JPS5990672A - Ultrasonic vibrating element drive - Google Patents
Ultrasonic vibrating element driveInfo
- Publication number
- JPS5990672A JPS5990672A JP57199485A JP19948582A JPS5990672A JP S5990672 A JPS5990672 A JP S5990672A JP 57199485 A JP57199485 A JP 57199485A JP 19948582 A JP19948582 A JP 19948582A JP S5990672 A JPS5990672 A JP S5990672A
- Authority
- JP
- Japan
- Prior art keywords
- frequency
- circuit
- ultrasonic
- voltage
- signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/60—Riveting or staking
- B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
- B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
- B29C65/7805—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features
- B29C65/7814—Positioning the parts to be joined, e.g. aligning, indexing or centring the parts to be joined comprising positioning features in the form of inter-cooperating positioning features, e.g. tenons and mortises
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
- B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/84—Specific machine types or machines suitable for specific applications
- B29C66/847—Drilling standard machine type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
- B29C66/92651—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops
- B29C66/92653—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by using stops said stops being adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
- B29C66/9511—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools by measuring their vibration frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
- B29C66/951—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools
- B29C66/9512—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94 by measuring or controlling the vibration frequency and/or the vibration amplitude of vibrating joining tools, e.g. of ultrasonic welding tools by controlling their vibration frequency
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
- B29C66/92611—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools by controlling or regulating the gap between the joining tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
技術分野
この発明は、いわゆる超音波「jノニルター、超合波溶
首機等の超音波加工機のための超音波振動素子を超音波
振動させる超音波振8素子駆動装置に関づる。Detailed Description of the Invention Technical Field The present invention relates to an ultrasonic vibrating 8-element drive system for ultrasonic vibration of ultrasonic vibrating elements for ultrasonic processing machines such as so-called ultrasonic waves and ultrasonic wave head welding machines. Related to equipment.
従来技術
従来の超音波振動素子駆動′3A置に[13いては、超
音波振動素子に設(〕られた加工用ボーンにひび割れが
生ずるどか、加工用ホーンが交換された時には、超音波
振動素子が基本周波数以外の異なる周波数にて振動され
るようになり、例えば被加工物であるプラスチックの溶
着不良を生ずる等の問題点があった。Prior Art In the conventional ultrasonic vibrating element drive '3A, if the machining bone installed in the ultrasonic vibrating element cracks or the machining horn is replaced, the ultrasonic vibrating element is now vibrated at a different frequency than the fundamental frequency, resulting in problems such as poor welding of the plastic workpiece, for example.
目的
この発明の目的は、上記問題点を解決するために為され
たものであって、基本周波数以外の異なる周波数にて超
音波振動素子が1肢動された場合、その界なる振動周波
数による超音波振動素子の振動を防11−シて、基本周
波数による振動に自動的に移行するにうにし、被加工物
の溶着不良を防止し19る超音波振動素子駆動装置を提
供りることにある。Purpose The purpose of the present invention was to solve the above-mentioned problems, and when one limb of an ultrasonic vibrating element is moved at a frequency other than the fundamental frequency, the ultrasonic vibration due to the vibration frequency of that field is An object of the present invention is to provide an ultrasonic vibrating element drive device which prevents vibration of a sonic vibrating element and automatically shifts to vibration at the fundamental frequency, thereby preventing defective welding of workpieces. .
実施例
以下この発明を超音波加工機に具体化した一実施例を回
向に従って説明J゛る。EXAMPLE Hereinafter, an example in which the present invention is embodied in an ultrasonic processing machine will be described in detail.
第1図に示すように、−デープル1上には支社2が立設
され、その支柱2の−に部には固定台3が固定されてい
る。その固定台3に【よ流体圧シリンダ1が固定され、
その下方に延びるビス1〜ンロツド5には可動枠体6が
固定されて、l−3つ、その可動枠体6に;ま超音波振
動素子7が保持されている。その超音波振動素子7の下
端には加工用ボーン8が看脱可能に取りイ」()られ、
イの1S@の加工部8aは前記デープル1と対向してい
る。又、超音波振動素子7を発振さ已゛る発振回路9が
段()られてい6 。As shown in FIG. 1, a branch office 2 is erected on top of the table 1, and a fixed base 3 is fixed to the bottom of the column 2. A fluid pressure cylinder 1 is fixed to the fixed base 3,
Movable frames 6 are fixed to screws 1 to 5 extending downward, and ultrasonic vibration elements 7 are held on the movable frames 6. A machining bone 8 is removably attached to the lower end of the ultrasonic vibration element 7.
