JPS60212900A - Semiconductor fixed memory - Google Patents
Semiconductor fixed memoryInfo
- Publication number
- JPS60212900A JPS60212900A JP59070414A JP7041484A JPS60212900A JP S60212900 A JPS60212900 A JP S60212900A JP 59070414 A JP59070414 A JP 59070414A JP 7041484 A JP7041484 A JP 7041484A JP S60212900 A JPS60212900 A JP S60212900A
- Authority
- JP
- Japan
- Prior art keywords
- cell block
- circuit
- memory cell
- rewriting
- blocks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Techniques For Improving Reliability Of Storages (AREA)
- Read Only Memory (AREA)
- For Increasing The Reliability Of Semiconductor Memories (AREA)
Abstract
Description
【発明の詳細な説明】
(技術分野)
本発明は書換え回数を増加しても信頼性の低下を招くこ
とのない電気的消去可能な半導体固定記憶装置(以下E
EPROMと称す)に関する。Detailed Description of the Invention (Technical Field) The present invention relates to an electrically erasable semiconductor fixed memory device (hereinafter referred to as E
(referred to as EPROM).
(従来技術)
従来、フローティフグゲート構造を有するEEPR,O
Mは、記憶用トラフ′)スタの制御ゲートに20V程度
の高電圧を印加し、トノネル効果によりドレイン上に形
成された薄い酸化膜を通して電子をドレインからフロー
ティフグゲートへ到達させることにより記憶を行ってい
る。このため高電圧印加の回数、いわゆる書換え回数が
増加すると薄い酸化膜が次第に劣化しついには破壊に到
る欠点を有していた。このためこのEEPROMは書き
換え頻度の高い応用には不向きであるという問題が6っ
た。(Prior art) Conventionally, EEPR,O having a floating puffer gate structure
M performs storage by applying a high voltage of about 20 V to the control gate of the memory trough star and causing electrons to reach the floating gate from the drain through a thin oxide film formed on the drain due to the Tononel effect. ing. Therefore, as the number of times high voltage is applied, that is, the number of rewrites increases, the thin oxide film gradually deteriorates and eventually breaks down. For this reason, this EEPROM is unsuitable for applications that require frequent rewriting.
(発明の目的)
本発明の目的は、このような欠点を解決し、チップ内部
に書換え回数判定回路を設け、ある規定書換回数以上に
なると予め準備された他のメモリセルブロックに切換え
ることにより、書換え頻度の高い回路にも使用できるよ
うにしたEEPROMを提供することにある。(Object of the Invention) An object of the present invention is to solve such drawbacks by providing a rewrite count determination circuit inside the chip, and switching to another memory cell block prepared in advance when the number of rewrites exceeds a certain predetermined number. An object of the present invention is to provide an EEPROM that can be used even in circuits that are frequently rewritten.
(発明の構成)
本発明のEEFROMは、複数に分割された電気的書換
可能なメモリセルブロックと、これらメモリセルブロッ
クのうちの1個への書換を選択しかつあるメモリセルブ
ロックへの書換回数が所定最大書換回数より大きくなっ
たことを判定して他のメモリセルブロックへ順次切換え
る書換回数判定回路と、前記各メモリセルブロックの各
出力を入力して外部出力端子に出力するOR回路とを含
み構成される。(Structure of the Invention) The EEFROM of the present invention includes an electrically rewritable memory cell block divided into a plurality of blocks, a memory cell block that is divided into a plurality of blocks, a memory cell block that is electrically rewritable, a memory cell block that can be rewritten, a memory cell block that can be rewritten, and a memory cell block that is rewritten to a memory cell block that can be rewritten. a rewrite count determination circuit that determines that the number of rewrites has become greater than a predetermined maximum number of rewrites and sequentially switches to other memory cell blocks; and an OR circuit that inputs each output of each memory cell block and outputs it to an external output terminal. Contains and consists of.
(実施例) 次に本発明を図面により詳細に説明する。(Example) Next, the present invention will be explained in detail with reference to the drawings.
第1図は本発明の実施例のブロック図である。FIG. 1 is a block diagram of an embodiment of the invention.
図において、1はメモリセル部分で、本実施例では10
0〜103の4ブロツクが準備されている。In the figure, 1 is a memory cell portion, and in this example, 10
Four blocks numbered 0 to 103 are prepared.
2は書換回数判定回路で、メモリセルブロック(以下セ
ルブロックと称す)に対応し4回路準備されている。ま
た、3はEEFROMの書込みおよび読出し動作を制御
するブロック、4は各々のセルブロックからのデータを
出力へ伝達するOR回路である。なお、その他メモリの
動作に必要なアドレスデコーダ、センスア/グ等は省略
している。Reference numeral 2 denotes a rewriting number determination circuit, of which four circuits are prepared corresponding to memory cell blocks (hereinafter referred to as cell blocks). Further, 3 is a block that controls write and read operations of the EEFROM, and 4 is an OR circuit that transmits data from each cell block to the output. Note that other components necessary for memory operation, such as an address decoder and a sense amplifier, are omitted.
次に主要ブロックの動作を説明する。書換回数判定回路
2は紫外線消去型EPROM に使用実績のおるフロー
ティングゲート構造のMOSトランジスタとアナログコ
ンパレータから構成されている。この回路2のMOSト
ランジスタのスレッシュホールド電圧VTRは、フロー
ティングゲートに加えられる電圧VPPと、印加回数N
および印加時間tに比例し、次式で表わ、される。Next, the operation of the main blocks will be explained. The number of rewrites determining circuit 2 is composed of a MOS transistor with a floating gate structure, which has been used in ultraviolet erasable EPROMs, and an analog comparator. The threshold voltage VTR of the MOS transistor of this circuit 2 is determined by the voltage VPP applied to the floating gate and the number of times of application N.
and is proportional to the application time t, and is expressed by the following equation.
VTR=f (vII)P r N + t )したが
ってゲート電圧Vpp の電圧値および印加時間tが一
定であれはスレッシュホールド電圧VTRは書換回数に
比例することになる。VTR=f (vII)P r N + t) Therefore, if the voltage value of the gate voltage Vpp and the application time t are constant, the threshold voltage VTR will be proportional to the number of rewrites.
本実施例の場合、メモリセルが破壊に到る最大書換回数
に対するマージンの程度を設定するものであるから、ス
レッシュホールド電圧VTHの精度すなわち書換え回数
検出の精度は必ずしも高い必要はない。In the case of this embodiment, since the degree of margin for the maximum number of rewrites before the memory cell is destroyed is set, the accuracy of the threshold voltage VTH, that is, the accuracy of detecting the number of rewrites, does not necessarily need to be high.
次に番号100.101.102.103の4ブロツク
に等分されているメモリセル1の各セルブロックは、書
換回数判定回路2により選択され、まfc4ブロックと
も同時にセルブロック内の同−ロクーションが外部から
アドレッシングされる構成となっている。Next, each cell block of the memory cell 1, which is equally divided into four blocks numbered 100, 101, 102, and 103, is selected by the rewrite count determination circuit 2, and the same location within the cell block is selected at the same time as the fc4 block. It is configured to be addressed from the outside.
いま、EEPROMの書換回数の最大値Nと設定してお
くと、セルブロック100のある番地でN回目の書換え
が終了した後は、次回からセルブロック101内の同一
番地が新たに選択される。If the maximum number of EEPROM rewrites is set to N, then after the Nth rewrite is completed at a certain address in the cell block 100, the same address in the cell block 101 will be newly selected next time.
具体的にバイト単位で書換えが行われている例について
第2図を用いて説明する。A specific example in which rewriting is performed in byte units will be explained using FIG. 2.
第2図は4ブロツク100〜103から成るEEROM
のメモリセル部の構成図であり、各々のセルブロック1
00〜103はう乃−ドx8ビットで構成されている。Figure 2 shows an EEROM consisting of four blocks 100 to 103.
2 is a configuration diagram of the memory cell section of each cell block 1.
00 to 103 are made up of 8 bits.
