JPS6457633A - Suction transfer device - Google Patents
Suction transfer deviceInfo
- Publication number
- JPS6457633A JPS6457633A JP21455787A JP21455787A JPS6457633A JP S6457633 A JPS6457633 A JP S6457633A JP 21455787 A JP21455787 A JP 21455787A JP 21455787 A JP21455787 A JP 21455787A JP S6457633 A JPS6457633 A JP S6457633A
- Authority
- JP
- Japan
- Prior art keywords
- transferred
- suction
- mounting surface
- transfer
- flexible material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Automatic Assembly (AREA)
- Manipulator (AREA)
Abstract
PURPOSE:To make it possible to suck an object to be transferred with sufficient suction force even if the object has warp, and transfer it, by setting a suction pad with an suction hole at a position higher than the mounting surface for the object to be transferred, and forming the pad by using flexible material. CONSTITUTION:In a transfer device which transfers objects to be transferred, and suction pad 36 having an suction hole is settled at a position higher than the mounting surface 32 for the object to be transferred, and constituted by using flexible material. For example, a transfer chuck 30 of nearly a horizontal U-shape and an alignment stage 24 are installed. The former sucks by the use of vacuum the object to be transferred on the mounting surface 32 and transfers it. The latter is arranged on the transfer path of the transfer chuck 30 so as to be able to ascend and descend and to freely rotate, and ascends via a central notched part 31 of the transfer chuck 30 to receive the object to be transferred. The object to be transferred is sucked by the use of vacuum to the alignment stage 24, which aligns the object to be transferred. The suction pad 36 is constituted by using flexible material possessing a suction surface at a position a little higher than the mounting surface 32. In the transfer chuck 30, the suction pads 36 are at least arranged at two positions of the mounting surface 32 of nearly a horizontal U-shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21455787A JPH0630370B2 (en) | 1987-08-27 | 1987-08-27 | Probe device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21455787A JPH0630370B2 (en) | 1987-08-27 | 1987-08-27 | Probe device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6457633A true JPS6457633A (en) | 1989-03-03 |
JPH0630370B2 JPH0630370B2 (en) | 1994-04-20 |
Family
ID=16657696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21455787A Expired - Lifetime JPH0630370B2 (en) | 1987-08-27 | 1987-08-27 | Probe device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0630370B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6075372A (en) * | 1984-09-04 | 1985-04-27 | セイレイ工業株式会社 | Receiving trough for cylinder selecting rice huller |
JP2001205586A (en) * | 2000-01-28 | 2001-07-31 | Myotoku Ltd | Suction pad |
US20110025344A1 (en) * | 2007-11-26 | 2011-02-03 | Tokyo Electron Limited | Holding member for use in test and method for manufacturing same |
JP2014229696A (en) * | 2013-05-21 | 2014-12-08 | 三菱電機株式会社 | Evaluation device of semiconductor device |
JP2018134688A (en) * | 2017-02-20 | 2018-08-30 | パナソニックIpマネジメント株式会社 | Work device and cable holding tool |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6151310U (en) * | 1984-09-11 | 1986-04-07 |
-
1987
- 1987-08-27 JP JP21455787A patent/JPH0630370B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6151310U (en) * | 1984-09-11 | 1986-04-07 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6075372A (en) * | 1984-09-04 | 1985-04-27 | セイレイ工業株式会社 | Receiving trough for cylinder selecting rice huller |
JP2001205586A (en) * | 2000-01-28 | 2001-07-31 | Myotoku Ltd | Suction pad |
US20110025344A1 (en) * | 2007-11-26 | 2011-02-03 | Tokyo Electron Limited | Holding member for use in test and method for manufacturing same |
JP2014229696A (en) * | 2013-05-21 | 2014-12-08 | 三菱電機株式会社 | Evaluation device of semiconductor device |
US9551745B2 (en) | 2013-05-21 | 2017-01-24 | Mitsubishi Electric Corporation | Semiconductor device assessment apparatus |
JP2018134688A (en) * | 2017-02-20 | 2018-08-30 | パナソニックIpマネジメント株式会社 | Work device and cable holding tool |
Also Published As
Publication number | Publication date |
---|---|
JPH0630370B2 (en) | 1994-04-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6473625A (en) | Arranging method for solder spheres | |
EP0297138A4 (en) | Gantry for tomograph. | |
JPS6457633A (en) | Suction transfer device | |
EP0381401A3 (en) | Image forming apparatus | |
CA2171221A1 (en) | Apparatus and method for positioning glass sheets | |
CA2053047A1 (en) | Device For Use in Positioning an Article Precisely in a Desired Location | |
JPS6421924A (en) | Resist dropping apparatus | |
MY136228A (en) | "ic socket" | |
CN216069439U (en) | Assembling equipment for mounting and transferring | |
JPS5583239A (en) | Mounting tip element | |
JPS55128817A (en) | Device for bonding piece on tape | |
JPS6411744A (en) | Workpiece holding device | |
JPS5511345A (en) | Lead frame transport device in semiconductor inner connection device | |
JPS5415285A (en) | Device for driving handrails of man conveyor | |
JPS6462230A (en) | Work transfer device in pressing device | |
JPS6461033A (en) | Device for mounting chip | |
JPS6484163A (en) | Test handler for semiconductor device | |
FR2453084A1 (en) | Transfer table for glass or fragile objects - has number of pads with felt tops to support glass lowered from forks between pads | |
JPS6468894A (en) | Fingerprint image input device | |
JPS56161237A (en) | Separating device for tightly piled platelike body | |
JPS6468938A (en) | Removal of defective semiconductor element | |
DE3564244D1 (en) | Envelope delivery device | |
JPS53140760A (en) | Vacuum adsorption lifting device | |
JPS5447582A (en) | Mask aligner | |
JPS5288090A (en) | Vacuum pincette |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080420 Year of fee payment: 14 |