The processed portion 8a of 1S@ in A is opposed to the daple 1. Further, an oscillation circuit 9 that oscillates the ultrasonic vibration element 7 is provided in stages 6.
でしてデープル1上に型10を載置し、その型10内に
シラスチックからなる2枚の被加工物11を重合しぞ載
置して、流体圧シリンダ4のピストンロッド5を下動さ
けると、可動枠体6とともに加工用ホーン8が下動され
、その加工部8aが被加工物11の加工部11aを押圧
する。その状態で発振回路9により超音波振rF)ノ素
子7を振動させ被加工物1つに加工部8aから超音波振
動を付ノコするど両波加工物11の加工部11aが溶着
加−1される。加工終了後は流体圧シリンダ1により加
工用ホーン8が上動され、被加工物11がテーブル1」
−から取り除かれる。Then, a mold 10 is placed on the table 1, two workpieces 11 made of plastic are placed in the mold 10 in a superposed manner, and the piston rod 5 of the fluid pressure cylinder 4 is moved downward. When the machining horn 8 is moved downward together with the movable frame 6, its machining portion 8a presses the machining portion 11a of the workpiece 11. In this state, when the ultrasonic vibration rF) element 7 is vibrated by the oscillation circuit 9 and the ultrasonic vibration is applied from the processing part 8a to one workpiece, both waves cause the processing part 11a of the workpiece 11 to be welded. be done. After the machining is completed, the machining horn 8 is moved upward by the fluid pressure cylinder 1, and the workpiece 11 is placed on the table 1.
− is removed from
次にこの実施例の超音波加工機の電子回路を第2図に従
って説明づる。超音波振動素子7 LJ駆動用素子7a
ど検出用素子7bどを協えており、発振回路9により発
振される。その発振回路9についC説明づるど、検出用
素子7bからは超音波振動素子7の実際の振動周波数f
の電気的な高周波信号SG1が出力され、その高周波信
号SG1は帰還回路12に入力される。その帰還回路1
2は、一端が超音波振動素子7の検出用素子71+に接
続され、他端が抵抗13を介して接地されたニー1ンデ
ンザ14ど、その抵抗13ど、イの抵抗1.′3に一次
側端子が並列接続された1−ランス15どからなり、ト
ランス15の二次側端子は帰還回路12の出力端子どな
つ−Cいる。帰還回路12の出力端子から出力されるフ
ィードバック信号S G 2 tJ減衰回路16に入力
される。その減辰回路16は、3飼の抵抗R1,I’?
2.R3を直列接続してなり、トランス′15の二次側
端子に並列接続されている。Next, the electronic circuit of the ultrasonic processing machine of this embodiment will be explained with reference to FIG. Ultrasonic vibration element 7 LJ driving element 7a
The detection element 7b and the like are connected to each other, and the oscillation circuit 9 oscillates. Regarding the oscillation circuit 9, the actual vibration frequency f of the ultrasonic vibration element 7 is detected from the detection element 7b.
An electrical high frequency signal SG1 is output, and the high frequency signal SG1 is input to the feedback circuit 12. The feedback circuit 1
2 is a knee sensor 14 whose one end is connected to the detection element 71+ of the ultrasonic vibration element 7 and whose other end is grounded via a resistor 13, its resistor 13, and the resistor 1. The transformer 15 has a primary terminal connected in parallel with the transformer 15, and the secondary terminal of the transformer 15 is connected to the output terminal of the feedback circuit 12. A feedback signal S G 2 tJ output from the output terminal of the feedback circuit 12 is input to the attenuation circuit 16 . The depletion circuit 16 has three resistors R1, I'?