ここでセルブロック100 は最大書換回数N回使用済
のパターンの状態を示し、セルブロック101はN−z
回目の書込み後のパターンを示し、セルブロック102
.103は未使用状態を示している。このセルブロック
100で、AK番地のデータがN+1回目の書換対象に
選ばれたが、セルブロック100の最大書換回数Nを越
えているため、該当するワードAKのデータが0に消去
された後、セルブロック101 が選択され同一ワード
に書換希望のデータが書込まれることになる。第2図の
ROMバター/はこの状態を表わしている。Here, the cell block 100 indicates the state of a pattern that has been used for the maximum number of rewrites N times, and the cell block 101 indicates the state of the pattern that has been used for the maximum number of rewrites N times.
The pattern after the first write is shown in the cell block 102.
.. 103 indicates an unused state. In this cell block 100, the data at the AK address was selected to be rewritten the N+1st time, but since the maximum number of rewrites N for the cell block 100 has been exceeded, the data at the corresponding word AK is erased to 0, and then Cell block 101 is selected and data to be rewritten is written in the same word. ROM butter/ in FIG. 2 represents this state.
次に、書換えられるN+2回目から2N回までは、セル
ブロック101の各ワードの書換回数がNに達してなく
ても、指定されたアドレスに対応する8ビツトデータが
一旦消去された後、セルブロック102の対応するアド
レスにデータを書き込む。この制御はすべて書換回数検
出回路2と書込制御回路3によって自動的に行うことが
できる。Next, from the N+2 to 2N times of rewriting, even if the number of rewrites of each word in the cell block 101 has not reached N, the 8-bit data corresponding to the specified address is once erased, and then the cell block is rewritten. Write data to the corresponding address of 102. All of this control can be performed automatically by the rewrite count detection circuit 2 and the write control circuit 3.
このブロック内での書込前の一旦消去する方法について
は、既存のEEFROMに採用されているものが用いら
れる。As for the method of once erasing before writing in this block, the method employed in existing EEFROMs is used.
なお、データの続出しは、各セルブロック100〜10
3内の8ビツトデータがOR回路4に接続されているた
め、任意の有効データが出方される。Note that data continues to be output from each cell block 100 to 10.
Since the 8-bit data in 3 is connected to the OR circuit 4, any valid data is output.
これは、未使用のセルはすべてデータ「O」であり、1
旦セルブロツクで無効となったワードはデータ「0」に
消去されているからである。なお、以上の説明の中でメ
モリセルの消去状態は論理「0」とし、書込状態は論理
rIJと割当てている。This means that all unused cells have data "O" and 1
This is because the word once invalidated in the cell block is erased to data "0". In the above explanation, the erased state of the memory cell is assigned to logic "0", and the written state is assigned to logic rIJ.
(発明の効果)
以上説明した様に、本発明によれば、1ワードでも最大
書換回数Nを越える書換回数が与えられた場合には、そ
の後の書換えは新しいセルブロックを使用することによ
り制御回路が簡易化され、また書換えの制御をチップ内
部で自動的に処理するため、外部端子を増加させること
がなく、従来品種との端子互換性を有しながら実現でき
る。(Effects of the Invention) As explained above, according to the present invention, when even one word is rewritten more than the maximum number of rewrites N, subsequent rewriting is performed by using a new cell block, thereby controlling the control circuit. Moreover, since the rewriting control is automatically processed inside the chip, there is no need to increase the number of external terminals, and it can be realized while maintaining terminal compatibility with conventional products.
このように本発明によれば、EEPROMの書換回数を
予備セルブロックの数だけ増加させることができ、応用
分野の拡大が期待できる。As described above, according to the present invention, the number of times the EEPROM can be rewritten can be increased by the number of spare cell blocks, and the field of application can be expected to expand.
第1図は本発明の実施例の主要ブロック図、第2図は第
1図のメモリセルブロックのROMパターン図である。
図において
1・・・・・・メモリセルブロック、2・・・・・・書
換回数判定回路、3・・・・・・制御回路、4・・・・
・・08回路、100゜101.102.103・・・
・・・4等分されたセルブロック
である。FIG. 1 is a main block diagram of an embodiment of the present invention, and FIG. 2 is a ROM pattern diagram of the memory cell block of FIG. In the figure, 1... Memory cell block, 2... Rewriting number determination circuit, 3... Control circuit, 4...
