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JPS5299847A - Thickness measurement using ultrasonic waves - Google Patents

Thickness measurement using ultrasonic waves

Info

Publication number
JPS5299847A
JPS5299847A JP1682576A JP1682576A JPS5299847A JP S5299847 A JPS5299847 A JP S5299847A JP 1682576 A JP1682576 A JP 1682576A JP 1682576 A JP1682576 A JP 1682576A JP S5299847 A JPS5299847 A JP S5299847A
Authority
JP
Japan
Prior art keywords
ultrasonic waves
thickness measurement
thickness
accomplish
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1682576A
Other languages
Japanese (ja)
Inventor
Susumu Ihara
Yuzo Otawara
Tokuo Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP1682576A priority Critical patent/JPS5299847A/en
Publication of JPS5299847A publication Critical patent/JPS5299847A/en
Pending legal-status Critical Current

Links

Landscapes

  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)

Abstract

PURPOSE: To accomplish the correct measurement of the thickness of an insulating layer on a conductor in a cooling water bath immediately after the production of a wire or cable by taking a mean value among several measured values excepting abnormal values.
COPYRIGHT: (C)1977,JPO&Japio
JP1682576A 1976-02-17 1976-02-17 Thickness measurement using ultrasonic waves Pending JPS5299847A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1682576A JPS5299847A (en) 1976-02-17 1976-02-17 Thickness measurement using ultrasonic waves

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1682576A JPS5299847A (en) 1976-02-17 1976-02-17 Thickness measurement using ultrasonic waves

Publications (1)

Publication Number Publication Date
JPS5299847A true JPS5299847A (en) 1977-08-22

Family

ID=11926945

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1682576A Pending JPS5299847A (en) 1976-02-17 1976-02-17 Thickness measurement using ultrasonic waves

Country Status (1)

Country Link
JP (1) JPS5299847A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62206410A (en) * 1986-03-06 1987-09-10 Mimasu Handotai Kogyo Kk Method and apparatus of measuring wafer thickness
US5098185A (en) * 1988-06-15 1992-03-24 Japan Industrial Land Development Co., Ltd. Automatic tracking type measuring apparatus
JP2014232031A (en) * 2013-05-29 2014-12-11 株式会社クボタ Thickness measuring method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62206410A (en) * 1986-03-06 1987-09-10 Mimasu Handotai Kogyo Kk Method and apparatus of measuring wafer thickness
US5098185A (en) * 1988-06-15 1992-03-24 Japan Industrial Land Development Co., Ltd. Automatic tracking type measuring apparatus
JP2014232031A (en) * 2013-05-29 2014-12-11 株式会社クボタ Thickness measuring method

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