2. R3 are connected in series, and are connected in parallel to the secondary terminal of transformer '15.
抵抗R2の両端にはアナ、ログスイッヂ17が並列接続
され、抵抗R1どR2どの接続点/〕曹う減衰回路1G
の出力信@SG3が出力される。イの出力信号S G
3は可変増幅度増幅回路18と電力増幅回路19により
増幅され、その電力増幅回路1つから高周波電力が超音
波振動素子7の駆動用素子7aに供給される。そして、
減衰回路16.可変増幅度増幅回路18.電ツノ増幅回
路1つにより電力供給回路20が構成されている。An analog and log switch 17 is connected in parallel to both ends of the resistor R2, and a damping circuit 1G is connected to the resistor R1 and R2.
The output signal @SG3 is output. A output signal S G
3 is amplified by a variable amplification amplifier circuit 18 and a power amplifier circuit 19, and high frequency power is supplied from one of the power amplifier circuits to the driving element 7a of the ultrasonic vibration element 7. and,
Attenuation circuit 16. Variable amplification amplifier circuit 18. The power supply circuit 20 is constituted by one power amplifier circuit.
この発振回路9は、電圧増幅率を人0.電圧帰るどき発
振する。This oscillation circuit 9 has a voltage amplification factor of 0. It oscillates when the voltage returns.
超音波振動素子7の検出用素子71)からの高周波信号
S01は検波整流回路21へ入力され、その検波整流回
路21は高周波信tU S G 1の電圧(1r1に比
例覆る直流電圧VDを可変直流電源22に角与する。そ
の可変直流電源22には電源・電丹vCが(=J〜され
ており、直流電圧VDにより制御される出ツノ電圧vO
を可変増幅度増幅回路18に付与づ−る。イの出力型E
’ V Oは、直流電圧VDが高くなるほど低い値とな
り、直流電圧VDが低1(するほど高くなる。前記可変
増幅度増幅回路18の増幅率はその出力型ffVOに比
例する。従つ−(、超音波振動素子7の振動周波数[が
低下りるど高周波信号SGIの電圧値が低くなり、直流
電圧VDが低下し出力電圧vOが高くなる。これにJ、
り可変増幅度増幅回路18の増幅率が高くなり、超音波
振動素子7の駆動用素子7aには人さな高周波型ツノが
供給される。従って超音波振動素子7は結果的に一定の
振動数にて振動づることになり、高周波信号SG1の電
圧値も一定どなる。又、反対に超音波振動素子7の振動
周波数fが高くなった時も、同様に制御されて結果的に
JfI音波振動素子7は一定の振動周波数[にて振動さ
れ、高周波信号SG1の電圧も一定となる。The high frequency signal S01 from the detection element 71) of the ultrasonic vibration element 7 is input to the detection rectifier circuit 21, which converts the high frequency signal tU S G 1 into a variable DC voltage VD proportional to the voltage (1r1). The variable DC power supply 22 has a power supply voltage vC (=J~), and an output voltage vO controlled by the DC voltage VD.
is applied to the variable amplification amplifier circuit 18. Output type E of A
' VO becomes a lower value as the DC voltage VD becomes higher, and becomes higher as the DC voltage VD becomes lower. The amplification factor of the variable amplification amplifier circuit 18 is proportional to its output type ffVO. Therefore, -( , as the vibration frequency of the ultrasonic vibration element 7 decreases, the voltage value of the high-frequency signal SGI decreases, the DC voltage VD decreases, and the output voltage vO increases.
As a result, the amplification factor of the variable amplification amplification circuit 18 is increased, and a human-like high-frequency horn is supplied to the driving element 7a of the ultrasonic vibration element 7. Therefore, the ultrasonic vibration element 7 vibrates at a constant frequency, and the voltage value of the high frequency signal SG1 also remains constant. Conversely, when the vibration frequency f of the ultrasonic vibration element 7 becomes high, the same control is performed, and as a result, the JfI sonic vibration element 7 is vibrated at a constant vibration frequency, and the voltage of the high-frequency signal SG1 also increases. It becomes constant.
しかしながら、超音波振動素子7は袖本周波数fo以外
の周波数を含む。この基本周波数fO以外の周波数とし
ては、高調波、発振回路9の)7遁容聞等に起因リ−る
寄生振動によるしの等が存在するが、超音波振動素子7
の周波数に対するいわゆるスプリアス特性が基本周波数
[0に接M L−た周波数て゛ビーク値を右づると、超
音波振動索子7の実際の振動周波数[は基本周波数fO
から外れ−Cしまうことどなる。このような状態となる
と、前述したような検波整流回路21.可変直流電源2
2.可変増幅度増幅回路18によっては、もはや超音波
振動索子7の振動周波数fを一定に保つことができなく
なってしまう。However, the ultrasonic vibration element 7 includes frequencies other than the Sodemoto frequency fo. Frequencies other than this fundamental frequency fO include harmonics and parasitic vibrations caused by the oscillation circuit 9, etc., but the ultrasonic vibration element 7
The so-called spurious characteristic with respect to the frequency of
I yelled that I was going to put it away and put it away. In such a state, the detection rectifier circuit 21 as described above. Variable DC power supply 2
2. Depending on the variable amplification amplifier circuit 18, it is no longer possible to keep the vibration frequency f of the ultrasonic transducer 7 constant.
イこてこの発明においては発振回路9に以下に述べるよ
うな回路構成を設りている。帰還回路12の抵抗13ど
コンデン+j14どの接続点からは超音波振動素子7の
振動周波数「の電気信号が出力されている。その振動周
波数1は周波数−電圧変換器からなる周波数検出装置2
3に入ツノされ、その周波数検出装置23はj辰動周波
数「に比例りる自流電圧Vfを判別手段24にfNl与
りる。その判別手段24は、超音波振動素子7の基本周
波数fOJ、り僅かに高い周波数f()トΔfに比例−
する直流電圧V Hと、基本周波数rOより僅かに低い
周波数[0−△[に比例Jる直流電圧vしとを出力づる
基準電圧発生器25と、直流電圧Vfと直流電圧V1−
1とが2個の入力端子にそれぞれ入力される比較器26
ど、直流電圧Vfと直流電圧VL とが2個の入力端
子にそれぞれ入力される比較器27と、両比較器26.
27の出力端子が2個の入力端子にぞれぞれ接続された
OR回路28とからなる。In this invention, the oscillation circuit 9 is provided with a circuit configuration as described below. An electrical signal at the vibration frequency of the ultrasonic vibration element 7 is output from the connection point between the resistor 13 and the capacitor +j14 of the feedback circuit 12.
3, the frequency detecting device 23 applies a self-current voltage Vf proportional to the oscillating frequency fNl to the determining means 24. The slightly higher frequency f() is proportional to Δf.
A reference voltage generator 25 outputs a DC voltage VH proportional to a frequency slightly lower than the fundamental frequency rO, a DC voltage v proportional to a frequency [0-△[, and a DC voltage Vf and a DC voltage V1-.
A comparator 26 in which 1 and 1 are respectively input to two input terminals.
A comparator 27 to which DC voltage Vf and DC voltage VL are respectively input to two input terminals, and both comparators 26 .
It consists of an OR circuit 28 in which 27 output terminals are respectively connected to two input terminals.
