３
３０４をアルゴンガス雰囲気中でろうの融点＋３０℃で
３分間保温してその後徐冷した。そのろう付は継手の剪
断試験片はＪＩＳ ２３１９４．４号試験片を用い、
ＪＩＳ ２３１９２ろう付は継手の剪断試験方法によ
って剪断強さを測定した処、下記の表の右欄に示すよう
な結果を得た。And in these waxes, titanium comrades and titanium and SO3
304 was kept warm for 3 minutes at the melting point of the wax +30°C in an argon gas atmosphere, and then slowly cooled. For the brazing, JIS 23194.4 test piece was used as the joint shear test piece.
For JIS 23192 brazing, the shear strength was measured using the joint shear test method, and the results shown in the right column of the table below were obtained.
（１）、下余白）
上記の表の中央間の固相線温度及び液相線温度で明らか
なように実施例１〜５のパラジウムろうは、融点か低い
とされている従来品１〜３のｔｙろうに比へても融点か
著しく低く、ろう付は温度か低いことが判る。また上記
の表の右（閘の剪断強さで明らかなように実施例１〜５
のパラジウムろうでろう付けしたろうイ」け４１１手は
、従来品１〜３の銀ろうでろ）付けしたろうＮけ継手に
比へて剪断強さが数倍用（、ろう付は強度か極めて高い
ことが判る。(1), bottom margin) As is clear from the solidus temperature and liquidus temperature between the centers of the table above, the palladium waxes of Examples 1 to 5 are conventional products 1 to 3, which are said to have a low melting point. It can be seen that the melting point is significantly lower than that of the brazing temperature, and the temperature for brazing is low. Also, on the right side of the table above (as is clear from the shear strength of the lock, Examples 1 to 5
Brazed N-brazed joints brazed with palladium braze have several times the shear strength compared to conventional brazed N-brazed joints brazed with silver braze (1 to 3). It turns out that it is expensive.
（発明の効果）
以」二の説明で判るように本発明のパラジウムろうは、
融点か低いので低融点ろうイ」けができて、エネルギー
Ｉｉｉ失か少なく、またチタン、チタン合金と同種斗Ａ
料若しくは異種材料（軽合金を除く）とのろう伺げに於
いてろう付は強度を数倍にも高めることができるという
優れた効果かある。(Effect of the invention) As can be seen from the explanation below, the palladium wax of the present invention has
Since the melting point is low, there is less risk of injury and energy loss, and the same type of metal as titanium and titanium alloys.
Brazing has the excellent effect of increasing the strength several times when joining materials or dissimilar materials (excluding light alloys).
Claims (1)
インジウム、すずの少なくとも１種を合計で０．５〜１
５重量％と、残部パラジウムより成るパラジウムろう。5-30% by weight of silver, 0.25-7% by weight of silicon,
At least one of indium and tin in total of 0.5 to 1
Palladium wax consisting of 5% by weight and the balance palladium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13980484A JPS6120696A (en) | 1984-07-06 | 1984-07-06 | Palladium brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13980484A JPS6120696A (en) | 1984-07-06 | 1984-07-06 | Palladium brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6120696A true JPS6120696A (en) | 1986-01-29 |
| JPH0349675B2 JPH0349675B2 (en) | 1991-07-30 |
Family
ID=15253819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13980484A Granted JPS6120696A (en) | 1984-07-06 | 1984-07-06 | Palladium brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120696A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103240540A (en) * | 2013-05-22 | 2013-08-14 | 哈尔滨工业大学 | Brazing filler metal for connecting SiO2 ceramic and SiO2 ceramic matrix composite materials and preparing method thereof |
-
1984
- 1984-07-06 JP JP13980484A patent/JPS6120696A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103240540A (en) * | 2013-05-22 | 2013-08-14 | 哈尔滨工业大学 | Brazing filler metal for connecting SiO2 ceramic and SiO2 ceramic matrix composite materials and preparing method thereof |
| CN103240540B (en) * | 2013-05-22 | 2015-08-19 | 哈尔滨工业大学 | A kind of for SiO 2pottery and SiO 2solder that ceramic matric composite connects and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0349675B2 (en) | 1991-07-30 |
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