JPS5958947U - Semiconductor element mounting equipment - Google Patents
Semiconductor element mounting equipmentInfo
- Publication number
- JPS5958947U JPS5958947U JP15357882U JP15357882U JPS5958947U JP S5958947 U JPS5958947 U JP S5958947U JP 15357882 U JP15357882 U JP 15357882U JP 15357882 U JP15357882 U JP 15357882U JP S5958947 U JPS5958947 U JP S5958947U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- element mounting
- mounting equipment
- mounting
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体素子取付装置の構造を示す斜視図
、第２図は本考案の半導体取付装置の構造を示す斜視図
、第３図は同、他の実施例を示す斜視図である。
１は半導体素子、３はプリント基板、４はヒー “ト
シンク、６は取付部、７は取付金具、７ａは押。 え部
である。FIG. 1 is a perspective view showing the structure of a conventional semiconductor device mounting device, FIG. 2 is a perspective view showing the structure of the semiconductor mounting device of the present invention, and FIG. 3 is a perspective view showing another embodiment of the same. . 1 is a semiconductor element, 3 is a printed circuit board, 4 is a heat sink, 6 is a mounting portion, 7 is a mounting bracket, and 7a is a holding portion.
Claims (1)
導体素子１取付部近傍の端部を外方へ突出させて取付部
６を設け、当該取付部６および半導体素子１をヒートシ
ンク４に当接させ、取付金具７を当該取付金具７の押え
部７ａによって上記半導体素手１を押えて上記取付部６
とともにヒートシンク４に取付けた構造の半導体素子取
付装置A mounting part 6 is provided by protruding the end of the printed circuit board 3 near the mounting part of the semiconductor element 1 to the outside, and the mounting part 6 and the semiconductor element 1 are brought into contact with the heat sink 4. and press the semiconductor bare hand 1 with the holding part 7a of the mounting fitting 7 to press the mounting part 6.
A semiconductor element mounting device having a structure that is attached to the heat sink 4 along with the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15357882U JPS5958947U (en) | 1982-10-08 | 1982-10-08 | Semiconductor element mounting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15357882U JPS5958947U (en) | 1982-10-08 | 1982-10-08 | Semiconductor element mounting equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5958947U true JPS5958947U (en) | 1984-04-17 |
| JPS6233335Y2 JPS6233335Y2 (en) | 1987-08-26 |
Family
ID=30339737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15357882U Granted JPS5958947U (en) | 1982-10-08 | 1982-10-08 | Semiconductor element mounting equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5958947U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5647912B2 (en) * | 2011-02-02 | 2015-01-07 | 新電元工業株式会社 | Electronic circuit device and manufacturing method thereof |
-
1982
- 1982-10-08 JP JP15357882U patent/JPS5958947U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6233335Y2 (en) | 1987-08-26 |
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