比較器26は直流電圧vrが直流電圧V +i J:り
高くなった時、リ−なわち超音波振動素子7の振動周波
数113<基本周波数[OよりΔfだ番)高くなった時
、論理1の出力信号を出力し、比較器27は直流電圧V
[が直流電圧Vしより低くなった時、Tlなわち超音波
振動索子7の振動周波数fが基本周波数rOよりΔfだ
(J低くなった時、論理1の出力信号を出力りるにうに
なっており、OR回路28は、両比較器26.27の出
力のいずれか一方又は両方が論理1どなった時、論J、
!I! 1の判別信号SG/1を出力する。イの判別信
号SG4は、スイッチ29を介して、警報表示手段30
又はアナログスイッチ駆動回路31に入力される。ぞの
警報表示手段30は、警報13号を発生ずる発光ダイΔ
−ド。The comparator 26 outputs logic 1 when the DC voltage vr becomes higher than the DC voltage V + i J:, that is, when the vibration frequency 113 of the ultrasonic vibration element 7 becomes higher than the fundamental frequency [Δf number than O]. The comparator 27 outputs an output signal of DC voltage V
When [ becomes lower than the DC voltage V, Tl, that is, the vibration frequency f of the ultrasonic vibrating cord 7 is Δf than the fundamental frequency rO (When J becomes lower, an output signal of logic 1 is output. When either or both of the outputs of the comparators 26 and 27 becomes logic 1, the OR circuit 28 outputs logic J,
! I! 1 discrimination signal SG/1 is output. The determination signal SG4 of A is sent to the alarm display means 30 via the switch 29.
Alternatively, it is input to the analog switch drive circuit 31. The alarm display means 30 is a light emitting diode Δ that generates alarm No. 13.
-Do.
スピーカー等の警報素子32ど、での警報素子32を駆
動づる警報表示素子駆動回路33とからなる。超音波振
動索子7の実際の周波数fがfO±△fの範囲内の値に
収まっていない場合には、判別手段24から論理1の判
別信号SG4が警報表示素子駆動回路33に付与されて
、警報素子32h)ら光、音等の警報信号が発生される
。It consists of an alarm display element drive circuit 33 that drives an alarm element 32 such as an alarm element 32 such as a speaker. If the actual frequency f of the ultrasonic vibrating cord 7 is not within the range of fO±△f, a discrimination signal SG4 of logic 1 is applied from the discrimination means 24 to the alarm display element drive circuit 33. , alarm element 32h) generates an alarm signal such as light or sound.
又、スイッチ29がアナログスイッチ駆動回路31側へ
倒されている時には、判別手段24から論理1の判別信
号SG4が出力されるどアナログスイッチ駆動回路31
が作動し、そのアナログスイッチ駆動回路31は前記減
衰回路16のアナログスイッチ17をオンさける。減衰
回路16の減6592は、アナログスイッ7−17がオ
ー7されているときにはrR1/ (R14−R2−1
−R3)であるが、アナログスイッチ17がオンされた
時にはR17/(F?、 1’+ R3)となる。従っ
て、アプゴ」グスイッヂ17がオンされた時のほうが減
衰回路16の減衰率は大きくなり、発振回路9の全体の
電圧利得は低下す゛る。それににり超音波振動素子7は
、例え基本周波数[0に接近した周波数でスプリアス特
性のピーク値をイjする場合でも通常でのピーク値は基
本周波数fOのピーク値より低いため、基本周波数fO
以外の周波数では発振し難くなり、基本周波数10で発
振するようになる。するど、周波数検出装置23から出
力される直流電圧V[は、基準電圧発生器25力目ら出
力される直流電圧VL−V1]の値の範囲内に収まり、
判別手段24からは論1!I!0の信号が出力される。Further, when the switch 29 is turned to the analog switch drive circuit 31 side, the discrimination signal SG4 of logic 1 is output from the discrimination means 24, and the analog switch drive circuit 31
is activated, and its analog switch drive circuit 31 turns on the analog switch 17 of the attenuation circuit 16. The reduction 6592 of the attenuation circuit 16 is rR1/(R14-R2-1
-R3), but when the analog switch 17 is turned on, it becomes R17/(F?, 1'+R3). Therefore, when the up-go switch 17 is turned on, the attenuation rate of the attenuation circuit 16 becomes larger, and the overall voltage gain of the oscillation circuit 9 decreases. Therefore, even if the peak value of the spurious characteristic is equalized at a frequency close to the fundamental frequency [0, the peak value under normal conditions is lower than the peak value of the fundamental frequency fO,
It becomes difficult to oscillate at frequencies other than that, and oscillates at a fundamental frequency of 10. Eventually, the DC voltage V output from the frequency detection device 23 falls within the value range of the DC voltage VL-V1 output from the reference voltage generator 25,
From the determination means 24, argument 1! I! A signal of 0 is output.
