JPS6024088A - Method of producing testing printed board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed circuit board for trial production and testing.

As a printed circuit board for prototyping and testing, electronic components such as engineering C are mounted on a printed circuit board, which conventionally uses a universal board with perforated lands formed on a basic grid, and their placement and energization tests are carried out. This universal board is used to test whether the circuit drawn on the drawing is actually effective.

In other words, components are mounted on the lands of the universal board, and wires are used between the lands and between the terminals of the components. Another method is to mount components onto a universal board on which frequently used power lines and the like are patterned in advance, and then wire wires between terminals of the components or between lands.

These conventional prototype and test printed circuit boards have many drawbacks as follows.

That is, since the terminals of the parts are connected with wires, manufacturing is extremely labor-intensive and requires a considerable amount of time. In addition, manual wiring is required,
Because the wiring is complicated and intersects between parts and lands, there are problems with the reliability of the finish, often leading to incorrect wiring. Furthermore, since space wiring is performed using wires, when conducting a current conduction test after prototyping and then performing actual printed wiring, an accurate amount of current cannot be obtained due to differences in the space wiring loss of the wires and the resistance of the printed wiring. There were many things.

The present invention eliminates all the drawbacks of the conventional printed circuit boards for prototyping and testing, and provides a method for fabricating printed circuit boards for prototyping and testing that can produce reliable printed circuit boards in half a period of time.

That is, the present invention creates a reference board by drilling holes on the basic lattice of a copper-clad laminate and plating wires through the holes, and then forming necessary circuits on the board using a circuit construction film and a hole connection wire construction film. After forming the photoresist, this reference board is etched to remove unnecessary null holes and unnecessary copper foil surfaces, and to create a circuit with detour connecting lines remaining around the large area of the necessary parts. This is a method for manufacturing a printed circuit board for trial production and testing, characterized by comprising:

Examples of the present invention will be described in detail below.

A board having regular holes is created by drilling holes on a 2.5411111 grid on a copper-clad laminate, and the holes are plated with copper. Next, a part of the connector is formed at the end using a conventional method, and an appropriate external shape is processed. The substrate thus created is used as a universal substrate.

A photoresist is formed on this universal substrate using the hole connection line forming film and the circuit forming film. The hole connecting line configuration F4/VJ uses a donut-shaped land arrangement film in which only the center point of the grid is punched out on the basic grid of 2.511 shoulders. This hole connection line configuration film and normal rotation rI! A resist layer is formed by overlapping the r-component films and baking or printing them on a universal printing plate. The circuit configuration film should be placed in the middle of run 1 to avoid removing copper adhesion on parts insertion lands and lands where front and back conduction is required.
The resist layer is formed by crushing the dots.

By etching the board on which the resist layer has been formed, lands with through-hole plating are obtained for parts insertion lands and lands that require front and back conductivity, as well as necessary circuits.On the other hand, lands that are inconvenient to have front and back conductivity can be obtained. Only the connecting lines around the lands remain so that the lands are connected only on one side, and the plating is removed from the through-hole portions of these lands.

The printed circuit board manufactured in this manner becomes energized as shown in the drawing. That is, a connector part 2 is formed on one side of a printed circuit board 1, and numerous regular through holes are present on the board 1. Front and back conductive lands 3 and detour connecting land 4 are formed on the substrate 1''2, and a circuit is formed by these as a whole. The front and back conductive lands 3 are left in places where parts need to be inserted and electrical connections between the front and back sides are required, and the detour connecting land 4 is formed in places where electrical connections are required only on one side. 3. The cross sections of these two lands are shown in Figures 3 and 4. In the case of front and back conductive lands, copper 6 appears on the through-hole surface, and the copper 6 on the inner surface of the board 5 and the circuit on the surface In contrast, in the case of the detour connecting line land 4, the surface of the board 5 is exposed on the through-hole surface and is insulated from the circuit copper 6 attached to the front and back surfaces. The detour connecting line land 4 forms a donut-shaped connecting line surrounding the null hole on its surface.

According to the method of the present invention, when obtaining a printed circuit board for prototyping or testing using a universal board, two types of lands are used: a front and back conductive land and a detour connecting land that forms a connecting line only on the surface along the required circuit. is selectively formed on the substrate. Therefore, it becomes possible to carry out energization tests and positioning prototypes simply by mounting components at designated positions on the printed circuit board. As a result, there is no need for wire wiring as in the past.
Moreover, problems such as incorrect wiring and poor reliability of current supply that occur in wire wiring are all eliminated.

Compared to conventional wire wiring on a universal board, which required about 10 days from prototyping to production, this method allows prototyping and production in one day. It has extremely high practical value.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a printed circuit board obtained by the present invention, FIG. 2 is an enlarged plan view of part A in FIG. It is a sectional view taken along the line X-X. 1, Printed circuit board 2, Connector part 31, Front and back conductive lands 4, Detour connecting line land 5, Base
Material 6. Copper patent applicant Shirai Electronics Industry Co., Ltd.

Claims (1)

[Claims] 1) Create a reference board by drilling holes on the basic lattice of the copper-clad laminate and plating the wires through the holes, and forming a photoresist for the necessary circuit on the board using a circuit configuration film and a hole connection line configuration film. After that, this standard board is etched to remove the necessary cine null holes and unnecessary copper foil surfaces, and to construct a circuit with detour connecting lines remaining around the large area of the necessary parts. A method for manufacturing a printed circuit board for testing, characterized by: