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JPS5939991U - Mounting device for heat sink to board - Google Patents

Mounting device for heat sink to board

Info

Publication number
JPS5939991U
JPS5939991U JP13566582U JP13566582U JPS5939991U JP S5939991 U JPS5939991 U JP S5939991U JP 13566582 U JP13566582 U JP 13566582U JP 13566582 U JP13566582 U JP 13566582U JP S5939991 U JPS5939991 U JP S5939991U
Authority
JP
Japan
Prior art keywords
board
heat sink
mounting device
heat dissipation
dissipation plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13566582U
Other languages
Japanese (ja)
Inventor
水谷 和夫
Original Assignee
水谷電機工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 水谷電機工業株式会社 filed Critical 水谷電機工業株式会社
Priority to JP13566582U priority Critical patent/JPS5939991U/en
Publication of JPS5939991U publication Critical patent/JPS5939991U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示す斜視図である。 FIG. 1 is a perspective view showing an embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 上下複数個の切り起し孔を形成すると共に基板との隣接
端に空気抜きをあけた放熱板を基板上に立て、上部に鉤
部を有するハンダ付は可能な連結杆を前記の上下の切り
起し孔及び基板に設けた差込み孔に小道してなる放熱板
の基板への取付装置。
A heat dissipation plate with a plurality of upper and lower cut holes and an air vent at the end adjacent to the board is erected on the board, and a connecting rod with a hook part on the upper part that can be soldered is attached to the upper and lower cut holes. A device for attaching a heat dissipation plate to a circuit board, which has a path through a hole and an insertion hole provided in the circuit board.
JP13566582U 1982-09-07 1982-09-07 Mounting device for heat sink to board Pending JPS5939991U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13566582U JPS5939991U (en) 1982-09-07 1982-09-07 Mounting device for heat sink to board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13566582U JPS5939991U (en) 1982-09-07 1982-09-07 Mounting device for heat sink to board

Publications (1)

Publication Number Publication Date
JPS5939991U true JPS5939991U (en) 1984-03-14

Family

ID=30305286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13566582U Pending JPS5939991U (en) 1982-09-07 1982-09-07 Mounting device for heat sink to board

Country Status (1)

Country Link
JP (1) JPS5939991U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299085A (en) * 1988-10-07 1990-04-11 Achilles Corp Method for sewing sheet material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433089U (en) * 1977-08-09 1979-03-03
JPS5537293B2 (en) * 1976-02-18 1980-09-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5537293B2 (en) * 1976-02-18 1980-09-26
JPS5433089U (en) * 1977-08-09 1979-03-03

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0299085A (en) * 1988-10-07 1990-04-11 Achilles Corp Method for sewing sheet material

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