JPS5998524A - Inspecting apparatus of transparent material - Google Patents
Inspecting apparatus of transparent materialInfo
- Publication number
- JPS5998524A JPS5998524A JP57206174A JP20617482A JPS5998524A JP S5998524 A JPS5998524 A JP S5998524A JP 57206174 A JP57206174 A JP 57206174A JP 20617482 A JP20617482 A JP 20617482A JP S5998524 A JPS5998524 A JP S5998524A
- Authority
- JP
- Japan
- Prior art keywords
- light
- transmits
- glass mask
- mask
- deflected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012780 transparent material Substances 0.000 title description 2
- 230000007547 defect Effects 0.000 claims abstract description 14
- 238000007689 inspection Methods 0.000 claims abstract description 9
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 abstract description 24
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract description 13
- 230000035945 sensitivity Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
【発明の詳細な説明】 本発明は、透明体の検査装置に関する。[Detailed description of the invention] The present invention relates to a transparent body inspection device.
一般に、半導体装置の製造に不可欠なホトリソグラフィ
(写真処理)にはウェハに塗布したホトレジスト膜を選
択的に感光させる工程が必要になる。この感光処理は透
明ガラス板の表面にクロム等からなる不透明膜を所要の
パターンに形成してなるガラスマスクを使用し、ホトレ
ジスト膜を形成したウェハに密着させた状態で露光して
感光させることによシ行なわれる。Generally, photolithography (photographic processing), which is essential for manufacturing semiconductor devices, requires a process of selectively exposing a photoresist film applied to a wafer. This photo-sensitization process uses a glass mask made by forming an opaque film made of chromium or the like in the desired pattern on the surface of a transparent glass plate, and exposes the wafer with a photoresist film on it to expose it to light. It is done well.
このようなガラスマスクに欠陥(傷、異物、汚れ等)が
あると、ホトレジスト膜が所要とするパターンと異なる
パターンを感光せしめて不良発生の原因になる。そして
、このマスクは数百枚のウェハに対する感光処理に繰シ
返えして使用されるため、半導体装置の製造上重大な問
題になる。したがって、マスクの検査が実施される。特
に透明体の傷はガラスマスクの洗浄等を行なっても除却
できず、よシ厳密な検査が必要とされている。If such a glass mask has defects (scratches, foreign matter, dirt, etc.), the photoresist film will be exposed to a pattern different from the desired pattern, causing defects. Since this mask is used repeatedly for photosensitive processing on hundreds of wafers, this poses a serious problem in the manufacture of semiconductor devices. Therefore, an inspection of the mask is performed. In particular, scratches on transparent objects cannot be removed even by cleaning the glass mask, and more rigorous inspection is required.
従来、この種の透明体の傷検査装置として、例えば、第
1図に示すようなものが提案されている。2. Description of the Related Art Conventionally, as this type of a flaw inspection apparatus for transparent bodies, an apparatus as shown in FIG. 1, for example, has been proposed.
この装置は、ガラスマスクlの端面から平行光線を入射
させ、マスクの傷2において乱反射した光を検出するこ
とにより、傷2を検査するようにしたものである。This device is designed to inspect flaws 2 by making parallel light rays incident on the end face of a glass mask 1 and detecting the light that is diffusely reflected at the flaws 2 on the mask.
しかしながら、このような透明体の傷検査装置にあって
は、ガラスマスクの端面がすシガラス状になっているも
のが多く、平行光線が端面で乱反射して入射光量が少な
くなるため、傷の検出感度が悪いという欠点がおった。However, in many of these devices for inspecting defects on transparent materials, the end surface of the glass mask is glass-like, and parallel light rays are diffusely reflected at the end surface, reducing the amount of incident light, making it difficult to detect defects. It had the disadvantage of poor sensitivity.
本発明の目的は、前記従来技術の欠点を解決し。The object of the present invention is to overcome the drawbacks of the prior art.
特に傷の検出感度が良好な透明体の検査装置を提供する
にある。It is an object of the present invention to provide a transparent body inspection device that has particularly good flaw detection sensitivity.
以下5本発明を図面に示す実施例にしたがって説明する
。Hereinafter, five embodiments of the present invention will be explained according to embodiments shown in the drawings.
