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JPS5918495U - circuit board equipment - Google Patents

circuit board equipment

Info

Publication number
JPS5918495U
JPS5918495U JP11391282U JP11391282U JPS5918495U JP S5918495 U JPS5918495 U JP S5918495U JP 11391282 U JP11391282 U JP 11391282U JP 11391282 U JP11391282 U JP 11391282U JP S5918495 U JPS5918495 U JP S5918495U
Authority
JP
Japan
Prior art keywords
circuit board
board equipment
solder
adhesive
metal case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11391282U
Other languages
Japanese (ja)
Inventor
八幡 光弘
石田 武彦
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP11391282U priority Critical patent/JPS5918495U/en
Publication of JPS5918495U publication Critical patent/JPS5918495U/en
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例における回路基板装置の斜視
図、第2図は同断側面図である。 1・・・・・・金属ケース、3・・・・・・接着剤また
は半田、4・・・・・・セラミック基板、6・・・・・
・電子部品。
FIG. 1 is a perspective view of a circuit board device according to an embodiment of the present invention, and FIG. 2 is a sectional side view thereof. 1...Metal case, 3...Adhesive or solder, 4...Ceramic substrate, 6...
・Electronic parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品を取付けたセラミック基板を接着剤または半田
により金属ケースの内面に取付けた回路基板装置。
A circuit board device in which a ceramic board with electronic components is attached to the inner surface of a metal case using adhesive or solder.
JP11391282U 1982-07-27 1982-07-27 circuit board equipment Pending JPS5918495U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11391282U JPS5918495U (en) 1982-07-27 1982-07-27 circuit board equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11391282U JPS5918495U (en) 1982-07-27 1982-07-27 circuit board equipment

Publications (1)

Publication Number Publication Date
JPS5918495U true JPS5918495U (en) 1984-02-04

Family

ID=30263515

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11391282U Pending JPS5918495U (en) 1982-07-27 1982-07-27 circuit board equipment

Country Status (1)

Country Link
JP (1) JPS5918495U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03159187A (en) * 1989-11-16 1991-07-09 Matsushita Electric Ind Co Ltd Hybrid integrated circuit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03159187A (en) * 1989-11-16 1991-07-09 Matsushita Electric Ind Co Ltd Hybrid integrated circuit

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