従ってアナ〔1グスイッチ駆動回路31ば作動せず、ア
ナログスイッチ17がオフされる。すると、発振回路引
〕の全体の電圧和(qは元の値に戻って、イのまま基本
周波数fOにて超音波振動素子7が振動されることとな
る。Therefore, the analog switch drive circuit 31 does not operate, and the analog switch 17 is turned off. Then, the total voltage sum (q) of the oscillation circuit returns to its original value, and the ultrasonic transducer element 7 is vibrated at the fundamental frequency fO as in A.
前述しIFc検波整流回路21.η交直流電源22等か
らなる回路は、超音波振動素子7の基本周波数[0の値
が何らかの原因によりずれた場合にイの基本周波数fO
の値を一定に保つための回路である。The above-mentioned IFc detection rectifier circuit 21. ηA circuit consisting of an AC/DC power source 22, etc. is configured to maintain the fundamental frequency fO of the ultrasonic transducer 7 when the value of 0 deviates for some reason.
This is a circuit to keep the value constant.
これに対して周波数検出装置231判別手段24゜警報
表示手段30.アナ[:1グスイッチ駆動回路31、ア
ナログスイッチ17.減衰回路16等により構成される
回路は、超音波振動素子7が基本周波数fO以外の高調
波成分等による周波数によって発振されるのを防止する
回路でありその目的が箕仕る。On the other hand, frequency detection device 231 discrimination means 24° alarm display means 30. Analog switch drive circuit 31, analog switch 17. The circuit constituted by the attenuation circuit 16 and the like is a circuit that prevents the ultrasonic vibration element 7 from being oscillated by frequencies due to harmonic components other than the fundamental frequency fO, and its purpose is to serve this purpose.
なa3、周波数検出装置23としては、振動周波数rの
高周波信号SG1をその周波数〔のパルス13号に変換
−するシュミット回路で]?4成し、その周波数fもし
くは周期を直接h1測することににり判別信@SG4を
出力するように判別手段24を構成してもよい。A3, the frequency detection device 23 is a Schmitt circuit that converts the high frequency signal SG1 of the vibration frequency r into a pulse No. 13 of that frequency. The discriminating means 24 may be configured to directly measure the frequency f or period h1 and output the discriminating signal @SG4.
効果
以上詳述したにうにこの発明番よ、超音波振動素子7の
検出用素子7bから出力される高周波信号SG1の周波
数fに比例する電気1g号Vfを検出する周波数検出装
置23ど、その周波数検出装置23によ・〕で検出され
た電気信号Vfが予め定められた周波数fOと一致する
か杏かを判別する判別手段24ど、その判別手段24に
よって前記検出された周波数「が前記予め定められた周
波数fOと一致しないと判別された場合、その判別結果
に応答して前記電力供給回路2oがら駆動用素子7aに
供給する高周波電力を減少ざμる手段とを設()だこと
により、新しい加工用ホーンに交換した場合等には、超
音波振動素子7の基本周波数foど異なる周波数[に−
C超音波振動素子7が振動されようとしても自動的に基
本周波数fOにて振動されるJ:うになり、被加工物の
溶着不良をなくずことができ゛る。Effects As described in detail above, this invention number includes a frequency detection device 23 that detects the electricity 1g Vf which is proportional to the frequency f of the high frequency signal SG1 output from the detection element 7b of the ultrasonic vibration element 7. A determining means 24 determines whether the electric signal Vf detected by the detecting device 23 matches the predetermined frequency fO or not, and the determining means 24 determines whether the electric signal Vf detected by the detecting device 23 matches the predetermined frequency fO. By providing means for reducing the high frequency power supplied from the power supply circuit 2o to the driving element 7a in response to the result of the determination, if it is determined that the frequency does not match the frequency fO, When replacing with a new machining horn, etc., the fundamental frequency fo of the ultrasonic vibrating element 7 may be different.
Even if the ultrasonic vibration element 7 is about to be vibrated, it is automatically vibrated at the fundamental frequency fO, thereby eliminating welding defects on the workpiece.
