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JPS6473631A - Integrated circuit device - Google Patents

Integrated circuit device

Info

Publication number
JPS6473631A
JPS6473631A JP62231604A JP23160487A JPS6473631A JP S6473631 A JPS6473631 A JP S6473631A JP 62231604 A JP62231604 A JP 62231604A JP 23160487 A JP23160487 A JP 23160487A JP S6473631 A JPS6473631 A JP S6473631A
Authority
JP
Japan
Prior art keywords
probe
terminal
probes
positioning
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62231604A
Other languages
Japanese (ja)
Other versions
JPH06105733B2 (en
Inventor
Masaru Katagiri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP62231604A priority Critical patent/JPH06105733B2/en
Publication of JPS6473631A publication Critical patent/JPS6473631A/en
Publication of JPH06105733B2 publication Critical patent/JPH06105733B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To provide good contact with probes by so providing a positioning terminal in contact with a probe separately from a terminal as to accurately bring a probe for an electric test into contact with an input/output terminal and power supply terminal. CONSTITUTION:A terminal 11 for input/output signal and supplying power source and positioning terminals 13, 14, 15, 16 of probes 12 provided at the four corners of an LSI chip 10 are provided on an LSI chip 10. Here, first, second, third and fourth positioning probes 23, 24, 25, 26 corresponding to the terminals 13, 14, 15, 16 are prepared. In case of an electric test for an LSI, an open monitor 17 is connected from the probe 23 to the probe 26, and the probes 24, 25 are directly shortcircuited. In this case, a closed loop of the probe 23, a buried layer 21, the probe 24, the probe 25, a buried layer 22, and the probe 26 is formed through the monitor 17.
JP62231604A 1987-09-14 1987-09-14 Integrated circuit device Expired - Lifetime JPH06105733B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62231604A JPH06105733B2 (en) 1987-09-14 1987-09-14 Integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62231604A JPH06105733B2 (en) 1987-09-14 1987-09-14 Integrated circuit device

Publications (2)

Publication Number Publication Date
JPS6473631A true JPS6473631A (en) 1989-03-17
JPH06105733B2 JPH06105733B2 (en) 1994-12-21

Family

ID=16926115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62231604A Expired - Lifetime JPH06105733B2 (en) 1987-09-14 1987-09-14 Integrated circuit device

Country Status (1)

Country Link
JP (1) JPH06105733B2 (en)

Also Published As

Publication number Publication date
JPH06105733B2 (en) 1994-12-21

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