...08 circuit, 100°101.102.103...
...It is a cell block divided into four equal parts.
Claims (1)
と、これらメモリセルブロックのうちの1個への書換を
選択しかつあるメモリセルブロックへの書換回数が所定
最大書換回数より大きくなったことを判定して他のメモ
リセルブロックへ順次切換える書換回数判定回路と、前
記各メモリセルブロックの各出力を入力して外部出方端
子に出力するOR回路とを含む半導体固定記憶装置。An electrically rewritable memory cell block that is divided into a plurality of blocks, and when rewriting to one of these memory cell blocks is selected and the number of rewrites to a certain memory cell block has become greater than a predetermined maximum number of rewrites. A semiconductor fixed memory device including a rewrite count determination circuit that determines and sequentially switches to another memory cell block, and an OR circuit that inputs each output of each of the memory cell blocks and outputs it to an external output terminal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59070414A JPS60212900A (en) | 1984-04-09 | 1984-04-09 | Semiconductor fixed memory |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59070414A JPS60212900A (en) | 1984-04-09 | 1984-04-09 | Semiconductor fixed memory |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS60212900A true JPS60212900A (en) | 1985-10-25 |
Family
ID=13430785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59070414A Pending JPS60212900A (en) | 1984-04-09 | 1984-04-09 | Semiconductor fixed memory |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60212900A (en) |
Cited By (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62283496A (en) * | 1986-05-31 | 1987-12-09 | Canon Inc | Management system for of number of times of writing programmable read only memory |
JPS62283497A (en) * | 1986-05-31 | 1987-12-09 | Canon Inc | Management system for of number of times of writing programmable read only memory |
JPS63292496A (en) * | 1987-05-25 | 1988-11-29 | Seiko Instr & Electronics Ltd | Semiconductor nonvolatile memory device |
JPS6462900A (en) * | 1987-09-02 | 1989-03-09 | Hitachi Ltd | Method for evaluating nonvolatile storage element and data processor using it |
JPH01109596A (en) * | 1987-10-22 | 1989-04-26 | Fuji Electric Co Ltd | Method for data writing in eeprom |
JPH0670119A (en) * | 1992-06-12 | 1994-03-11 | Ricoh Co Ltd | Facsimile equipment |
JPH06302194A (en) * | 1993-01-20 | 1994-10-28 | Canon Inc | Information processor |
JPH06338195A (en) * | 1993-05-31 | 1994-12-06 | Nec Corp | Device for managing number of writing times of electrically erasable nonvolatile memory |
US5568439A (en) * | 1988-06-08 | 1996-10-22 | Harari; Eliyahou | Flash EEPROM system which maintains individual memory block cycle counts |
US5602987A (en) * | 1989-04-13 | 1997-02-11 | Sandisk Corporation | Flash EEprom system |
US5838614A (en) * | 1995-07-31 | 1998-11-17 | Lexar Microsystems, Inc. | Identification and verification of a sector within a block of mass storage flash memory |
US5907856A (en) * | 1995-07-31 | 1999-05-25 | Lexar Media, Inc. | Moving sectors within a block of information in a flash memory mass storage architecture |
US5928370A (en) * | 1997-02-05 | 1999-07-27 | Lexar Media, Inc. | Method and apparatus for verifying erasure of memory blocks within a non-volatile memory structure |
US5930815A (en) * | 1995-07-31 | 1999-07-27 | Lexar Media, Inc. | Moving sequential sectors within a block of information in a flash memory mass storage architecture |
US6034897A (en) * | 1999-04-01 | 2000-03-07 | Lexar Media, Inc. | Space management for managing high capacity nonvolatile memory |
US6076137A (en) * | 1997-12-11 | 2000-06-13 | Lexar Media, Inc. | Method and apparatus for storing location identification information within non-volatile memory devices |