第2図および第3図は本発明による透明体の検査装置の
一実施例を示す各縦断面図である。FIGS. 2 and 3 are longitudinal sectional views showing an embodiment of a transparent body inspection apparatus according to the present invention.
本実施例において、欠陥を検査すべき透明体としてのガ
ラスマスク1はほぼ水平に支持されておシ、マスク1の
下方にはレーザ光源4がマスク面に直角に光線を照射す
るように設けられている。In this embodiment, a glass mask 1 as a transparent body to be inspected for defects is supported almost horizontally, and a laser light source 4 is provided below the mask 1 so as to irradiate a light beam perpendicularly to the mask surface. ing.
レーザ光源4とマスク1の裏面との間には偏光板(ポー
ラロイド板)5が介設されておシ、この偏光板5はレー
ザ光源4からの一般光(振動方向の限定されない光)の
うち振動方向の限定された光(偏光光)のみを透過させ
る。ガラスマスク1の上方には第2偏光板6が設けられ
、この偏光板6は前記第1偏光板5で作られた偏光光を
遮ぎるように構成されている。第2偏光板6の真上には
スリット板7が設けられ、スリット板7の真上には受光
器8がスリット板7を透過した光を検出し得るように設
けられている。A polarizing plate (polaroid plate) 5 is interposed between the laser light source 4 and the back surface of the mask 1, and this polarizing plate 5 polarizes general light (light whose vibration direction is not limited) from the laser light source 4. Only light in a limited vibration direction (polarized light) is allowed to pass through. A second polarizing plate 6 is provided above the glass mask 1, and this polarizing plate 6 is configured to block the polarized light produced by the first polarizing plate 5. A slit plate 7 is provided directly above the second polarizing plate 6, and a light receiver 8 is provided directly above the slit plate 7 so as to be able to detect the light transmitted through the slit plate 7.
図示しないが、ガラスマスク1への光の照射がXY方向
に相対的に走査されるようにガラスマスクの支持機構お
よびレーザ光源や偏光板等の光学系は構成されている。Although not shown, the support mechanism for the glass mask and optical systems such as a laser light source and a polarizing plate are configured so that the glass mask 1 is irradiated with light relatively scanned in the X and Y directions.
次に特に傷の検出作用を説明する。Next, the flaw detection function will be explained in particular.
レーザ光源4からの一般光9は第1偏光板5を透過する
と、偏光光10になり、ガラスマスク1に直角に入射し
て上方に透過する。When the general light 9 from the laser light source 4 passes through the first polarizing plate 5, it becomes polarized light 10, which enters the glass mask 1 at right angles and is transmitted upward.
第2図に示すように、偏光光10はガラスマスク1の傷
の無い箇所を透過するときはそのままの振動方向のみで
透過する。この偏光光10は第2偏光板6で遮られるの
で、受光器8は所定値以上の光量を検出しない。これに
より、ガラスマスク1の当該走査点には傷が無いことが
検査されることになる。As shown in FIG. 2, when the polarized light 10 is transmitted through an undamaged portion of the glass mask 1, it is transmitted only in the same vibration direction. Since this polarized light 10 is blocked by the second polarizing plate 6, the light receiver 8 does not detect an amount of light exceeding a predetermined value. Thereby, it is inspected that there are no scratches at the scanning point on the glass mask 1.
第3図に示すように、偏光光10はガラスマスク1の傷
2を透過するときは他の振動方向の光11を含む(一般
光に戻る。)ことになる。この光11は第2偏光板6で
一部は遮られることなく透過し、スリット板7を透過し
て受光器8に検出される。As shown in FIG. 3, when the polarized light 10 passes through the scratches 2 on the glass mask 1, it includes light 11 in another vibration direction (returns to general light). A portion of this light 11 passes unobstructed through the second polarizing plate 6, passes through the slit plate 7, and is detected by the light receiver 8.
この検出によシ、ガラスマスク10当該走査点に傷があ
ることが検査されることになる。なおこの現象は傷取外
の異物、汚れ等がガラスマスクに付着した場合でも一部
発生する。Through this detection, it is determined that the glass mask 10 has a flaw at the scanning point. Note that this phenomenon partially occurs even when foreign matter, dirt, etc. other than the scratches are attached to the glass mask.
