Nothing Special   »   [go: up one dir, main page]

JPS5375859A - Glass sealing semiconductor - Google Patents

Glass sealing semiconductor

Info

Publication number
JPS5375859A
JPS5375859A JP15091476A JP15091476A JPS5375859A JP S5375859 A JPS5375859 A JP S5375859A JP 15091476 A JP15091476 A JP 15091476A JP 15091476 A JP15091476 A JP 15091476A JP S5375859 A JPS5375859 A JP S5375859A
Authority
JP
Japan
Prior art keywords
glass sealing
sealing semiconductor
cavity
chip
packaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15091476A
Other languages
Japanese (ja)
Other versions
JPS5949695B2 (en
Inventor
Shunji Koike
Hajime Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15091476A priority Critical patent/JPS5949695B2/en
Publication of JPS5375859A publication Critical patent/JPS5375859A/en
Publication of JPS5949695B2 publication Critical patent/JPS5949695B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To lower the cost of packaging and reduce wire disconnections by increasing the cavity of a base member to contain a semiconductor chip to about the cavity of a cap member and performing bonding of other end of the connecting wires whose one end is connected to the chip to the inside end of lead-out leads in the intended glass sealing positions.
COPYRIGHT: (C)1978,JPO&Japio
JP15091476A 1976-12-17 1976-12-17 Manufacturing method for glass-sealed semiconductor devices Expired JPS5949695B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15091476A JPS5949695B2 (en) 1976-12-17 1976-12-17 Manufacturing method for glass-sealed semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15091476A JPS5949695B2 (en) 1976-12-17 1976-12-17 Manufacturing method for glass-sealed semiconductor devices

Publications (2)

Publication Number Publication Date
JPS5375859A true JPS5375859A (en) 1978-07-05
JPS5949695B2 JPS5949695B2 (en) 1984-12-04

Family

ID=15507143

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15091476A Expired JPS5949695B2 (en) 1976-12-17 1976-12-17 Manufacturing method for glass-sealed semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5949695B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908086A (en) * 1985-06-24 1990-03-13 National Semiconductor Corporation Low-cost semiconductor device package process
JPH02127039U (en) * 1989-03-29 1990-10-19
EP0588944A1 (en) 1991-06-05 1994-03-30 Algernon Promotions, Inc. An improved miniature transponder device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4908086A (en) * 1985-06-24 1990-03-13 National Semiconductor Corporation Low-cost semiconductor device package process
JPH02127039U (en) * 1989-03-29 1990-10-19
EP0588944A1 (en) 1991-06-05 1994-03-30 Algernon Promotions, Inc. An improved miniature transponder device

Also Published As

Publication number Publication date
JPS5949695B2 (en) 1984-12-04

Similar Documents

Publication Publication Date Title
CA1021864A (en) Liquid encapsulated integrated circuit package
CA1017071A (en) Plastic power semiconductor flip chip package
JPS5282183A (en) Connecting wires for semiconductor devices
CA1021066A (en) Semiconductor chip interconnect package
JPS5375859A (en) Glass sealing semiconductor
JPS5348463A (en) Semiconductor integrated circuit support
JPS5785244A (en) Semiconductor device
JPS5751928B2 (en)
JPS5345987A (en) Semiconductor integrated circuit element
JPS5348461A (en) Wire bonder
JPS5348671A (en) Electrode structure of semiconductor element
JPS5368573A (en) Hermetic sealing method of semiconductor device
JPS5280780A (en) Semiconductor device
JPS5240974A (en) Package for semiconductor chips
JPS5250167A (en) Semiconductor device
JPS57194559A (en) Semicondcutor device
JPS5385160A (en) Production of semiconductor device
JPS5374368A (en) Package for semiconductor device
JPS5375763A (en) Manufacture for semiconductor device
JPS5246770A (en) Method of assembling semiconductor device and lead frame used for same
JPS5323563A (en) Semiconductor device
JPS5417668A (en) Glass-sealed diode
JPS5315049A (en) Monostable multivibrator circuit
JPS52112296A (en) Josephson element unit
JPS53129968A (en) Ceramic package type semiconductor device and production of the same