US6081878A (en) * | 1997-03-31 | 2000-06-27 | Lexar Media, Inc. | Increasing the memory performance of flash memory devices by writing sectors simultaneously to multiple flash memory devices |
US6115785A (en) * | 1995-07-31 | 2000-09-05 | Lexar Media, Inc. | Direct logical block addressing flash memory mass storage architecture |
US6122195A (en) * | 1997-03-31 | 2000-09-19 | Lexar Media, Inc. | Method and apparatus for decreasing block write operation times performed on nonvolatile memory |
US6125435A (en) * | 1995-09-13 | 2000-09-26 | Lexar Media, Inc. | Alignment of cluster address to block addresses within a semiconductor non-volatile mass storage memory |
US6141249A (en) * | 1999-04-01 | 2000-10-31 | Lexar Media, Inc. | Organization of blocks within a nonvolatile memory unit to effectively decrease sector write operation time |
US6262918B1 (en) | 1999-04-01 | 2001-07-17 | Lexar Media, Inc. | Space management for managing high capacity nonvolatile memory |
US6567307B1 (en) | 2000-07-21 | 2003-05-20 | Lexar Media, Inc. | Block management for mass storage |
US6813678B1 (en) | 1998-01-22 | 2004-11-02 | Lexar Media, Inc. | Flash memory system |
US6850443B2 (en) | 1991-09-13 | 2005-02-01 | Sandisk Corporation | Wear leveling techniques for flash EEPROM systems |
KR100485550B1 (en) * | 2001-10-29 | 2005-04-28 | 미쓰비시덴키 가부시키가이샤 | Nonvolatile semiconductor memory device with backup memory block |
US6898662B2 (en) | 2001-09-28 | 2005-05-24 | Lexar Media, Inc. | Memory system sectors |
US7492660B2 (en) | 1989-04-13 | 2009-02-17 | Sandisk Corporation | Flash EEprom system |
JP2011028793A (en) * | 2009-07-22 | 2011-02-10 | Toshiba Corp | Semiconductor memory device |
US8694722B2 (en) | 2001-09-28 | 2014-04-08 | Micron Technology, Inc. | Memory systems |
US9026721B2 (en) | 1995-07-31 | 2015-05-05 | Micron Technology, Inc. | Managing defective areas of memory |
US9032134B2 (en) | 2001-09-28 | 2015-05-12 | Micron Technology, Inc. | Methods of operating a memory system that include outputting a data pattern from a sector allocation table to a host if a logical sector is indicated as being erased |
US9213606B2 (en) | 2002-02-22 | 2015-12-15 | Micron Technology, Inc. | Image rescue |
US9576154B2 (en) | 2004-04-30 | 2017-02-21 | Micron Technology, Inc. | Methods of operating storage systems including using a key to determine whether a password can be changed |
-
1984
- 1984-04-09 JP JP59070414A patent/JPS60212900A/en active Pending
Cited By (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62283497A (en) * | 1986-05-31 | 1987-12-09 | Canon Inc | Management system for of number of times of writing programmable read only memory |
JPS62283496A (en) * | 1986-05-31 | 1987-12-09 | Canon Inc | Management system for of number of times of writing programmable read only memory |
JPS63292496A (en) * | 1987-05-25 | 1988-11-29 | Seiko Instr & Electronics Ltd | Semiconductor nonvolatile memory device |
JPS6462900A (en) * | 1987-09-02 | 1989-03-09 | Hitachi Ltd | Method for evaluating nonvolatile storage element and data processor using it |
JPH01109596A (en) * | 1987-10-22 | 1989-04-26 | Fuji Electric Co Ltd | Method for data writing in eeprom |
US5712819A (en) * | 1988-06-08 | 1998-01-27 | Harari; Eliyahou | Flash EEPROM system with storage of sector characteristic information within the sector |
US5909390A (en) * | 1988-06-08 | 1999-06-01 | Harari; Eliyahou | Techniques of programming and erasing an array of multi-state flash EEPROM cells including comparing the states of the cells to desired values |
US5862081A (en) * | 1988-06-08 | 1999-01-19 | Harari; Eliyahou | Multi-state flash EEPROM system with defect management including an error correction scheme |
US5568439A (en) * | 1988-06-08 | 1996-10-22 | Harari; Eliyahou | Flash EEPROM system which maintains individual memory block cycle counts |
