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JPS6436041A - Noncontact wafer transfer mechanism - Google Patents

Noncontact wafer transfer mechanism

Info

Publication number
JPS6436041A
JPS6436041A JP19211287A JP19211287A JPS6436041A JP S6436041 A JPS6436041 A JP S6436041A JP 19211287 A JP19211287 A JP 19211287A JP 19211287 A JP19211287 A JP 19211287A JP S6436041 A JPS6436041 A JP S6436041A
Authority
JP
Japan
Prior art keywords
wafer
feed part
floated
plate
noncontact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19211287A
Other languages
Japanese (ja)
Inventor
Yutaka Ueda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19211287A priority Critical patent/JPS6436041A/en
Publication of JPS6436041A publication Critical patent/JPS6436041A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reciprocating Conveyors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE:To reduce a dust particle adhering to the rear of a wafer by a method wherein, during a transfer operation of the wafer, the air is blown and the wafer is floated and does not come into contact with a plate. CONSTITUTION:A wafer 1 is positioned and is set on the bringing-in side of a plate 5; the wafer 1 is sucked to the plate 5 through vacuum holes 3 for wafer suction use. In this state, claws 2a, 2b of a feed part 2 are arranged at a front end and a rear end of the wafer 1; the feed part 2 is raised to a wafer-holding height position h and is on standby. Then, the vacuum holes 3 for wafer suction use are released; the air is blown to the rear of the wafer 1 from blow-off holes 4; the wafer 1 is floated up to the wafer-holding height position h of the feed part 2; while the floated wafer 1 is held by using the claws 2a, 2b of the feed part 2, the wafer 1 is transferred to its destination along the plate 5 by using the feed part 2 while it is floated in a noncontact state.
JP19211287A 1987-07-31 1987-07-31 Noncontact wafer transfer mechanism Pending JPS6436041A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19211287A JPS6436041A (en) 1987-07-31 1987-07-31 Noncontact wafer transfer mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19211287A JPS6436041A (en) 1987-07-31 1987-07-31 Noncontact wafer transfer mechanism

Publications (1)

Publication Number Publication Date
JPS6436041A true JPS6436041A (en) 1989-02-07

Family

ID=16285863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19211287A Pending JPS6436041A (en) 1987-07-31 1987-07-31 Noncontact wafer transfer mechanism

Country Status (1)

Country Link
JP (1) JPS6436041A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003086917A1 (en) * 2002-04-18 2003-10-23 Olympus Corporation Substrate conveying device
JP2004168496A (en) * 2002-11-20 2004-06-17 Kawaju Plant Kk Vertical type conveyance apparatus for plate-shaped material
JP2006210393A (en) * 2005-01-25 2006-08-10 Dainippon Printing Co Ltd Substrate processing apparatus, substrate transfer apparatus and substrate control method
JP2007246287A (en) * 2007-05-28 2007-09-27 Kawasaki Plant Systems Ltd Vertical conveyance apparatus for plate material
JP2008195541A (en) * 2008-03-31 2008-08-28 Watanabe Shoko:Kk Floatation transport device and floatation transport system
JP2008300778A (en) * 2007-06-04 2008-12-11 Sumco Corp Silicon wafer carrier
JP2010260658A (en) * 2009-04-30 2010-11-18 Gunma Prefecture Conveyance device
WO2010145787A1 (en) * 2009-06-19 2010-12-23 Rena Gmbh Process module for the inline-treatment of substrates
KR101341208B1 (en) * 2011-02-15 2013-12-12 박봉선 Pneumatic Apparatus For Floating And Translating Plates
CN109311606A (en) * 2016-06-21 2019-02-05 科福罗有限公司 Non-contact support platforms with edge lift
CN114678310A (en) * 2022-02-16 2022-06-28 上海普达特半导体设备有限公司 Wafer transmission device

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009033214A (en) * 2002-04-18 2009-02-12 Olympus Corp Substrate conveying device
KR100848229B1 (en) * 2002-04-18 2008-07-24 올림푸스 가부시키가이샤 Substrate conveying device
WO2003086917A1 (en) * 2002-04-18 2003-10-23 Olympus Corporation Substrate conveying device
KR100848228B1 (en) * 2002-04-18 2008-07-24 올림푸스 가부시키가이샤 Substrate conveying device
JP2004168496A (en) * 2002-11-20 2004-06-17 Kawaju Plant Kk Vertical type conveyance apparatus for plate-shaped material
JP2006210393A (en) * 2005-01-25 2006-08-10 Dainippon Printing Co Ltd Substrate processing apparatus, substrate transfer apparatus and substrate control method
JP2007246287A (en) * 2007-05-28 2007-09-27 Kawasaki Plant Systems Ltd Vertical conveyance apparatus for plate material
JP2008300778A (en) * 2007-06-04 2008-12-11 Sumco Corp Silicon wafer carrier
JP2008195541A (en) * 2008-03-31 2008-08-28 Watanabe Shoko:Kk Floatation transport device and floatation transport system
JP2010260658A (en) * 2009-04-30 2010-11-18 Gunma Prefecture Conveyance device
WO2010145787A1 (en) * 2009-06-19 2010-12-23 Rena Gmbh Process module for the inline-treatment of substrates
KR101414969B1 (en) * 2009-06-19 2014-07-02 실트로닉 아게 Process module for the inline-treatment of substrates
KR101341208B1 (en) * 2011-02-15 2013-12-12 박봉선 Pneumatic Apparatus For Floating And Translating Plates
CN109311606A (en) * 2016-06-21 2019-02-05 科福罗有限公司 Non-contact support platforms with edge lift
CN114678310A (en) * 2022-02-16 2022-06-28 上海普达特半导体设备有限公司 Wafer transmission device
CN114678310B (en) * 2022-02-16 2023-12-22 上海普达特半导体设备有限公司 Wafer transmission device

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