本実施例によれば、ガラスマスクに偏光光を照射してマ
スクの欠陥での偏光光の乱れを検出することにより欠陥
を検査するので、異質の光を検出することになシ、検査
感度が極めて高くなシ、特に微細な傷も検出することが
できる。したがって。According to this embodiment, defects are inspected by irradiating the glass mask with polarized light and detecting disturbances in the polarized light due to defects in the mask, so there is no need to detect foreign light and the inspection sensitivity is low. Even extremely high scratches, especially minute scratches, can be detected. therefore.
欠陥のあるガラスマスクが感光処理工程に流れることを
未然に、かつ確実に防止でき、ウェハの歩留を向上させ
、しいては半導体装置の生産性や品質を向上させること
ができる。It is possible to prevent defective glass masks from being sent to the photosensitive processing process, improve the yield of wafers, and improve the productivity and quality of semiconductor devices.
なお、スリット板は受光器のS/N比を高めるものであ
るので、省略することも可能である。また、光源が偏光
光を照射できる装置である場合には第1偏光板を省略す
ることができるし、受光器が振動方向の変化を正確に検
出できるものでおれば、第2偏光板も省略することがで
きる。Note that since the slit plate increases the S/N ratio of the light receiver, it can be omitted. Additionally, if the light source is a device that can emit polarized light, the first polarizing plate can be omitted, and if the receiver can accurately detect changes in the vibration direction, the second polarizing plate can also be omitted. can do.
本発明はガラスマスクの欠陥を検査する場合に限らず、
板ガラスやレンズ等あらゆる分野の透明体の欠陥を検査
する装置全般に適用することができる。The present invention is not limited to inspecting defects in glass masks;
It can be applied to all devices that inspect defects in transparent bodies in all fields, such as plate glass and lenses.
以上説明したように、本発明によれば、透明体の傷を正
確に検査することができる。As described above, according to the present invention, it is possible to accurately inspect scratches on a transparent body.
第1図は従来例を示す縦断面図。
第2図および第3図は本発明の一実施例を示す原理的な
各縦断面図である。
1・・・ガラスマスク、2・・・傷、4・・・レーザ光
源、5・・・第1偏光板、6・・・第2偏光板、7・・
・スリット板、8・・・受光器。FIG. 1 is a longitudinal sectional view showing a conventional example. FIGS. 2 and 3 are longitudinal sectional views showing the principle of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Glass mask, 2... Scratch, 4... Laser light source, 5... First polarizing plate, 6... Second polarizing plate, 7...
・Slit plate, 8... Light receiver.
Claims (1)
の中から透明体に存在することがある欠陥での乱れを検
出して欠陥を検査するようにした透明体の検査装置。1. A transparent body inspection device that inspects defects by irradiating the transparent body with polarized light and detecting disturbances due to defects that may exist in the transparent body from the polarized light transmitted through the transparent body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57206174A JPS5998524A (en) | 1982-11-26 | 1982-11-26 | Inspecting apparatus of transparent material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57206174A JPS5998524A (en) | 1982-11-26 | 1982-11-26 | Inspecting apparatus of transparent material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5998524A true JPS5998524A (en) | 1984-06-06 |
Family
ID=16519031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57206174A Pending JPS5998524A (en) | 1982-11-26 | 1982-11-26 | Inspecting apparatus of transparent material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5998524A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134646A (en) * | 1984-12-05 | 1986-06-21 | Sumitomo Electric Ind Ltd | Crystal evaluating device |
JPS6435418A (en) * | 1987-07-30 | 1989-02-06 | Matsushita Electric Ind Co Ltd | Method for evaluating liquid crystal orientational capacity of oriented film |
-
1982
- 1982-11-26 JP JP57206174A patent/JPS5998524A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61134646A (en) * | 1984-12-05 | 1986-06-21 | Sumitomo Electric Ind Ltd | Crystal evaluating device |
JPS6435418A (en) * | 1987-07-30 | 1989-02-06 | Matsushita Electric Ind Co Ltd | Method for evaluating liquid crystal orientational capacity of oriented film |
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