US5835415A (en) * | 1988-06-08 | 1998-11-10 | Harari; Eliyahou | Flash EEPROM memory systems and methods of using them |
US5936971A (en) * | 1989-04-13 | 1999-08-10 | Sandisk Corporation | Multi-state flash EEprom system with cache memory |
US6373747B1 (en) | 1989-04-13 | 2002-04-16 | Sandisk Corporation | Flash EEprom system |
US7492660B2 (en) | 1989-04-13 | 2009-02-17 | Sandisk Corporation | Flash EEprom system |
US5602987A (en) * | 1989-04-13 | 1997-02-11 | Sandisk Corporation | Flash EEprom system |
US8040727B1 (en) | 1989-04-13 | 2011-10-18 | Sandisk Corporation | Flash EEprom system with overhead data stored in user data sectors |
US6850443B2 (en) | 1991-09-13 | 2005-02-01 | Sandisk Corporation | Wear leveling techniques for flash EEPROM systems |
US7353325B2 (en) | 1991-09-13 | 2008-04-01 | Sandisk Corporation | Wear leveling techniques for flash EEPROM systems |
JPH0670119A (en) * | 1992-06-12 | 1994-03-11 | Ricoh Co Ltd | Facsimile equipment |
JPH06302194A (en) * | 1993-01-20 | 1994-10-28 | Canon Inc | Information processor |
JPH06338195A (en) * | 1993-05-31 | 1994-12-06 | Nec Corp | Device for managing number of writing times of electrically erasable nonvolatile memory |
US6172906B1 (en) | 1995-07-31 | 2001-01-09 | Lexar Media, Inc. | Increasing the memory performance of flash memory devices by writing sectors simultaneously to multiple flash memory devices |
US6912618B2 (en) | 1995-07-31 | 2005-06-28 | Lexar Media, Inc. | Direct logical block addressing flash memory mass storage architecture |
US6115785A (en) * | 1995-07-31 | 2000-09-05 | Lexar Media, Inc. | Direct logical block addressing flash memory mass storage architecture |
US5838614A (en) * | 1995-07-31 | 1998-11-17 | Lexar Microsystems, Inc. | Identification and verification of a sector within a block of mass storage flash memory |
US5907856A (en) * | 1995-07-31 | 1999-05-25 | Lexar Media, Inc. | Moving sectors within a block of information in a flash memory mass storage architecture |
US6128695A (en) * | 1995-07-31 | 2000-10-03 | Lexar Media, Inc. | Identification and verification of a sector within a block of mass storage flash memory |
US6393513B2 (en) | 1995-07-31 | 2002-05-21 | Lexar Media, Inc. | Identification and verification of a sector within a block of mass storage flash memory |
US9026721B2 (en) | 1995-07-31 | 2015-05-05 | Micron Technology, Inc. | Managing defective areas of memory |
US6145051A (en) * | 1995-07-31 | 2000-11-07 | Lexar Media, Inc. | Moving sectors within a block of information in a flash memory mass storage architecture |
US5930815A (en) * | 1995-07-31 | 1999-07-27 | Lexar Media, Inc. | Moving sequential sectors within a block of information in a flash memory mass storage architecture |
US6223308B1 (en) | 1995-07-31 | 2001-04-24 | Lexar Media, Inc. | Identification and verification of a sector within a block of mass STO rage flash memory |
US6125435A (en) * | 1995-09-13 | 2000-09-26 | Lexar Media, Inc. | Alignment of cluster address to block addresses within a semiconductor non-volatile mass storage memory |
US5928370A (en) * | 1997-02-05 | 1999-07-27 | Lexar Media, Inc. | Method and apparatus for verifying erasure of memory blocks within a non-volatile memory structure |
US6081878A (en) * | 1997-03-31 | 2000-06-27 | Lexar Media, Inc. | Increasing the memory performance of flash memory devices by writing sectors simultaneously to multiple flash memory devices |
US6122195A (en) * | 1997-03-31 | 2000-09-19 | Lexar Media, Inc. | Method and apparatus for decreasing block write operation times performed on nonvolatile memory |
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