図面はこの発明を超音波加工機に具体化した一実施例を
示し、第1図は側面図、第2図は回路図である。The drawings show an embodiment of the present invention in an ultrasonic processing machine, with FIG. 1 being a side view and FIG. 2 being a circuit diagram.
Claims (1)
た超音波振動素子(7)と、 (の超音波振動素子(7)の駆動用素子(7a)に高周
波電力を供給するための電力供給回路(20)と、 ぞの電力供給回路(20)に前記超音波振動素子(7)
の検出用素子(7b)から出力される高周波信号(SG
I)を正帰還する帰還回路(12)と を含む超音波振動素子駆動装置において、前記検出用素
子(7b)から出力される高周波信号(SG1)の周波
数(f)に比例する電気信号(V[)を検出する周波数
検出駅間(23)と、その周波数検出装置(23)によ
って検出された電気信号(Vf )が予め定めIうれl
こ周波数〈CO)と一致J“るか否かを判別づる判別手
段<2/I)と、イの判別手段(24)によって前記検
出された周波数(r)が前記予め定められた周波数(「
0)ど一致しないど判別された場合、イの判別結果に応
答して前記電力供給回路(20)から駆動用素r−(7
a)に供給する高周波ミノJを減少させる手段と を設()たことを特徴どする超音波振動素子駆動装置。 2、前記電力供給回路(20〉は前記検出用素子(7b
)から帰還された高周波信@’(SG1)を減衰させる
ためのアナログスーイッヂ(17)を有する減衰回路(
16)を含み、前記高周波電ツノを減少させる手段は前
記アナログスイッヂ(17)を駆動するための駆動回路
(31)を含むことを特徴とする特許請求の範囲第1項
に記載の超音波振動素子駆動装置。[Claims] 1. An ultrasonic vibration element (7) comprising a driving element (7a) and a detection element (7b); a power supply circuit (20) for supplying high-frequency power; and the ultrasonic vibration element (7) in the power supply circuit (20).
The high frequency signal (SG
In the ultrasonic vibrating element drive device including a feedback circuit (12) that provides positive feedback of I), an electric signal (V The frequency detection station (23) that detects [) and the electrical signal (Vf) detected by the frequency detection device (23) are predetermined.
The detected frequency (r) is determined by the determining means (24) for determining whether or not the detected frequency (r) matches the predetermined frequency (2/I).
0) If it is determined that they do not match, the driving element r-(7) is supplied from the power supply circuit (20) in response to the determination result of
An ultrasonic vibrating element driving device comprising: (a) means for reducing high frequency mino J supplied to the ultrasonic vibrating element drive device. 2. The power supply circuit (20> is connected to the detection element (7b)
) is an attenuation circuit (
16), and the means for reducing the high frequency electric horn includes a drive circuit (31) for driving the analog switch (17). Vibration element drive device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57199485A JPS5990672A (en) | 1982-11-13 | 1982-11-13 | Ultrasonic vibrating element drive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57199485A JPS5990672A (en) | 1982-11-13 | 1982-11-13 | Ultrasonic vibrating element drive |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5990672A true JPS5990672A (en) | 1984-05-25 |
JPH0353995B2 JPH0353995B2 (en) | 1991-08-16 |
Family
ID=16408586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57199485A Granted JPS5990672A (en) | 1982-11-13 | 1982-11-13 | Ultrasonic vibrating element drive |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5990672A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07313937A (en) * | 1995-06-16 | 1995-12-05 | Olympus Optical Co Ltd | Driving circuit for ultrasonic converter |
JP2015212154A (en) * | 2014-05-01 | 2015-11-26 | 株式会社イシダ | Ultrasonic packaging machine |
-
1982
- 1982-11-13 JP JP57199485A patent/JPS5990672A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07313937A (en) * | 1995-06-16 | 1995-12-05 | Olympus Optical Co Ltd | Driving circuit for ultrasonic converter |
JP2015212154A (en) * | 2014-05-01 | 2015-11-26 | 株式会社イシダ | Ultrasonic packaging machine |
Also Published As
Publication number | Publication date |
---|---|
JPH0353995B2 (en) | 1991-08-16 |
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