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JPS5373067A - Polisher - Google Patents

Polisher

Info

Publication number
JPS5373067A
JPS5373067A JP14870076A JP14870076A JPS5373067A JP S5373067 A JPS5373067 A JP S5373067A JP 14870076 A JP14870076 A JP 14870076A JP 14870076 A JP14870076 A JP 14870076A JP S5373067 A JPS5373067 A JP S5373067A
Authority
JP
Japan
Prior art keywords
polisher
polyoxy
benzoyl
polymer
achieve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14870076A
Other languages
Japanese (ja)
Other versions
JPS5527593B2 (en
Inventor
Shojiro Miyake
Toshiro Karaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP14870076A priority Critical patent/JPS5373067A/en
Publication of JPS5373067A publication Critical patent/JPS5373067A/en
Publication of JPS5527593B2 publication Critical patent/JPS5527593B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PURPOSE:To achieve the surface works of high precision and high quality by forming a polisher surface of the surface mainly composed of a polyoxy-benzoyl polymer.
JP14870076A 1976-12-13 1976-12-13 Polisher Granted JPS5373067A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14870076A JPS5373067A (en) 1976-12-13 1976-12-13 Polisher

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14870076A JPS5373067A (en) 1976-12-13 1976-12-13 Polisher

Publications (2)

Publication Number Publication Date
JPS5373067A true JPS5373067A (en) 1978-06-29
JPS5527593B2 JPS5527593B2 (en) 1980-07-22

Family

ID=15458633

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14870076A Granted JPS5373067A (en) 1976-12-13 1976-12-13 Polisher

Country Status (1)

Country Link
JP (1) JPS5373067A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56121565U (en) * 1981-01-22 1981-09-16
JPS59201755A (en) * 1983-04-28 1984-11-15 Ntn Toyo Bearing Co Ltd Material for lapping tool
JPS6248023A (en) * 1985-08-28 1987-03-02 Shibayama Kikai Kk Clothless polishing method of semiconductor wafer
JPS63212464A (en) * 1987-02-26 1988-09-05 Nikko Rika Kk Polishing board
JPH0234925A (en) * 1988-04-20 1990-02-05 Fujitsu Ltd Manufacture of semiconductor device
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
JP2016104511A (en) * 2011-11-29 2016-06-09 ネクスプラナー コーポレイション Polishing pad having ground layer and polishing surface layer
JP2016120568A (en) * 2014-12-25 2016-07-07 三島光産株式会社 Polishing pad and polishing method using the same

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56121565U (en) * 1981-01-22 1981-09-16
JPS639406Y2 (en) * 1981-01-22 1988-03-19
JPS59201755A (en) * 1983-04-28 1984-11-15 Ntn Toyo Bearing Co Ltd Material for lapping tool
JPS6248023A (en) * 1985-08-28 1987-03-02 Shibayama Kikai Kk Clothless polishing method of semiconductor wafer
JPS63212464A (en) * 1987-02-26 1988-09-05 Nikko Rika Kk Polishing board
JPH0234925A (en) * 1988-04-20 1990-02-05 Fujitsu Ltd Manufacture of semiconductor device
US6121143A (en) * 1997-09-19 2000-09-19 3M Innovative Properties Company Abrasive articles comprising a fluorochemical agent for wafer surface modification
JP2016104511A (en) * 2011-11-29 2016-06-09 ネクスプラナー コーポレイション Polishing pad having ground layer and polishing surface layer
JP2016120568A (en) * 2014-12-25 2016-07-07 三島光産株式会社 Polishing pad and polishing method using the same

Also Published As

Publication number Publication date
JPS5527593B2 (en) 1980-07-22

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