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JPS5348463A - Semiconductor integrated circuit support - Google Patents

Semiconductor integrated circuit support

Info

Publication number
JPS5348463A
JPS5348463A JP12321876A JP12321876A JPS5348463A JP S5348463 A JPS5348463 A JP S5348463A JP 12321876 A JP12321876 A JP 12321876A JP 12321876 A JP12321876 A JP 12321876A JP S5348463 A JPS5348463 A JP S5348463A
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
circuit support
support
thickner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12321876A
Other languages
Japanese (ja)
Inventor
Shinji Wada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAMASAWA KOGYO KK
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
HAMASAWA KOGYO KK
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAMASAWA KOGYO KK, Seiko Epson Corp, Suwa Seikosha KK filed Critical HAMASAWA KOGYO KK
Priority to JP12321876A priority Critical patent/JPS5348463A/en
Publication of JPS5348463A publication Critical patent/JPS5348463A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To improve the bondability at the multipoint bonding by making the shape of the ends of the lead wires of an IC support spherical, thickner than other portions.
COPYRIGHT: (C)1978,JPO&Japio
JP12321876A 1976-10-14 1976-10-14 Semiconductor integrated circuit support Pending JPS5348463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12321876A JPS5348463A (en) 1976-10-14 1976-10-14 Semiconductor integrated circuit support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12321876A JPS5348463A (en) 1976-10-14 1976-10-14 Semiconductor integrated circuit support

Publications (1)

Publication Number Publication Date
JPS5348463A true JPS5348463A (en) 1978-05-01

Family

ID=14855112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12321876A Pending JPS5348463A (en) 1976-10-14 1976-10-14 Semiconductor integrated circuit support

Country Status (1)

Country Link
JP (1) JPS5348463A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352366A (en) * 1976-10-23 1978-05-12 Seiko Epson Corp Packaging method of semiconductor device
JPS5352365A (en) * 1976-10-23 1978-05-12 Seiko Epson Corp Semiconductor device
JPS5619632A (en) * 1979-07-26 1981-02-24 Seiko Epson Corp Lead terminal
JPS63187641A (en) * 1987-01-30 1988-08-03 Sony Corp Manufacture of metallic lead with bump

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352366A (en) * 1976-10-23 1978-05-12 Seiko Epson Corp Packaging method of semiconductor device
JPS5352365A (en) * 1976-10-23 1978-05-12 Seiko Epson Corp Semiconductor device
JPS5619632A (en) * 1979-07-26 1981-02-24 Seiko Epson Corp Lead terminal
JPS63187641A (en) * 1987-01-30 1988-08-03 Sony Corp Manufacture of metallic lead with bump

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